Heat dissipation device

Patent metadata

Field	Value
Publication number	US-10982685-B2
Application number	US-201916255978-A
Country	US
Kind code	B2
Filing date	Jan 24, 2019
Priority date	Feb 9, 2018
Publication date	Apr 20, 2021
Grant date	Apr 20, 2021

Abstract

The disclosure provides a heat dissipation device, including an enclosure, a connective member, and a fan module. The enclosure includes a first cover body and a second cover body that are opposite to each other. The second cover body includes an opening. The connective member is connected to one of the first cover body and the second cover body in the enclosure. The fan module is movably connected to the connective member, and is configured to move between a first position and a second position relative to the enclosure based on the connective member. When moving to the first position, the fan module is located in the enclosure.

First claim

What is claimed is:

1. A heat dissipation device, comprising:
an enclosure, comprising a first cover body and a second cover body that are opposite to each other, wherein the second cover body comprises an opening;
a connective member, located in the enclosure and connected to one of the first cover body and the second cover body;
a fan module, movably connected to the connective member, and moving between a first position and a second position relative to the enclosure, wherein when moving to the first position, the fan module is located in the enclosure, wherein the fan module further comprises a frame, the frame comprises an extension portion and a punch located on the extension portion, the connective member is slidably connected to the punch;
a first stop member, connected to the connective member, wherein the extension portion is limited between the first cover body and the first stop member, or is limited between the second cover body and the first stop member;
a second stop member, connected to the connective member, wherein the extension portion is further limited between the first stop member and the second stop member; and
a pushing member, disposed between the extension portion and the second stop member, and configured to push the extension portion to move the fan module toward the second position, wherein the connective member is connected to the first cover body.

2. The heat dissipation device according to claim 1 , wherein a distance exists between the second stop member and the first cover body or the second cover body.

3. The heat dissipation device according to claim 1 , wherein the connective member comprises:
a connection portion, detachably connected to the first cover body or the second cover body; and
a body portion, connected to the connection portion, and slidably connected to the punch.

4. The heat dissipation device according to claim 3 , wherein a distance exists between the body portion and the first cover body or the second cover body.

5. The heat dissipation device according to claim 1 , further comprising:
an outer cover, configured to selectively close or leave the second cover body.

6. A heat dissipation device, comprising:
an enclosure, comprising a first cover body and a second cover body that are opposite to each other, wherein the second cover body comprises an opening;
a connective member, located in the enclosure and connected to one of the first cover body and the second cover body;
a fan module, movably connected to the connective member, and moving between a first position and a second position relative to the enclosure, wherein when moving to the first position, the fan module is located in the enclosure, wherein the fan module further comprises a frame, the frame comprises an extension portion and a punch located on the extension portion, the connective member is slidably connected to the punch;
a first stop member, connected to the connective member, wherein the extension portion is limited between the first cover body and the first stop member, or is limited between the second cover body and the first stop member; and
a pushing member, disposed between the extension portion and the first stop member, and configured to push the extension portion to move the fan module toward the second position, wherein the connective member is connected to the second cover body.

7. The heat dissipation device according to claim 6 , further comprising:
an outer cover, configured to selectively close or leave the second cover body.

Assignees

• Asustek Comp Inc

Inventors

• Lin Hsin-Chen
• Chiou Ing-Jer

Classifications

• H05K7/20172

  Fan mounting or fan specifications · CPC title

• F04D27/002

  by varying geometry within the pumps, e.g. by adjusting vanes · CPC title

• F04D29/162

  of a centrifugal flow wheel · CPC title

• F04D29/4226 Primary

  Fan casings · CPC title

• F25D1/00

  Devices using naturally cold air or cold water · CPC title