Electrolytic copper foil and electrode and copper-clad laminate comprising the same

US10975487B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-10975487-B1
Application numberUS-202016746054-A
CountryUS
Kind codeB1
Filing dateJan 17, 2020
Priority dateDec 9, 2019
Publication dateApr 13, 2021
Grant dateApr 13, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided are an electrolytic copper foil, and an electrode and a copper-clad laminate comprising the same. The electrolytic copper foil comprises a base copper layer having a drum side and a deposited side; wherein the electrolytic copper foil has a Charpy impact strength from 0.4 J/mm2 to 5.8 J/mm2.

First claim

Opening claim text (preview).

What is claimed is: 1. An electrolytic copper foil comprising a base copper layer; wherein a Charpy impact strength of the electrolytic copper foil ranges from 0.4 J/mm 2 to 5.8 J/mm 2 . 2. The electrolytic copper foil of claim 1 , wherein the Charpy impact strength of the electrolytic copper foil ranges from 0.5 J/mm 2 to 5.3 J/mm 2 . 3. The electrolytic copper foil of claim 1 , wherein the electrolytic copper foil has two opposite surfaces; wherein at least one of the two surfaces of the electrolytic copper foil has an aspect ratio of surface profile from 14 to 693; the aspect ratio of surface profile is a ratio of a mean width of the roughness profile elements (RSm) to a root mean square deviation of the roughness profile (Rq). 4. The electrolytic copper foil of claim 3 , wherein the aspect ratio of surface profile ranges from 37 to 506. 5. The electrolytic copper foil of claim 3 , wherein the RSm ranges from 9 μm to 523 μm. 6. The electrolytic copper foil of claim 3 , wherein the Rq ranges from 0.14 μm to 1.34 μm. 7. The electrolytic copper foil of claim 3 , wherein the Rq ranges from 0.16 μm to 1.25 μm. 8. The electrolytic copper foil of claim 1 , wherein the base copper layer has a drum side and a deposited side opposite the drum side, and the electrolytic copper foil further comprises at least one surface-treated layer formed on at least one of the drum side and the deposited side of the base copper layer. 9. The electrolytic copper foil of claim 8 , wherein the at least one surface-treated layer comprises an anti-corrosion layer. 10. The electrolytic copper foil of claim 8 , wherein the at least one surface-treated layer comprises a nodule treated layer. 11. The electrolytic copper foil of claim 10 , wherein the at least one surface-treated layer further comprises at least one sub-layer formed on the nodule treated layer; and the at least one sub-layer is selected from the group consisting of: a copper covering layer, a nickel layer, a zinc layer, a chromium layer, and a silane coupling layer. 12. The electrolytic copper foil of claim 8 , wherein the at least one surface-treated layer comprises a first surface-treated layer and a second surface-treated layer, which are respectively formed on the drum side and the deposited side of the base copper layer. 13. The electrolytic copper foil of claim 3 , wherein the base copper layer has a drum side and a deposited side opposite the drum side, and the electrolytic copper foil further comprises at least one surface-treated layer formed on at least one of the drum side and the deposited side of the base copper layer. 14. The electrolytic copper foil of claim 13 , wherein the at least one surface-treated layer comprises an anti-corrosion layer. 15. The electrolytic copper foil of claim 13 , wherein the at least one surface-treated layer comprises a nodule treated layer. 16. The electrolytic copper foil of claim 15 , wherein the at least one surface-treated layer further comprises at least one sub-layer formed on the nodule treated layer; and the at least one sub-layer is selected from the group consisting of: a copper covering layer, a nickel layer, a zinc layer, a chromium layer, and a silane coupling layer. 17. An electrode for a lithium ion battery comprising the electrolytic copper foil of claim 1 , at least one binder, and at least one active substance. 18. A copper-clad laminate comprising the electrolytic copper foil of claim 1 and a resin substrate.

Assignees

Inventors

Classifications

  • in the form of layers, e.g. coatings · CPC title

  • Strips or foils · CPC title

  • C25D1/04Primary

    Wires; Strips; Foils · CPC title

  • Refractory metal-containing compounds · CPC title

  • Heterocyclic compounds containing nitrogen as hetero atom · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10975487B1 cover?
Provided are an electrolytic copper foil, and an electrode and a copper-clad laminate comprising the same. The electrolytic copper foil comprises a base copper layer having a drum side and a deposited side; wherein the electrolytic copper foil has a Charpy impact strength from 0.4 J/mm2 to 5.8 J/mm2.
Who is the assignee on this patent?
Chang Chun Petrochemical Co Ltd
What technology area does this patent fall under?
Primary CPC classification C25D1/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 13 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).