System, method, and apparatus for attaching structures

Patent metadata

Field	Value
Publication number	US-10975207-B2
Application number	US-201916355567-A
Country	US
Kind code	B2
Filing date	Mar 15, 2019
Priority date	Mar 15, 2019
Publication date	Apr 13, 2021
Grant date	Apr 13, 2021

Abstract

Apparatuses, methods, and systems are disclosed for attaching structures. One system includes: a device having a first structure attached to a second structure; a first polymer coupled to the first structure, wherein the first polymer has a first temperature profile and a first shape; and a second polymer coupled to the second structure. The second polymer has a second temperature profile and a second shape. The second shape interlocks the first shape. The first polymer and the second polymer secure the first structure to the second structure in response to the first polymer and the second polymer being in a first temperature range. The first polymer and the second polymer release the first structure from the second structure in response to the first polymer and the second polymer being in a second temperature range different from the first temperature range.

First claim

What is claimed is:

1. A system comprising:
a device comprising a first structure attached to a second structure;
a first polymer coupled to the first structure, wherein the first polymer comprises a first temperature profile and a first shape; and
a second polymer coupled to the second structure, wherein:
the second polymer comprises a second temperature profile and a second shape;
the second temperature profile is different from the first temperature profile;
the second shape is different from the first shape;
the second shape interlocks the first shape;
the first polymer and the second polymer secure the first structure to the second structure in response to the first polymer and the second polymer being in a first temperature range; and
the first polymer and the second polymer release the first structure from the second structure in response to the first polymer and the second polymer being in a second temperature range different from the first temperature range.

2. The system of claim 1 , wherein the device is selected from a group comprising a computer, a phone, a tablet, a keyboard, a mouse, and a display.

3. The system of claim 1 , wherein the first temperature profile has a different shrinkage ratio than the second temperature profile.

4. The system of claim 1 , wherein the first temperature range has all values greater than a greatest temperature of the second temperature range.

5. The system of claim 1 , wherein the first temperature range has all values less than a lowest temperate of the second temperature range.

6. A method comprising:
forming a first polymer having a first temperature profile and a first shape;
forming a second polymer having a second temperature profile and a second shape, wherein the second temperature profile is different from the first temperature profile, the second shape is different from the first shape, and the second shape interlocks the first shape;
coupling the first polymer to a first structure of an apparatus; and
coupling the second polymer to a second structure of the apparatus, wherein the first polymer and the second polymer secure the first structure to the second structure in response to the first polymer and the second polymer being in a first temperature range, and the first polymer and the second polymer release the first structure from the second structure in response to the first polymer and the second polymer being in a second temperature range different from the first temperature range.

7. The method of claim 6 , wherein the first temperature profile has a different shrinkage ratio than the second temperature profile.

8. The method of claim 6 , wherein the first temperature profile has a different melting temperature than the second temperature profile.

9. The method of claim 6 , wherein the first temperature range has all values greater than a greatest temperature of the second temperature range.

10. The method of claim 6 , wherein the first temperature range has all values less than a lowest temperature of the second temperature range.

11. The method of claim 6 , wherein the second temperature range comprises a third temperature range having all values greater than a greatest temperature of the first temperature range and a fourth temperature range having all values less than a lowest temperature of the first temperature range.

12. The method of claim 6 , wherein coupling the first polymer to the first structure of the apparatus comprises coupling the first polymer to the first structure of the apparatus using an adhesive.

13. The method of claim 12 , wherein the adhesive is a pressure sensitive adhesive.

14. The method of claim 6 , wherein the first polymer, the second polymer, or a combination thereof are shape-memory polymers.

15. An apparatus comprising:
a first structure;
a second structure;
a first polymer coupled to the first structure, wherein the first polymer comprises a first temperature profile and a first shape; and
a second polymer coupled to the second structure, wherein:
the second polymer comprises a second temperature profile and a second shape;
the second temperature profile is different from the first temperature profile;
the second shape is different from the first shape;
the second shape interlocks the first shape;
the first polymer and the second polymer secure the first structure to the second structure in response to the first polymer and the second polymer being in a first temperature range; and
the first polymer and the second polymer release the first structure from the second structure in response to the first polymer and the second polymer being in a second temperature range different from the first temperature range.

16. The apparatus of claim 15 , wherein the first temperature range has all values greater than a greatest temperature of the second temperature range.

17. The apparatus of claim 15 , wherein the second temperature range comprises a third temperature range having all values greater than a greatest temperature of the first temperature range and a fourth temperature range having all values less than a lowest temperature of the first temperature range.

18. The apparatus of claim 15 , wherein the first polymer is coupled to the first structure using an adhesive.

19. The apparatus of claim 18 , wherein the adhesive is a pressure sensitive adhesive.

20. The apparatus of claim 15 , wherein the first polymer, the second polymer, or a combination thereof are shape-memory polymers.

Assignees

• Lenovo Singapore Pte Ltd

Inventors

• Yebka Bouziane
• Jakes Philip John
• Wong Tin-Lup

Classifications

• B29C66/30321

  making use of protrusions belonging to at least one of the parts to be joined · CPC title

• B29C66/73112

  of different thermal expansion coefficient, i.e. the thermal expansion coefficient of one of the parts to be joined being different from the thermal expansion coefficient of the other part · CPC title

• Y10T156/1911

  Heating or cooling delaminating means [e.g., melting means, freezing means, etc.] · CPC title

• B29C66/12425

  Other specific interlocking undercuts not provided for in B29C66/12421 - B29C66/12423 · CPC title

• B29C66/73116

  of different melting point, i.e. the melting point of one of the parts to be joined being different from the melting point of the other part · CPC title