Growth of Nanowires
US-2024344223-A1 · Oct 17, 2024 · US
US10975487B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-10975487-B1 |
| Application number | US-202016746054-A |
| Country | US |
| Kind code | B1 |
| Filing date | Jan 17, 2020 |
| Priority date | Dec 9, 2019 |
| Publication date | Apr 13, 2021 |
| Grant date | Apr 13, 2021 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Provided are an electrolytic copper foil, and an electrode and a copper-clad laminate comprising the same. The electrolytic copper foil comprises a base copper layer having a drum side and a deposited side; wherein the electrolytic copper foil has a Charpy impact strength from 0.4 J/mm2 to 5.8 J/mm2.
Opening claim text (preview).
What is claimed is: 1. An electrolytic copper foil comprising a base copper layer; wherein a Charpy impact strength of the electrolytic copper foil ranges from 0.4 J/mm 2 to 5.8 J/mm 2 . 2. The electrolytic copper foil of claim 1 , wherein the Charpy impact strength of the electrolytic copper foil ranges from 0.5 J/mm 2 to 5.3 J/mm 2 . 3. The electrolytic copper foil of claim 1 , wherein the electrolytic copper foil has two opposite surfaces; wherein at least one of the two surfaces of the electrolytic copper foil has an aspect ratio of surface profile from 14 to 693; the aspect ratio of surface profile is a ratio of a mean width of the roughness profile elements (RSm) to a root mean square deviation of the roughness profile (Rq). 4. The electrolytic copper foil of claim 3 , wherein the aspect ratio of surface profile ranges from 37 to 506. 5. The electrolytic copper foil of claim 3 , wherein the RSm ranges from 9 μm to 523 μm. 6. The electrolytic copper foil of claim 3 , wherein the Rq ranges from 0.14 μm to 1.34 μm. 7. The electrolytic copper foil of claim 3 , wherein the Rq ranges from 0.16 μm to 1.25 μm. 8. The electrolytic copper foil of claim 1 , wherein the base copper layer has a drum side and a deposited side opposite the drum side, and the electrolytic copper foil further comprises at least one surface-treated layer formed on at least one of the drum side and the deposited side of the base copper layer. 9. The electrolytic copper foil of claim 8 , wherein the at least one surface-treated layer comprises an anti-corrosion layer. 10. The electrolytic copper foil of claim 8 , wherein the at least one surface-treated layer comprises a nodule treated layer. 11. The electrolytic copper foil of claim 10 , wherein the at least one surface-treated layer further comprises at least one sub-layer formed on the nodule treated layer; and the at least one sub-layer is selected from the group consisting of: a copper covering layer, a nickel layer, a zinc layer, a chromium layer, and a silane coupling layer. 12. The electrolytic copper foil of claim 8 , wherein the at least one surface-treated layer comprises a first surface-treated layer and a second surface-treated layer, which are respectively formed on the drum side and the deposited side of the base copper layer. 13. The electrolytic copper foil of claim 3 , wherein the base copper layer has a drum side and a deposited side opposite the drum side, and the electrolytic copper foil further comprises at least one surface-treated layer formed on at least one of the drum side and the deposited side of the base copper layer. 14. The electrolytic copper foil of claim 13 , wherein the at least one surface-treated layer comprises an anti-corrosion layer. 15. The electrolytic copper foil of claim 13 , wherein the at least one surface-treated layer comprises a nodule treated layer. 16. The electrolytic copper foil of claim 15 , wherein the at least one surface-treated layer further comprises at least one sub-layer formed on the nodule treated layer; and the at least one sub-layer is selected from the group consisting of: a copper covering layer, a nickel layer, a zinc layer, a chromium layer, and a silane coupling layer. 17. An electrode for a lithium ion battery comprising the electrolytic copper foil of claim 1 , at least one binder, and at least one active substance. 18. A copper-clad laminate comprising the electrolytic copper foil of claim 1 and a resin substrate.
in the form of layers, e.g. coatings · CPC title
Strips or foils · CPC title
Wires; Strips; Foils · CPC title
Refractory metal-containing compounds · CPC title
Heterocyclic compounds containing nitrogen as hetero atom · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.