Light emitting element mounting substrate, light emitting device, and light emitting module

Patent metadata

Field	Value
Publication number	US-10985305-B2
Application number	US-201716344518-A
Country	US
Kind code	B2
Filing date	Oct 25, 2017
Priority date	Oct 25, 2016
Publication date	Apr 20, 2021
Grant date	Apr 20, 2021

Abstract

A light emitting module and the like having a higher heat-dissipation effect includes a light emitting element mounting substrate, one or more light emitting elements, a heatsink including a through-hole in a position corresponding to a screw hole, a bolt screwed in the screw hole and fastening the heatsink and a metal plate or a full thread and a nut for the fastening. In the light emitting element mounting substrate, the metal plate, an insulating layer, and an electrode layer on which the one or more light emitting elements are mountable are stacked in this order. The metal plate includes a bottomed screw hole opened at a surface opposite to a surface in contact with the insulating layer. The bolt or the full thread and the nut have a heat conductivity equal to or greater than that of the metal plate.

First claim

The invention claimed is:

1. A light emitting element mounting substrate, comprising:
a metal plate;
an insulating layer; and
an electrode layer on which one or more light emitting elements are mountable, the metal plate, the insulating layer, and the electrode layer being stacked in this order, wherein
the metal plate comprises a bottomed screw hole opened at a surface opposite to a surface in contact with the insulating layer, and
a metal joint is disposed in a deepest portion of the bottomed screw hole of the metal plate, the metal joint having a hardness less than a hardness of the metal plate and/or a heat conductivity equal to or greater than a heat conductivity of the metal plate.

2. The light emitting element mounting substrate according to claim 1 , wherein
in a transparent plan view, a region in which the one or more light emitting elements are mountable in the electrode layer at least partially overlaps with the bottomed screw hole of the metal plate.

3. The light emitting element mounting substrate according to claim 1 , wherein in a transparent plan view, a center of a region in which the one or more light emitting elements are mountable in the electrode layer coincides with a center of the bottomed screw hole of the metal plate.

4. The light emitting element mounting substrate according to claim 1 , wherein
a material of the metal joint is solder, gold, silver, or aluminum.

5. The light emitting element mounting substrate according to claim 4 , wherein
the metal joint is disposed over an entire inner surface of the bottomed screw hole.

6. The light emitting element mounting substrate according to claim 4 , wherein
the metal plate comprises a small hole in a portion deeper than the deepest portion, and
the small hole is filled with the metal joint.

7. The light emitting element mounting substrate according to claim 1 , wherein
a depth of the bottomed screw hole is 50% to 90%, inclusive, of a thickness of the metal plate.

8. A light emitting device, comprising:
the light emitting element mounting substrate according to claim 1 ; and
one or more light emitting elements.

9. A light emitting module, comprising:
the light emitting device according to claim 8 ;
a heatsink comprising a through-hole in a position corresponding to the bottomed screw hole; and
a bolt screwed in the bottomed screw hole and fastening the heatsink and the metal plate, or a full thread and a nut screwed in the bottomed screw hole fastening the heatsink and the metal plate, wherein
a heat conductivity of the bolt or the full thread and the nut is equal to or greater than a heat conductivity of the metal plate.

10. The light emitting module according to claim 9 , further comprising:
a back side insulating layer between the metal plate and the heatsink, the back side insulating layer comprising a through-hole in a position corresponding to the bottomed screw hole.

11. The light emitting module according to claim 10 , wherein
a material of the metal plate and the bolt or the full thread and the nut is copper,
a material of the metal joint is silver, and
a material of the back side insulating layer is Si 3 N 4 or AlN.

Assignees

• Kyocera Corp

Inventors

• Yamasaki Shou
• Sakai Mitsuharu
• Ochi Natsumi
• Morita Yukio
• Hashimoto Toshihiro

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/858

  Means for heat extraction or cooling · CPC title

• H10H20/8582 Primary

  characterised by their shape · CPC title

• H10H20/8581

  characterised by their material · CPC title

• H10H20/8506

  Containers · CPC title