Thermoplastic resin composition having excellent thermal stability and low birefringence and molded atricle thereof

US10982091B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10982091-B2
Application numberUS-201816107530-A
CountryUS
Kind codeB2
Filing dateAug 21, 2018
Priority dateAug 21, 2017
Publication dateApr 20, 2021
Grant dateApr 20, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a thermoplastic resin composition having excellent thermal stability and birefringence properties and to a molded article formed therefrom. In one embodiment, the thermoplastic resin composition includes: 100 parts by weight of a polycarbonate resin including a repeating unit represented by formula 1; about 0.2 parts by weight to about 15 parts by weight of an epoxy resin represented by formula 2; and about 1 part by weight to about 15 parts by weight of a phosphate-based compound, wherein formula 1 and formula 2 are as defined in the detailed description.

First claim

Opening claim text (preview).

What is claimed is: 1. A thermoplastic resin composition comprising: 100 parts by weight of a polycarbonate resin comprising a repeating unit represented by the following formula 1; 0.2 parts by weight to 15 parts by weight of an epoxy resin represented by the following formula 2; 1.05 part by weight to 4 parts by weight of a phosphate-based compound represented by the following formula 5; and an antioxidant; wherein the antioxidant comprises one or more selected from the group consisting of phosphite-based antioxidants, sulfur-based antioxidants and phenol-based antioxidants, wherein the antioxidant and the phosphate-based compound are contained at a weight ratio of 1:2 to 1:13, wherein the thermoplastic resin composition has a flow index of 50 g/10 min to 65 g/10 min as measured at 260° C. under a load of 2.16 kg in accordance with ASTM D1238; a haze of more than 0%, but not more than 1.5% or less as measured for a 3.2-mm sample in accordance with ASTM D1003; and a transmittance of 90% or more as measured for a 3.2 mm thick sample in accordance with ASTM D1003: wherein * is a linkage; wherein n is an integer ranging from 0 to 300, wherein R 3 , R 4 and R 5 are each independently hydrogen or a C 1 -C 4 alkyl group; X is a C 6 -C 20 aryl group or a C 6 -C 20 aryl group substituted with a C 1 -C 4 alkyl group, and m is an integer ranging from 1 to 4. 2. The thermoplastic resin composition of claim 1 , wherein the polycarbonate resin is produced by copolymerization of a diol compound, which comprises a plant-derived isosorbide represented by the following formula 1 a, with a carbonic diester compound: 3. The thermoplastic resin composition of claim 1 , wherein the polycarbonate resin comprises 30 mol% to 95 mol% of the repeating unit of formula 1. 4. The thermoplastic resin composition of claim 1 , wherein the polycarbonate resin has a viscosity-average molecular weight of 15000 g/mol to 25000 g/mol. 5. The thermoplastic resin composition of claim 1 , wherein the epoxy resin represented by formula 2 is produced by a process comprising: reacting plant-derived isosorbide with glycerin to obtain an epichlorohydrin; and allowing the epichlorohydrin to react in the presence of an aqueous hydroxide solution. 6. The thermoplastic resin composition of claim 1 , wherein the epoxy resin has an epoxy equivalent weight of 100 g/eq to 300 g/eq and a viscosity of 1,000 cps to 10,000 cps as measured at 25° C. 7. The thermoplastic resin composition of claim 1 , wherein the phosphate-based compound comprises one or more of resorcinol bis(diphenyl)phosphate, resorcinol bis(2,6-dimethylphenyl)phosphate, resorcinol bis(2,4-di-tertairy-butylphenyl)phosphate, hydroquinol bis(2,6-dimethylphenyl)phosphate, and hydroquinol bis(2,4-di-tertairy-butylphenyl)phosphate. 8. The thermoplastic resin composition of claim 1 , wherein the thermoplastic resin composition has a yellowness index difference (ΔYI) of 0.3 or less as calculated according to the following equation 1: ΔYI=YI 1 −YI 0   Equation 1 wherein YI 0 is a yellowness index measured using a spectrophotometer for a thermoplastic resin composition sample obtained by injection molding at an injection molding temperature (cylinder temperature) of 250° C. with a cycle time of 20 seconds, and YI 1 is a yellowness index measured for a thermoplastic resin composition sample obtained by injection molding at an injection molding temperature (cylinder temperature) of 250° C. after the thermoplastic resin composition in a molten state was left in the cylinder for 15 minutes. 9. A molded article formed from a thermoplastic resin composition according to claim 1 .

Assignees

Inventors

Classifications

  • C08L69/00Primary

    Compositions of polycarbonates; Compositions of derivatives of polycarbonates · CPC title

  • Esters of phosphoric acids, e.g. of H3PO4 · CPC title

  • Sulfur-, selenium-, or tellurium-containing compounds {(C08K5/0091 takes precedence)} · CPC title

  • Stabilisers against oxidation, heat, light, ozone · CPC title

  • General preparatory processes · CPC title

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What does patent US10982091B2 cover?
The present invention relates to a thermoplastic resin composition having excellent thermal stability and birefringence properties and to a molded article formed therefrom. In one embodiment, the thermoplastic resin composition includes: 100 parts by weight of a polycarbonate resin including a repeating unit represented by formula 1; about 0.2 parts by weight to about 15 parts by weight of an e…
Who is the assignee on this patent?
Hyundai Mobis Co Ltd, Samyang Corp
What technology area does this patent fall under?
Primary CPC classification C08L69/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 20 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).