Method of manufacturing socket punches

US10987745B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10987745-B2
Application numberUS-201916258032-A
CountryUS
Kind codeB2
Filing dateJan 25, 2019
Priority dateJan 25, 2019
Publication dateApr 27, 2021
Grant dateApr 27, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing a punch, such as a socket punch, using wire EDM with at least six steps. The method involves forming a blank, holding the blank with an adapter, machining grooves in the blank, manufacturing a side relief of a working portion using wire EDM, milling the working portion to a final size, and forming a cone point on the end of the working portion. The method allows the punch to be manufactured more quickly and from a CAD model, therefore removing the need for over-specialized equipment and improving manufacturing times.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a punch from a blank having first and second halves, wherein the second half has a second end, the method comprising: holding the blank; forming grooves in the second half with an electric discharge machine (“EDM”), wherein the grooves have respective groove profiles and extend to the second end; forming a hex portion with the EDM machine in the blank in a portion of the second half, wherein respective groove portions and groove remnants of the groove profiles remain after forming the hex portion with the EDM machine, and wherein the groove portions are disposed between the hex portion and the first half, and the groove remnants are disposed adjacent to the second end; milling the hex portion to obtain a final hex portion size; and machining a cone point at the second end. 2. The method according to claim 1 , further comprising forming a transition portion between the groove portions and the hex portion. 3. The method according to claim 1 , wherein the EDM machine includes a wire having a diameter of 0.010 inches. 4. The method according to claim 1 , wherein the blank includes a Crucible Particle Metallurgy (“CPM”) T-15 steel material. 5. The method according to claim 1 , wherein the EDM machine includes a wire and wherein the step of forming grooves includes angling the wire at 1.25-2.00 degrees relative to an axis of the blank. 6. The method according to claim 1 , further comprising stress relieving the punch. 7. The method according to claim 6 , wherein the step of stress relieving the punch includes heating the punch to 1025° F. for two hours. 8. The method according to claim 1 , further comprising surface coating the punch. 9. The method according to claim 8 , wherein the step of surface coating the punch includes coating the punch with aluminum chromium nitride. 10. The method according to claim 8 , wherein the step of surface coating the punch includes coating the punch with titanium nitride. 11. A method of manufacturing a punch comprising: forming a blank having first and second halves, wherein the second half has a second end; machining a geometry of the blank with an EDM machine and forming grooves having respective groove profiles in the second half and that extend to the second end; milling a hex portion in the blank in a portion of the second half to obtain a final hex portion size, wherein respective groove portions and groove remnants of the groove profiles remain after milling the hex portion, the groove portions are disposed between the hex portion and the first half, and the groove remnants are disposed adjacent to the second end; and machining a cone point at the second end. 12. The method according to claim 11 , wherein the EDM machine includes a wire and wherein the step of forming the grooves includes angling the wire at an angle of 1.25-2.00 degrees to the axis of the blank. 13. The method according to claim 11 , wherein the step of machining a geometry of the blank includes forming the hex portion with the EDM machine. 14. The method according to claim 11 , further comprising holding the blank with an adapter. 15. The method according to claim 11 , wherein the step of machining a geometry of the blank includes forming a transition portion between the groove portions and the hex portion. 16. The method according to claim 11 , further comprising stress relieving the punch. 17. The method according to claim 16 , wherein the step of stress relieving the punch includes heating the punch to 1025° F. for two hours. 18. The method according to claim 11 , further comprising surface coating the punch. 19. The method according to claim 18 , wherein the step of surface coating the punch includes coating the punch with one of aluminum chromium nitride and titanium nitride.

Assignees

Inventors

Classifications

  • Forming parts of complementary shape, e.g. punch-and-die · CPC title

  • B21D37/01Primary

    Selection of materials · CPC title

  • B23H7/02Primary

    Wire-cutting · CPC title

  • B23H5/04Primary

    Electrical discharge machining combined with mechanical working · CPC title

  • Perforating tools; Die holders · CPC title

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Frequently asked questions

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What does patent US10987745B2 cover?
A method of manufacturing a punch, such as a socket punch, using wire EDM with at least six steps. The method involves forming a blank, holding the blank with an adapter, machining grooves in the blank, manufacturing a side relief of a working portion using wire EDM, milling the working portion to a final size, and forming a cone point on the end of the working portion. The method allows the pu…
Who is the assignee on this patent?
Snap On Tools Corp
What technology area does this patent fall under?
Primary CPC classification B21D37/01. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 27 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).