Three dimensional woven lattices as multi-functional heat exchanger

US10982913B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10982913-B2
Application numberUS-201615161945-A
CountryUS
Kind codeB2
Filing dateMay 23, 2016
Priority dateMay 22, 2015
Publication dateApr 20, 2021
Grant dateApr 20, 2021

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The present invention is directed to devices formed from three dimensional (3D) structures composed of wires, yarns of wires, or 3D printed structures. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, using optimization within the 3D manufacturing constraints. The 3D structures of the present invention include multiple properties that are optimized for heat transfer applications. The present invention also includes the methods for optimization of the 3D woven lattices as well as methods of use of the 3D woven lattices in heat transfer applications.

First claim

Opening claim text (preview).

The invention claimed is: 1. A device for providing heat management, comprising: a plurality of wires configured to create a heat management material, the plurality of wires to form a three-dimensional (3D) woven lattice, the 3D woven lattice including: a first set of wires in an x-direction, a second set of wires in a y-direction, and a third set of wires in a z-direction, wherein the 3D woven lattice is configured to be optimized in one or more directions by removing at least one wire in each of the x-direction and the y-direction, wherein optimization of the 3D woven lattice is based upon adjustment of two or more heat management qualities or mechanical qualities of the 3D woven lattice selected from the following: fluid permeability, mechanical stiffness, mechanical strength, pressure drop, pumping power, heat transfer, or temperature uniformity, wherein a normalized fluid permeability of the 3D woven lattice ranges from between about 0.0001 to about 0.4, wherein the plurality of wires have diameters of between about 10 microns to about 10 mm, wherein a volume fraction of the 3D woven lattice ranges from between about 10% to about 65%, and wherein the plurality of wires of the optimized 3D woven lattice are bonded at intersections between adjacent wires. 2. The device of claim 1 , wherein the plurality of wires are formed from one selected from a group consisting of: a metal, a ceramic, and a polymer. 3. The device of claim 1 , wherein the plurality of wires are formed from copper. 4. The device of claim 1 , wherein the plurality of wires are formed from a non-metal. 5. The device of claim 1 , wherein diameters of plurality of wires are a same or different. 6. The device of claim 1 , wherein the plurality of wires are woven with a warp and a fill. 7. The device of claim 1 , wherein the plurality of wires are woven with a warp, fill, and a Z wire. 8. The device of claim 1 , wherein the plurality of wires are composed of a bonding material. 9. The device of claim 1 , wherein the optimization is performed to design the 3D woven lattice with properties that are adjusted in one or more directions. 10. The device of claim 1 , wherein parameters of the wires are selected to adjust heat transfer properties, the parameters are selected from a group consisting of: wire position, wire material chemistry, wire size, wire coating, roughness, wire shape, wire bonding, varying composition of plurality of wires in the 3D woven lattice, and wire architecture. 11. The device of claim 1 , wherein the plurality of wires are in a form of a yarn. 12. The device of claim 1 , wherein parameters of the plurality of wires are selected to adjust one or more of: the mechanical stiffness, the fluid permeability, and the pumping power. 13. The device of claim 1 , wherein the plurality of wires are solid or hollow. 14. The device of claim 1 , wherein a normalized fluid permeability of the 3D woven lattice ranges from between about 0.0001 to about 0.4, and wherein the plurality of wires have diameters of between about 10 microns to about 10 mm. 15. The device of claim 14 , wherein the 3D woven lattice has a Young's modulus of between about 0.01 and 200 GPa, a shear modulus of between about 0.1 and 100 GPa, and a strength of between about 1 and 300 MPa. 16. A method for forming a heat management material, comprising: positioning a plurality of wires in an x-direction, a y-direction, and a z-direction to form the heat management material, the plurality of wires to form a three-dimensional (3D) woven lattice, the 3D woven lattice including: a first set of wires in the x-direction, a second set of wires in the y-direction, and a third set of wires in the z-direction; and selecting a plurality of parameters of the plurality of wires to adjust, the plurality of parameters of the plurality of wires being adjusted computationally, wherein adjustment of the plurality of parameters of the plurality of wires is based upon adjustment of two or more heat managements qualities of the 3D woven lattice selected from the following: pressure drop, pumping power, heat transfer, or temperature uniformity; removing at least one wire in each of the x-direction, the y-direction, and the z-direction to adjust the 3D woven lattice in one or more directions; and bonding the plurality of wires of the adjusted 3D woven lattice at intersections between adjacent wires. 17. The method of claim 16 , wherein a volume fraction of the 3D woven lattice ranges from between about 10% to about 65%. 18. The method of claim 16 , wherein the 3D woven lattice has a Young's modulus of between about 0.01 and 200 GPa, a shear modulus of between about 0.1 and 100 GPa, and a strength of between about 1 and 300 MPa.

Assignees

Inventors

Classifications

  • of metal · CPC title

  • by using permeable mass, perforated or porous materials (F28F13/18 takes precedence) · CPC title

  • F28F3/022Primary

    the means being wires or pins · CPC title

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What does patent US10982913B2 cover?
The present invention is directed to devices formed from three dimensional (3D) structures composed of wires, yarns of wires, or 3D printed structures. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, using optimization within the 3D manufacturing constraints. The 3D structures of the present invention include multiple p…
Who is the assignee on this patent?
Univ Johns Hopkins, Saertex Usa Llc
What technology area does this patent fall under?
Primary CPC classification F28F3/022. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Apr 20 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).