Method of manufacturing a heat pipe

US10975488B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10975488-B2
Application numberUS-201916540513-A
CountryUS
Kind codeB2
Filing dateAug 14, 2019
Priority dateAug 14, 2019
Publication dateApr 13, 2021
Grant dateApr 13, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing a heat transfer device includes manipulating the microstructure of a metal alloy to thereby remove one or more chemical components of the alloy to form resultant heat pipe structure having an envelope composed of the precursor metal alloy and a porous wick structure composed of the dealloyed metal. Manipulation of the microstructure may be conducted by selective etching of a substrate composed of a metal or metal alloy using a dealloying process.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a heat pipe, the method comprising: conducting an electroplating process on a metal substrate to form a metal composite structure; conducting a heat treatment on the metal composite structure to form a locally alloyed region on an inner surface of the metal substrate; and manipulating a microstructure of the locally alloyed region by selectively etching the locally alloyed region via a dealloying process to form the heat pipe having an outer layer to serve as a heat pipe envelope composed of the metal substrate and an inner surface to serve as a wick structure composed of a dealloyed metal having a porous wick structure formed from the locally alloyed region. 2. The method of claim 1 , wherein the heat pipe comprises: a hollow cylindrical structure, such that the porous wick structure is to extend radially inward from the metal substrate, or a hollow rectangular structure, such that the porous wick structure is to extend laterally inward from the metal substrate. 3. The method of claim 1 , wherein the dealloying process comprises electro-chemical dealloying. 4. The method of claim 1 , wherein the dealloying process comprises vacuum dealloying. 5. The method of claim 1 , wherein the dealloying process comprises vapor-phase dealloying. 6. A method of manufacturing a heat pipe, the method comprising: conducting an electroplating process on a metal substrate composed of a first metal to form a metal composite structure that includes an inner layer composed of a second metal and an outer layer comprising the metal substrate; conducting a heat treatment on the electroplated metal composite structure to transform the inner layer composed of the second metal into a metal alloy layer formed on the metal substrate; and selectively etching the metal alloy layer, via a dealloying process, to form the heat pipe having an outer layer to serve as a heat pipe envelope composed of the metal substrate and an inner surface to serve as a wick structure composed of a dealloyed metal having a porous wick structure formed from the metal alloy layer. 7. The method of claim 6 , wherein the heat pipe comprises: a hollow cylindrical structure, such that the porous wick structure is to extend radially inward from the metal substrate, or a hollow rectangular structure, such that the porous wick structure is to extend laterally inward from the metal substrate. 8. The method of claim 6 , wherein the dealloying process comprises electro-chemical dealloying. 9. The method of claim 6 , wherein the dealloying process comprises vacuum dealloying. 10. The method of claim 6 , wherein the dealloying process comprises vapor-phase dealloying.

Assignees

Inventors

Classifications

  • C25D5/50Primary

    by heat-treatment · CPC title

  • characterised by the material or the construction of the capillary structure · CPC title

  • After-treatment of electroplated surfaces · CPC title

  • Tubes; Rings; Hollow bodies · CPC title

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Frequently asked questions

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What does patent US10975488B2 cover?
A method of manufacturing a heat transfer device includes manipulating the microstructure of a metal alloy to thereby remove one or more chemical components of the alloy to form resultant heat pipe structure having an envelope composed of the precursor metal alloy and a porous wick structure composed of the dealloyed metal. Manipulation of the microstructure may be conducted by selective etchin…
Who is the assignee on this patent?
Toyota Eng & Mfg North America
What technology area does this patent fall under?
Primary CPC classification C25D5/50. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 13 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).