Process automation technology sensor

Patent metadata

Field	Value
Publication number	US-10983079-B2
Application number	US-201916360530-A
Country	US
Kind code	B2
Filing date	Mar 21, 2019
Priority date	Mar 26, 2018
Publication date	Apr 20, 2021
Grant date	Apr 20, 2021

Abstract

The present disclosure includes a process automation technology sensor for detecting at least one measured variable of a medium, the sensor including a process connection for attaching the sensor to a container in which the medium is located; at least two webs which run essentially parallel to a longitudinal axis of the sensor, where the webs are arranged on the medium side extending from the process connection; and at least one first housing portion that comprises a temperature sensor, where the first housing portion is arranged between the webs.

First claim

The invention claimed is:

1. A sensor of process automation technology for detecting at least one measured variable of a medium, the sensor comprising:
a temperature sensor; and
a housing, which encloses the temperature sensor from the medium, the housing including:
a process connection adapted for attaching the sensor to a container in which the medium travels or is contained;
at least two webs extending from the process connection and substantially parallel to a longitudinal axis of the sensor; and
a first housing portion disposed between the webs, wherein the temperature sensor is disposed within the first housing portion,

wherein the housing, including the process connection, the at least two webs and the first housing portion, are portions of a single integrated body.

2. The sensor of claim 1 , wherein the first housing portion is arranged parallel to the at least two webs.

3. The sensor of claim 1 , wherein the first housing portion extends from the process connection.

4. The sensor of claim 1 , wherein the housing includes only two webs, which are arranged opposite each other about the longitudinal axis.

5. The sensor of claim 4 , wherein the first housing portion is arranged midway between the webs.

6. The sensor of claim 1 , wherein the first housing portion is arranged perpendicular to the webs.

7. The sensor of claim 1 , further comprising one or more sensor elements configured to detect the measured variable and to enclose sensor components configured to detect the measured variable, wherein the webs connect the one or more sensor elements to the process connection.

8. The sensor of claim 7 , wherein the first housing portion extends from at least one of the one or more sensor elements.

9. The sensor of claim 1 , wherein the temperature sensor is embedded in a circuit board.

10. The sensor of claim 1 , wherein the sensor is configured as a conductivity sensor.

11. The sensor of claim 10 , wherein the sensor includes one or more electrodes or coils, each in electrical contact with the printed circuit board.

12. A method for manufacturing a sensor, the method comprising:
providing a sensor configured to detect at least one measured variable of a medium, the sensor comprising:
a temperature sensor; and
a housing, which encloses the temperature sensor from the medium, the housing including:
a process connection adapted for attaching the sensor to a container in which the medium travels or is contained;
at least two webs extending from the process connection and substantially parallel to a longitudinal axis of the sensor; and
a first housing portion disposed between the webs, wherein the temperature sensor is disposed within the first housing portion; and

overmolding the temperature sensor using an injection molding process such that the housing of the sensor, including the process connection, the at least two webs and the first housing portion, is manufactured as a single integrated body.

13. The method of claim 12 , wherein the first housing portion is arranged parallel to the at least two webs.

14. The method of claim 12 , wherein the first housing portion extends from the process connection.

15. The method of claim 12 , wherein the housing includes only two webs, which are arranged opposite each other about the longitudinal axis.

16. The method of claim 15 , wherein the first housing portion is arranged midway between the webs.

17. The method of claim 12 , wherein the temperature sensor is embedded in a circuit board.

18. The method of claim 17 , wherein the sensor includes one or more electrodes or coils, each in electrical contact with the printed circuit board.

19. The method of claim 18 , wherein the one or more electrodes or coils are overmolded with the temperature sensor.

Assignees

• Endress Hauser Conducta Gmbh Co Kg

Inventors

• Fanselow Christian
• Pfeifer André
• Mayerhofer Damian
• Nagel Thomas

Classifications

• G01K7/18

  the element being a linear resistance, e.g. platinum resistance thermometer (G01K7/26 takes precedence) · CPC title

• G01N27/06

  of a liquid (involving electrolysis G01N27/26) · CPC title

• G01N33/143

  containing sugar · CPC title

• G01N27/07

  Construction of measuring vessels; Electrodes therefor · CPC title

• G01K1/18

  for reducing thermal inertia · CPC title