Shadow elimination detection method and manufacturing method for a touch substrate, touch substrate and touch device

Patent metadata

Field	Value
Publication number	US-10980110-B2
Application number	US-201715756474-A
Country	US
Kind code	B2
Filing date	Jul 20, 2017
Priority date	Sep 30, 2016
Publication date	Apr 13, 2021
Grant date	Apr 13, 2021

Abstract

The present disclosure provides a shadow elimination detection method for a touch substrate, a touch substrate manufacturing method, a touch substrate, and a touch device. The shadow elimination detection method for a touch substrate includes detecting a difference in light reflectance between test blocks with different structures located in an area outside a touch area of the touch substrate using a detection device, and determining a shadow elimination effect of the touch substrate according to the difference, wherein each of the test blocks with different structures includes a structure corresponding to a respective structure in different structures in the touch area.

First claim

What is claimed is:

1. A shadow elimination detection method for a touch substrate, the method comprising:
detecting a difference in light reflectance between test blocks with different structures located in an area outside a touch area of the touch substrate using a detection device; and
determining a shadow elimination effect of the touch substrate based on the difference, wherein each of the test blocks with different structures includes a structure corresponding to a respective structure in the touch area, and wherein the test blocks comprise a first test block corresponding to a conductive block in the touch area, a second test block corresponding to an etched line in the touch area, and a third test block corresponding to a bridge point area in the touch area.

2. The method according to claim 1 , wherein the test blocks are rectangular or square with a shortest side length being greater than or equal to 1 millimeter.

3. The method according to claim 1 , further comprising:
locating, using the detection device, the test blocks based on a positioning mark located in an area outside the touch area of the touch substrate.

4. The method according to claim 1 , wherein the test blocks are formed simultaneously with the formation of a structural area in the touch area during the manufacture of the touch substrate.

5. The method according to claim 4 , wherein the test blocks are formed by adding patterns for forming the test blocks on masks for forming film layers of the structural area in the touch area.

6. The method according to claim 1 , wherein the detection device comprises at least one of an optic inspection device, a sensor, and a digital image processing device.

7. The method according to claim 1 , wherein a manufacturing process of the touch substrate comprises a large board process, in which a plurality of cell panels are formed on the large board, and a small panel process, in which the large board is cut into the plurality of cell panels, and wherein the test blocks are formed in a blank area of the large board during the large board process.

8. The method according to claim 1 , wherein the manufacturing process of the touch substrate comprises a large board process, in which a plurality of cell panels are formed on the large board, and a small panel process, in which the large board is cut into the plurality of cell panels, and wherein the test blocks are formed on a black matrix layer in a periphery of a cell panel in the large board process.

9. A method for manufacturing a touch substrate, the method comprising:
forming test blocks with different structures in an area outside a touch area of the touch substrate in a manufacturing process of the touch substrate, wherein each of the test blocks with different structures includes a structure corresponding to a respective structure in the touch area, and wherein the test blocks include a first test block corresponding to a conductive block in the touch area, a second test block corresponding to an etched line in the touch area, and a third test block corresponding to a bridge point area in the touch area.

10. The method according to claim 9 , wherein the manufacturing process of the touch substrate comprises a large board process, in which a plurality of cell panels are formed on a large board, and a small panel process, in which the large board is cut into the plurality of cell panels, wherein the test blocks are formed in a blank area of the large board in the large board process.

11. The method according to claim 9 , wherein the manufacturing process of the touch substrate comprises a large board process, in which a plurality of cell panels are formed on a large board, and a small panel process, in which the large board is cut into the plurality of cell panels, wherein the test blocks are formed on a black matrix layer in a periphery of a cell panel in the large board process.

12. A touch substrate comprising:
test blocks with different structures located in an area outside a touch area thereof, wherein each of the test blocks with different structure includes a structure corresponding to a respective structure in the touch area, and wherein the test blocks comprise a first test block corresponding to a conductive block in the touch area, a second test block corresponding to an etched line in the touch area, and a third test block corresponding to a bridge point area in the touch area.

13. The touch substrate according to claim 12 , wherein the test blocks are rectangular or square, and the shortest side length thereof is greater than or equal to 1 millimeter.

14. The touch substrate according to claim 12 , further comprising:
a positioning mark for positioning the test blocks by a detection device.

15. A touch device comprising the touch substrate according to claim 12 .

16. The touch device according to claim 15 , wherein the test blocks are rectangular or square, and wherein the shortest side length thereof is greater than or equal to 1 millimeter.

17. The touch device according to claim 15 , wherein the touch substrate further comprises a positioning mark for positioning the test blocks by a detection device.

Assignees

• Boe Technology Group Co Ltd
• Hefei Xinsheng Optoelectronics Technology Co Ltd

Inventors

• Fan Wenjin
• Zhang Lei
• Kuo Tsung Chieh
• Liu Yang
• Lv Kui

Classifications

• G06F3/041 Primary

  Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• G06F3/044 Primary

  by capacitive means · CPC title

• G06F2203/04111

  Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate · CPC title

• H05K1/0269 Primary

  for visual or optical inspection · CPC title