Integrated power electronics component for mitigating noise, vibration, and harshness

Patent metadata

Field	Value
Publication number	US-10985629-B2
Application number	US-201816124906-A
Country	US
Kind code	B2
Filing date	Sep 7, 2018
Priority date	Sep 7, 2018
Publication date	Apr 20, 2021
Grant date	Apr 20, 2021

Abstract

An integrated power electronics component configured for mitigating noise, vibration, and harshness includes a case formed from metal and configured to dampen a sound wave having a first frequency and a first amplitude and propagatable in a first direction. The case has a first surface and a second surface spaced apart from the first surface, a first stiffness, and a first strength, and the first and second surfaces include a structure defining a plurality of recessions therein. The component includes a cured polymer formed from a composition disposed on at least one of the first and second surfaces in each of the recessions to thereby dampen the sound wave in the first direction and in a second direction that is perpendicular to the first direction to a second frequency that is less than the first frequency and a second amplitude that is less than the first amplitude.

First claim

What is claimed is:

1. An integrated power electronics component configured for mitigating noise, vibration, and harshness, the integrated power electronics component comprising:
a case formed from a metal and configured to dampen a sound wave having a first frequency and a first amplitude and propagatable in a first direction;
wherein the case has:
a first surface and a second surface spaced apart from the first surface;
a first stiffness; and
a first strength;
wherein the first surface and the second surface include a structure defining a plurality of recessions therein; and

a cured polymer formed from a composition disposed on at least one of the first surface and the second surface in each of the plurality of recessions to thereby dampen the sound wave in the first direction and in a second direction that is perpendicular to the first direction to a second frequency that is less than the first frequency and a second amplitude that is less than the first amplitude;
wherein the integrated power electronics component has a second stiffness that is greater than the first stiffness and a second strength that is greater than the first strength.

2. The integrated power electronics component of claim 1 , wherein the composition entirely fills each of the plurality of recessions.

3. The integrated power electronics component of claim 1 , wherein the structure is formed from a plurality of adjoining hexagons each defining a respective one of the plurality of recessions therein.

4. The integrated power electronics component of claim 1 , wherein the composition includes at least one of a metallic component, a fiber component, and a ceramic component.

5. The integrated power electronics component of claim 1 , further including a second layer disposed on the cured polymer, formed from a metallic composition, and configured for shielding the case from electromagnetic interference.

6. The integrated power electronics component of claim 5 , wherein the second layer encapsulates the cured polymer.

7. The integrated power electronics component of claim 1 , wherein the cured polymer is disposed along an entirety of the first surface.

8. The integrated power electronics component of claim 1 , wherein the cured polymer is solely disposed along a portion of the first surface.

9. An integrated power electronics component configured for mitigating noise, vibration, and harshness, the integrated power electronics component comprising:
a case formed from a metal and configured to dampen a sound wave having a first frequency and a first amplitude and propagatable in a first direction;
wherein the case has a first surface and a plurality of protrusions extending from the first surface and defining a plurality of interlocking cavities therein;
wherein the case has a first stiffness and a first strength; and
a cured polymer formed from a composition disposed within the plurality of interlocking cavities and configured to dampen the sound wave in the first direction and in a second direction that is perpendicular to the first direction to a second frequency that is less than the first frequency and a second amplitude that is less than the first amplitude;
wherein the integrated power electronics component has a second stiffness that is greater than the first stiffness and a second strength that is greater than the first strength.

10. The integrated power electronics component of claim 9 , wherein composition is insertable into the plurality of interlocking cavities such that the cured polymer fills the plurality of interlocking cavities and the plurality of protrusions surround the cured polymer.

11. The integrated power electronics component of claim 9 , wherein the plurality of protrusions are disposed along an entirety of the first surface.

12. The integrated power electronics component of claim 9 , wherein the plurality of protrusions are solely disposed along a portion of the first surface.

13. A device comprising:
a driven component;
an electric drive unit configured for driving the driven component and including:
an electric traction motor; and
an integrated power electronics component attached to the electric traction motor and configured for mitigating noise, vibration, and harshness, the integrated power electronics component comprising:
a case formed from a metal and configured to dampen a sound wave emitted by the electric traction motor, having a first frequency and a first amplitude, and propagatable in a first direction;
wherein the case has:
a first surface and a second surface spaced apart from the first surface;
a first stiffness; and
a first strength;
wherein the first surface and the second surface include a structure defining a plurality of recessions therein; and

a cured polymer formed from a composition disposed on at least one of the first surface and the second surface in each of the plurality of recessions to thereby dampen the sound wave in the first direction and in a second direction that is perpendicular to the first direction to a second frequency that is less than the first frequency and a second amplitude that is less than the first amplitude;
wherein the integrated power electronics component has a second stiffness that is greater than the first stiffness and a second strength that is greater than the first strength.

14. The integrated power electronics component of claim 13 , wherein the composition includes at least one of a metallic component, a fiber component, a ceramic component, and an electromagnetic interference-blocking component.

15. The device of claim 13 , wherein the composition entirely fills each of the plurality of recessions.

16. The device of claim 13 , wherein the structure is formed from a plurality of adjoining hexagons each defining a respective one of the plurality of recessions therein.

17. The device of claim 13 , wherein the composition includes at least one of a metallic component, a fiber component, and a ceramic component.

18. The device of claim 13 , wherein the integrated power electronics component further includes a second layer disposed on the cured polymer, formed from a metallic composition, and configured for shielding the case from electromagnetic interference.

19. The device of claim 18 , wherein the second layer encapsulates the cured polymer.

20. The device of claim 13 , wherein the electric traction motor has a central longitudinal axis, and further wherein the first surface and the second surface are each planar and parallel to one another and to the central longitudinal axis.

Assignees

• Gm Global Tech Operations Llc

Inventors

• Pack Seongchan
• Han Su Jung
• Kramer Martin S
• He Song

Classifications

• H02K5/02

  Casings or enclosures characterised by the material thereof · CPC title

• Y02T10/70

  Energy storage systems for electromobility, e.g. batteries · CPC title

• H02K5/06

  Cast metal casings · CPC title

• H02K11/30

  Structural association with control circuits or drive circuits · CPC title

• H02K5/24 Primary

  specially adapted for suppression or reduction of noise or vibrations · CPC title