Modular point-of-purchase (POP) display

Patent metadata

Field	Value
Publication number	US-10986940-B2
Application number	US-201916265190-A
Country	US
Kind code	B2
Filing date	Feb 1, 2019
Priority date	Feb 1, 2019
Publication date	Apr 27, 2021
Grant date	Apr 27, 2021

Abstract

There is described is described a modular point-of-purchase display, system and method. The modular point of purchase display includes a back wall and a front wall, a bottom wall, at least one side wall, and at least one shelf. A printed electronic device is affixed to a surface of the back wall, the front wall, the bottom wall, the at least one side wall, and the at least one shelf. The display includes a microcontroller electrically coupled to the printed electronic device. The display includes a power supply electrically coupled to the printed electronic device. The display includes a connection device coupled to the printed electronic device. The display includes a modular component coupled to the connection device, wherein the modular component can be removed and replaced with an alternate modular component compatible with the connection device.

First claim

What is claimed is:

1. A modular point-of-purchase display comprising:
a back wall and a front wall, a bottom wall, at least one side wall, and at least one shelf;
a printed electronic device comprising a pressure sensitive adhesive film affixed on a surface of the at least one the shelf, the bottom wall, the side wall, the back wall or the front wall, a surface wrap material disposed on the pressure sensitive adhesive film and at least one conductive trace disposed on the pressure sensitive adhesive film, wherein the printed electronic device is selected from the group consisting of: capacitors, inductors, transformers, transistors, OLEDs and sensors, wherein the at least one conductive trace is selected from the group consisting of: silver, gold, carbon nanotubes, graphene, graphite and carbon black;
a microcontroller electrically coupled to the printed electronic device;
a power supply electrically coupled to the printed electronic device;
a connection device coupled to the printed electronic device; and
a modular electronic component coupled to the connection device, wherein the modular component is configured to be removed and replaced with an alternate modular component compatible with the connection device.

2. The modular point-of-purchase display according to claim 1 , wherein the modular electronic component is selected from the group consisting of: a sensor, a light, an antenna, an audio component, a wireless communication device, an integrated circuits (IC), a resistor, a capacitor, a power supply, a diode, a transistor, an inductor, a transducer, a switch and a transformer.

3. The modular point-of-purchase display according to claim 1 , wherein the connection device is selected from the group consisting of: a pogo pin connector, a magnetic connector, a cable connector, a conductive adhesive, a low temperature solder having a melt temperature of 138° C. to 188° C., and a ribbon cable.

4. The modular point-of-purchase display according to claim 1 , wherein the at least one shelf can be removed and replaced with a second, distinct shelf.

5. A method of manufacturing modular point-of-purchase (POP) display comprising:
providing plurality of sheets forming a back wall and a front wall, a bottom wall, at least one side wall, and at least one shelf;
affixing a printed electronic device comprising a pressure sensitive adhesive film, a surface wrap material disposed on the pressure sensitive adhesive film and at least one conductive trace disposed on the pressure sensitive adhesive film on a surface at least one of the plurality of sheets, wherein the printed electronic device is selected from the group consisting of: capacitors, inductors, transformers, transistors, OLEDs and sensors, wherein the at least one conductive trace is selected from the group consisting of: silver, gold, carbon nanotubes, graphene, graphite and carbon black;
assembling the back wall, the front wall, the bottom wall, the at least one side wall and the at least one shelf;
affixing a connection device on a surface at least one of the back wall, the front wall, the bottom wall, the at least one side wall or the at least one shelf, the connection device coupled to the printed electronic device;
connecting at least one modular electronic component to the connection device, wherein the at least one modular component is configured to be removed and replaced with a second modular component compatible with the connection device;
coupling a microcontroller to the printed electronic device; and
coupling a power supply to the printed electronic device.

6. The method according to claim 5 , wherein the at least one modular electronic component and the second modular components are selected from the group consisting of: a sensor, a light, an antenna, an audio component, a wireless communication device, an integrated circuits (IC), a resistor, a capacitor, a power supply, a diode, a transistor, an inductor, a transducer, a switch and a transformer.

7. The method according to claim 5 , wherein the connection device is selected from the group consisting of: a pogo pin connector, a magnetic connector, a cable connector, a conductive adhesive, a low temperature solder having a melt temperature of 138° C. to 188° C., and a ribbon cable.

8. The method according to claim 5 , wherein the at least one shelf can be removed and replaced with a second shelf.

9. The method according to claim 5 , wherein the assembling is performed at a location for the POP display.

10. A modular point-of-purchase display system comprising:
a display having a back wall and a front wall, a bottom wall, at least one side wall, and at least one shelf;
a printed electronic device comprising a pressure sensitive adhesive film, a surface wrap material disposed on the pressure sensitive adhesive film and at least one conductive trace disposed on the pressure sensitive adhesive film, wherein the printed electronic device is affixed on a surface of the at least one the shelf, the bottom wall, the side wall, the back wall or the front wall, wherein the printed electronic device is selected from the group consisting of capacitors, inductors, transformers, transistors, OLEDs and sensors, wherein the at least one conductive trace is selected from the group consisting of: silver, gold, carbon nanotubes, graphene, graphite and carbon black;
a microcontroller coupled to the printed electronic device;
a power supply coupled to the printed electronic device;
a connection device coupled to the printed electronic device; and
a plurality of modular electronic components that are configure to be operably coupled to the connection device.

11. The modular point-of-purchase display system according to claim 10 , wherein the plurality of modular electronic components is selected from the group consisting of: a sensor, a light, an antenna, an audio component, a wireless communication device, an integrated circuits (IC), a resistor, a capacitor, a power supply, a diode, a transistor, an inductor, a transducer, a switch and a transformer.

12. The modular point-of-purchase display system according to claim 10 , wherein the connection device is selected from the group consisting of: a pogo pin connector, a magnetic connector, a cable connector, a conductive adhesive, a low temperature solder having a melt temperature of 138° C. to 188° C. and a ribbon cable.

13. The modular point-of-purchase display system according to claim 10 , wherein the at least one shelf can be removed and replaced with a second shelf.

Assignees

• Xerox Corp
• Palo Alto Res Ct Inc

Inventors

• Smithson Chad S
• Lloyd Williams Antonio St Clair
• Veres Janos
• Shen Ethan

Classifications

• H05K5/0017

  with operator interface units · CPC title

• H05K1/162

  incorporating printed capacitors · CPC title

• H05K3/0058

  Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence) · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• A47F5/116 Primary

  Shelving racks · CPC title