Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems

US10976822B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10976822-B2
Application numberUS-201616326902-A
CountryUS
Kind codeB2
Filing dateOct 1, 2016
Priority dateOct 1, 2016
Publication dateApr 13, 2021
Grant dateApr 13, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; in which one surface of each of the plurality of actuators is exposed at a surface of the wearable device case; an elastomer surrounding the sides of each of the plurality of actuators within the wearable device case to hold the actuators in position within the wearable device case; and electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.

First claim

Opening claim text (preview).

What is claimed is: 1. A wearable device, comprising: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination, wherein one surface of each of the plurality of actuators is exposed at a surface of the wearable device case; an elastomer surrounding the sides of each of the plurality of actuators within the wearable device case to hold the actuators in position within the wearable device case; and electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. 2. The wearable device of claim 1 , further comprising: contact pads between each of the plurality of actuators and the internal semiconductor components of the wearable device, wherein the contact pads form the electrical interconnects from the actuators to the internal semiconductor components of the wearable device. 3. The wearable device of claim 1 , further comprising: flexible contact pins between each of the plurality of actuators and the internal semiconductor components of the wearable device, wherein the flexible contact pins form the electrical interconnects from the actuators to the internal semiconductor components of the wearable device. 4. The wearable device of claim 3 , wherein the flexible contact pins are formed from electrically conductive springs, and wherein the electrically conductive springs provide both mechanical dampening within the wearable device case from vibrations emanating from each of the plurality of actuators and additionally electrically interface the plurality of actuators to the internal semiconductor components of the wearable device. 5. The wearable device of claim 1 : wherein the elastomer surrounding the sides of each of the plurality of actuators within the wearable device case to hold the actuators in position within the wearable device case forms a soft substrate for the plurality of actuators within the wearable device case; and wherein a portion of the soft substrate is at least partially evacuated between the plurality of actuators leaving the plurality of actuators within the device case physically encompassed on all sides within the elastomer and surrounded by one or more air gaps within the wearable device case where the elastomer has been at least partially evacuated. 6. The wearable device of claim 5 , wherein the portion of the soft substrate having been at least partially evacuated comprises the soft substrate being evacuated within the wearable device case by one or more processes including: an injection molding process to leave the one or more air gaps; a photolithographic patterning and chemical etching process to remove at least a portion of the elastomer to form the one or more air gaps; a mechanical removal process to remove at least a portion of the elastomer to form the one or more air gaps; and a thinning procedure to remove at least a portion of the elastomer to form the one or more air gaps. 7. The wearable device of claim 1 , wherein the one surface of each of the plurality of actuators to be exposed at the surface of the wearable device case comprises a human contact surface to make physical contact with skin of a human user wearing the wearable device. 8. The wearable device of claim 1 , further comprising: a semiconductor package having the internal semiconductor components of the wearable device embedded therein; and a substrate of the semiconductor package with electrical contacts to receive the electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. 9. The wearable device of claim 8 , wherein the semiconductor package comprises one or more of: a CPU processor die; a logic die; a wireless transceiver functional semiconductor device providing wireless connectivity for the wearable device; a heat sink; a memory die; a System On a Chip functional semiconductor device; and a Platform Controller Hub (PCH) functional semiconductor device. 10. The wearable device of claim 1 , wherein the elastomer surrounding the sides of each of the plurality of actuators comprises part of a compliant and stretchable substrate for the wearable device and one or more electrically connected electrical components, sensors, functional modules or the internal semiconductor components of the wearable device. 11. The wearable device of claim 1 , wherein the elastomer surrounding the sides of each of the plurality of actuators comprises at least one of a soft elastomer formed from a polydimethylsiloxane (PDMS) substrate, a stretchable Polyisoprene substrate, a stretchable polybutadiene substrate, a stretchable polyisobutylene substrate, a stretchable polyurethanes substrate, a stretchable thermoplasticpolyurethanes substrate, a stretchable butyl rubber substrate, or a stretchable nitrile rubber substrate. 12. The wearable device of claim 1 : wherein the elastomer surrounding the sides of each of the plurality of actuators comprises part of a soft elastomer substrate for the wearable device and wherein the soft elastomer substrate comprises one of: a flex circuit; a flexible plastic substrate; a stretchable electronic substrate; a stretchable dielectric material; a compliant, bendable, or flexible dielectric substrate; a polyimide substrate; a PolyEther Ether Ketone (PEEK) substrate; a PolyDiMethylSiloxane (PDMS) substrate; a Flexible Printed Circuit (FPC) substrate; a silicon-based organic polymer substrate; and a screen printed silver circuits on polyester substrate. 13. The wearable device of claim 1 , wherein the plurality of actuators within the wearable device case form multiple haptic actuators and localized tactors within a haptic feedback system of the wearable device to generate localized and non-global haptic feedback signals perceptible to a human user. 14. The wearable device of claim 1 , wherein the plurality of actuators comprise one of: electroactive polymer actuators; electromagnetic actuators; piezoelectric actuators; hybrid actuators; Eccentric Rotating Mass Motor (ERM) actuators; coin-cell form factor actuators; or Linear Resonant Actuators (LRAs). 15. The wearable device of claim 1 , wherein the wearable device embodies one of: a clothing item; a tactile suit; a keyboard; a mouse; a stylus a smartphone; a tablet; wearable sports attire; a shoe; a watch; a smartwatch; a fitness band; a ring; a bracelet; a wearable technology to be worn as a clothing item or an accessory; fashion electronics to be worn as a clothing item or an accessory; tech togs to be worn as a clothing item or an accessory; fashionable technology to be worn as a clothing item or an accessory; or a flexible wearable technology to be worn as a clothing item or an accessory. 16. A method of manufacturing a wearable device, the method comprising: fabricating a wearable device case; positioning a plurality of actuators within an elastomer surrounding the sides of each of the plurality of actuators, the elastomer to hold the actuators in position, wherein each of the plurality of actuators are to vibrate independently or in combination; affixing the plurality of actuators within the elastomer within the wearable device case, wherein one surface of each of the plurality of actuators remains exposed at a surface of the wearable device case; and electrically connecting each of the plurality of actuators to internal semiconductor components of the wearable device within the wearable device case.

Assignees

Inventors

Classifications

  • Wearable computers, e.g. on a belt · CPC title

  • G06F3/016Primary

    Input arrangements with force or tactile feedback as computer generated output to the user · CPC title

  • Mounting of electronic components · CPC title

  • Input or output devices integrated in time-pieces · CPC title

  • Constructional details or arrangements · CPC title

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Frequently asked questions

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What does patent US10976822B2 cover?
In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently …
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification G06F3/016. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 13 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).