Device enclosure

Patent metadata

Field	Value
Publication number	US-10980140-B2
Application number	US-202016879525-A
Country	US
Kind code	B2
Filing date	May 20, 2020
Priority date	Dec 21, 2018
Publication date	Apr 13, 2021
Grant date	Apr 13, 2021

Abstract

An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.

First claim

What is claimed is:

1. An electronic device, comprising:
a frame that at least partially defines an exterior surface and an internal volume_of the electronic device;
a display component;
a transparent cover defining a major surface and a first edge, the transparent cover disposed adjacent to the display component and the frame; and
an encapsulating material in contact with and at least partially surrounding a periphery of the display component, the encapsulating material bonded to the transparent cover and positioned at least partially within the internal volume, the encapsulating material defining a second edge, the second edge bonded to the frame and aligned with the first edge in a plane along the frame.

2. The electronic device of claim 1 , wherein the first edge and the second edge are substantially parallel to, and spaced apart from, a wall of the frame element.

3. The electronic device of claim 1 , wherein an active area defined by the display component is spaced apart from the surface of the frame by less than about 2 millimeters.

4. The electronic device of claim 1 , wherein the encapsulating material bonds the display component to the frame.

5. The electronic device of claim 1 , wherein the encapsulating material is bonded to the frame with an adhesive.

6. The electronic device of claim 1 , wherein the encapsulating material comprises an epoxy.

7. The electronic device of claim 1 , wherein the encapsulating material comprises a ceramic or a glass reinforced polymer.

8. A method of forming an electronic device, comprising:
surrounding at least a portion of a periphery of a display component with a moldable material;
positioning a transparent cover adjacent to the display component, the transparent cover defining a major surface and a first edge;
bonding the transparent cover to the moldable material; and
bonding the moldable material to the frame such that a second edge defined by the moldable material is substantially aligned with the first edge in a plane along the frame;
the frame at least partially defining an exterior surface of the electronic device.

9. The method of claim 8 , wherein bonding the moldable material to the frame comprises bonding the moldable material to the frame with an adhesive.

10. The method of claim 8 , wherein bonding the moldable material to the frame comprises directly bonding the moldable material to the frame.

11. The method of claim 8 , wherein at least partially surrounding a periphery of a display component with the moldable material further comprises solidifying the moldable material.

Assignees

• Apple Inc

Inventors

• Hooton Lee E
• Wittenberg Michael B
• Meschke Andrew J
• Williams Alexander W

Classifications

• G06F1/1637

  Details related to the display arrangement, including those related to the mounting of the display in the housing · CPC title

• H04M1/0249

  Details of the mechanical connection between the housing parts or relating to the method of assembly · CPC title

• H05K5/0217

  Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03) · CPC title

• H05K5/0018

  having an electronic display · CPC title

• B23P13/02

  in which only the machining operations are important · CPC title