Near infrared absorbing composition, near infrared cut filter, method of manufacturing near infrared cut filter, solid image pickup element, camera module, and image display device

Patent metadata

Field	Value
Publication number	US-10989846-B2
Application number	US-201816008209-A
Country	US
Kind code	B2
Filing date	Jun 14, 2018
Priority date	Dec 18, 2015
Publication date	Apr 27, 2021
Grant date	Apr 27, 2021

Abstract

Provided are a near infrared absorbing composition with which a cured film having excellent solvent resistance and thermal shock resistance can be manufactured, a near infrared cut filter, a method of manufacturing a near infrared cut filter, a solid image pickup element, a camera module, and an image display device. The near infrared absorbing composition includes: a resin A that satisfies the following condition a1; an infrared absorber B; and a solvent D. At least the resin A has a crosslinking group, or the near infrared absorbing composition further includes a compound C having a crosslinking group that is different from the resin A.
condition a1: in a case where the resin A does not have a crosslinking group, a glass transition temperature of the resin A measured by differential scanning calorimetry is 0° C. to 100° C., and in a case where the resin A has a crosslinking group, a glass transition temperature of a resin having a structure in which a portion which forms a crosslinking bond in the crosslinking group of the resin A is substituted with a hydrogen atom is 0° C. to 100° C., the glass transition temperature being measured by differential scanning calorimetry.

First claim

What is claimed is:

1. A near infrared absorbing composition comprising:
a resin A that satisfies the following condition a1;
an infrared absorber B; and
a solvent D,
wherein the resin A comprises a repeating unit having a crosslinking group, and the content of the repeating unit having a crosslinking group in the resin A is 10 to 90 mass % with respect to the total mass of all the repeating units of the resin A,
condition a1: a glass transition temperature of a resin having a structure in which a portion which forms a crosslinking bond in the crosslinking group of the resin A is substituted with a hydrogen atom is 0° C. to 100° C., the glass transition temperature being measured by differential scanning calorimetry.

2. The near infrared absorbing composition according to claim 1 ,
wherein the resin A includes a repeating unit derived from a monomer component; and a homopolymer of the monomer has a glass transition temperature of 70° C. or lower.

3. The near infrared absorbing composition according to claim 1 ,
wherein the crosslinking group is at least one selected from the group consisting of a group having an ethylenically unsaturated bond, a cyclic ether group, and an alkoxysilyl group.

4. The near infrared absorbing composition according to claim 1 ,
wherein the crosslinking group is an alkoxysilyl group.

5. The near infrared absorbing composition according to claim 1 ,
wherein a weight-average molecular weight of the resin A is 1,000 to 300,000.

6. The near infrared absorbing composition according to claim 1 ,
wherein the resin A has an alkoxysilyl group, and
a silicon valence of the resin A is 1.0 to 3.0 mmol/g.

7. The near infrared absorbing composition according to claim 1 ,
wherein the near infrared absorbing composition comprises the compound C,
the compound C is a compound having an alkoxysilyl group, and
a silicon valence of the compound C is 3.0 to 8.0 mmol/g.

8. The near infrared absorbing composition according to claim 1 ,
wherein a content of the compound C is 1 to 60 parts by mass with respect to 100 parts by mass of the resin A.

9. The near infrared absorbing composition according to claim 1 ,
wherein the infrared absorber B is at least one selected from the group consisting of a copper compound, a cyanine compound, a pyrrolopyrrole compound, a squarylium compound, a phthalocyanine compound, and a naphthalocyanine compound.

10. The near infrared absorbing composition according to claim 1 ,
wherein the infrared absorber B is a copper compound, and
the copper compound is a copper complex which includes a compound having four or five sites coordinating to copper as a ligand.

11. The near infrared absorbing composition according to claim 1 , which is a composition for forming a near infrared cut filter.

12. A near infrared cut filter which is obtained by using the near infrared absorbing composition according to claim 1 .

13. A method of manufacturing a near infrared cut filter, the method comprising:
applying the near infrared absorbing composition according to claim 1 to a support to form a film, and
drying the film.

14. A solid image pickup element comprising:
the near infrared cut filter according to claim 12 .

15. A camera module comprising:
the near infrared cut filter according to claim 12 .

16. An image display device comprising:
the near infrared cut filter according to claim 12 .

17. The near infrared absorbing composition according to claim 1 ,
wherein the content of the infrared absorber is 30 to 85 mass % with respect to the total solid content of the near infrared absorbing composition.

18. The near infrared absorbing composition according to claim 1 ,
wherein the infrared absorber B is a copper compound, and
wherein the resin A comprises the repeating unit having a crosslinking group and a repeating unit represented by Formula (A1-3);

wherein R 1 represents a hydrogen atom or an alkyl group, L 1 to L 3 each independently represents a single bond or a divalent linking group, R 2 and R 3 each independently represents a hydrogen atom, an aliphatic hydrocarbon group, or an aromatic group.

Assignees

• Fujifilm Corp

Inventors

• Hitomi Seiichi
• Kawashima Takashi
• Arimura Keisuke
• Okawara Takahiro

Classifications

• C08L33/10 Primary

  Homopolymers or copolymers of methacrylic acid esters · CPC title

• C08K5/5205

  Salts of P-acids with N-bases · CPC title

• C08L101/10

  containing hydrolysable silane groups · CPC title

• C08L101/12

  characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity (liquid crystal materials or compositions C09K19/00) · CPC title

• C08K5/0091

  Complexes with metal-heteroatom-bonds · CPC title