Hinged laminated body, layout sheet for hinged laminated body, and manufacturing method for hinged laminated body

Patent metadata

Field	Value
Publication number	US-10974534-B2
Application number	US-202016840582-A
Country	US
Kind code	B2
Filing date	Apr 6, 2020
Priority date	Dec 14, 2015
Publication date	Apr 13, 2021
Grant date	Apr 13, 2021

Abstract

A thin hinged laminated body and a layout sheet for the hinged laminated body are provided. A hinged laminated body, equipped with: an IC module having an IC chip capable of performing contactless communication; a hinge layer having a hinge section which can be bound into a booklet; a non-hinge layer which is laminated onto the hinge layer and does not have a hinge part, wherein the hinge layer is disposed over the entire surface of the laminated body having the hinge, the hinge layer and the non-hinge layer have a housing hole penetrating across the two layers, and the IC module is housed and held inside the housing hole.

First claim

The invention claimed is:

1. A hinged laminated body comprising:
an IC module having an IC chip capable of performing contactless communication;
a hinge layer having a hinge section bindable into a booklet; and
a non-hinge layer which is laminated on the hinge layer and does not have a hinge section,
wherein the hinge layer is provided on an entire surface of the hinged laminated body,
the non-hinge layer has a housing hole penetrating through the thickness direction of the non-hinge layer,
the IC module is housed and held in the housing hole, and
the hinge layer covers an entire opening of the housing hole.

2. The hinged laminated body according to claim 1 ,
wherein the IC module further has a mounted substrate on one surface of which the IC chip is mounted,
a width of the mounted substrate is larger than a width of the IC chip in a cross-sectional view, and
the housing hole is divided into a first housing hole on a side of the hinge layer and a second housing hole on a side of the non-hinge layer in the cross-sectional view, the first housing hole houses one of the mounted substrate and the IC chip, and the second housing hole houses the other one of the mounted substrate and the IC chip.

3. The hinged laminated body according to claim 2 ,
wherein the first housing hole or the second housing hole housing the IC chip has a width not allowing the mounted substrate to be housed.

4. The hinged laminated body according to claim 1 , further comprising:
an upper layer laminated on an upper side of the hinge layer and the non-hinge layer; and
a lower layer laminated on a lower side of the hinge layer and the non-hinge layer.

5. The hinged laminated body according to claim 4 ,
wherein the hinge layer and the non-hinge layer have translucency,
the upper layer includes an upper layer window portion through which a part of one of the hinge layer and the non-hinge layer close to the upper layer is visually recognizable, and
the lower layer includes a lower layer window portion through which a part of one of the hinge layer and the non-hinge layer is on the side of the lower layer is visually recognizable and which is provided in a region overlapping the upper layer window portion.

6. A layout sheet for a hinged laminated body in which a plurality of hinged laminated bodies according to claim 1 is arranged.

7. A booklet in which the hinged laminated body according to claim 1 is bound at the hinge section included in the hinged laminated body.

8. The hinged laminated body according claim 2 ,
wherein a melting temperature of the hinge layer is different from a melting temperature of the non-hinge layer.

9. The hinged laminated body according claim 3 ,
wherein a melting temperature of the hinge layer is different from a melting temperature of the non-hinge layer.

10. The hinged laminated body according to claim 2 , further comprising
an antenna connected to the IC chip,
wherein one of or both the hinge layer and the non-hinge layer have an antenna buried groove in which the antenna is buried.

11. The hinged laminated body according to claim 3 , further comprising
an antenna connected to the IC chip,
wherein one of or both the hinge layer and the non-hinge layer have an antenna buried groove in which the antenna is buried.

12. The hinged laminated body according to claim 2 , further comprising:
an upper layer laminated on an upper side of the hinge layer and the non-hinge layer; and
a lower layer laminated on a lower side of the hinge layer and the non-hinge layer.

13. The hinged laminated body according to claim 3 , further comprising:
an upper layer laminated on an upper side of the hinge layer and the non-hinge layer; and
a lower layer laminated on a lower side of the hinge layer and the non-hinge layer.

14. A layout sheet for a hinged laminated body in which a plurality of hinged laminated bodies according to claim 2 is arranged.

15. A booklet in which the hinged laminated body according to claim 2 is bound at the hinge section included in the hinged laminated body.

16. A hinged laminated body comprising:
an IC module having an IC chip capable of performing contactless communication;
a hinge layer having a hinge section bindable into a booklet; and
a non-hinge layer which is laminated on the hinge layer and does not have a hinge section,
wherein the hinge layer is provided on an entire surface of the hinged laminated body,
the non-hinge layer has a housing hole penetrating thereof, and
the IC module is housed and held in the housing hole,
wherein a melting temperature of the hinge layer is different from a melting temperature of the non-hinge layer.

17. The hinged laminated body according to claim 16 , further comprising
an antenna connected to the IC chip,
wherein one of or both the hinge layer and the non-hinge layer have an antenna buried groove in which the antenna is buried.

18. The hinged laminated body according to claim 16 , further comprising:
an upper layer laminated on an upper side of the hinge layer and the non-hinge layer; and
a lower layer laminated on a lower side of the hinge layer and the non-hinge layer.

19. A hinged laminated body comprising:
an IC module having an IC chip capable of performing contactless communication;
a hinge layer having a hinge section bindable into a booklet; and
a non-hinge layer which is laminated on the hinge layer and does not have a hinge section,
wherein the hinge layer is provided on an entire surface of the hinged laminated body,
the non-hinge layer has a housing hole penetrating thereof,
the IC module is housed and held in the housing hole, and
an antenna connected to the IC chip,
wherein one of or both the hinge layer and the non-hinge layer have an antenna buried groove in which the antenna is buried.

20. The hinged laminated body according to claim 19 , further comprising:
an upper layer laminated on an upper side of the hinge layer and the non-hinge layer; and

a lower layer laminated on a lower side of the hinge layer and the non-hinge layer.

Assignees

• Dainippon Printing Co Ltd

Inventors

• Motoi Takumi
• Nishioka Toru

Classifications

• B42D25/24 Primary

  Passports · CPC title

• B42D25/455

  using heat · CPC title

• B42D1/007 Primary

  Sheets or sheet blocks combined with other articles · CPC title

• G06K19/0723

  the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs · CPC title

• G06K19/077

  Constructional details, e.g. mounting of circuits in the carrier · CPC title