Photoirradiation substrate

Patent metadata

Field	Value
Publication number	US-10974062-B2
Application number	US-201716311527-A
Country	US
Kind code	B2
Filing date	Jun 21, 2017
Priority date	Jun 24, 2016
Publication date	Apr 13, 2021
Grant date	Apr 13, 2021

Abstract

The present invention includes: a front-side positive trace (2P) disposed on a flexible substrate (5); a positive external connection line (12P) connected to the front-side positive trace (2P) to supply electric power; and LED chips (4) provided to the flexible substrate (5) and connected to the front-side positive trace (2P), wherein an electric resistance between the positive external connection line (12P) and one of the LED chips (4) which is farthest from the positive external connection line (12P) is less than an internal resistance of the one of the LED chips (4).

First claim

The invention claimed is:

1. An irradiation substrate, comprising:
a trace disposed on a flexible substrate;
an electric power supply part connected to the trace at a center of the flexible substrate to externally supply electric power; and
LED chips disposed on a front side of the flexible substrate and connected to the trace,
wherein:
the trace includes a front-side trace part and a back-side trace part, the front-side trace part being disposed on the front side of the flexible substrate, the back-side trace part being disposed on a back side of the flexible substrate;
the electric power supply part is disposed on the back side of the flexible substrate;
the flexible substrate has a connecting hole at the center;
the front-side trace part is disposed so as to connect to the electric power supply part through the connecting hole; and
an electric resistance between the electric power supply part and one of the LED chips which is farthest from the electric power supply part is less than an internal resistance of the one of the LED chips which is farthest from the electric power supply part.

2. The irradiation substrate according to claim 1 , wherein the electric resistance is not greater than one-tenth of the internal resistance.

3. The irradiation substrate according to claim 1 , wherein
at least one of the front-side trace part and the back-side trace part includes individual traces that extend from the electric power supply part to individually connect to the respective LED chips.

4. The irradiation substrate according to claim 3 , wherein:
both the front-side trace part and the back-side trace part each include the individual traces that extend from the electric power supply part to individually connect to the respective LED chips; and
the individual traces of the front-side trace part and the individual traces of the back-side trace part are routed so as not to overlap each other.

5. The irradiation substrate according to claim 1 , wherein
at least one of the front-side trace part and the back-side trace part includes an allover trace that connects the electric power supply part and the LED chips collectively.

6. The irradiation substrate according to claim 1 , wherein the trace is thinner than the flexible substrate.

7. An irradiation substrate, comprising:
a trace disposed on a flexible substrate;
an electric power supply part connected to the trace at a center of the flexible substrate to externally supply electric power; and
LED chips provided to the flexible substrate and connected to the trace,
wherein the LED chips are substantially equal to each other in electric resistance between itself and the electric power supply part.

8. The irradiation substrate according to claim 7 , wherein an electric resistance between the electric power supply part and one of the LED chips which is farthest from the electric power supply part is not greater than one-tenth of an internal resistance of the one of the LED chips which is farthest from the electric power supply part.

9. The irradiation substrate according to claim 7 , wherein:
the trace includes a front-side trace part and a back-side trace part, the front-side trace part being disposed on a front side of the flexible substrate, the back-side trace part being disposed on a back side of the flexible substrate;
the electric power supply part is disposed on the back side of the flexible substrate; and
at least one of the front-side trace part and the back-side trace part includes individual traces that extend from the electric power supply part to individually connect to the respective LED chips.

10. The irradiation substrate according to claim 9 , wherein:
both the front-side trace part and the back-side trace part each include the individual traces that extend from the electric power supply part to individually connect to the respective LED chips; and
the individual traces of the front-side trace part and the individual traces of the back-side trace part are routed so as not to overlap each other.

11. The irradiation substrate according to claim 7 , wherein:
the trace includes a front-side trace part and a back-side trace part, the front-side trace part being disposed on a front side of the flexible substrate, the back-side trace part being disposed on a back side of the flexible substrate;
the electric power supply part is disposed on the back side of the flexible substrate; and
at least one of the front-side trace part and the back-side trace part includes an allover trace that connects the electric power supply part and the LED chips collectively.

12. The irradiation substrate according to claim 7 , wherein the trace includes: a main trace shared by at least two of the LED chips; and branch traces provided for the respective LED chips.

13. The irradiation substrate according to claim 7 , wherein the trace is thinner than the flexible substrate.

14. An irradiation substrate, comprising:
a trace disposed on a flexible substrate;
an electric power supply part connected to the trace at a center of the flexible substrate to externally supply electric power; and
LED chips provided to the flexible substrate and connected to the trace,
wherein an electric resistance between the electric power supply part and one of the LED chips which is disposed near the center of the flexible substrate is greater than an electric resistance between the electric power supply part and another one of the LED chips which is disposed near a periphery of the flexible substrate.

15. The irradiation substrate according to claim 14 , wherein the electric resistance between the electric power supply part and the one of the LED chips which is disposed near the periphery of the flexible substrate is not greater than one-tenth of an internal resistance of the one of the LED chips which is disposed near the periphery of the flexible substrate.

16. The irradiation substrate according to claim 14 , wherein:
the trace includes a front-side trace part and a back-side trace part, the front-side trace part being disposed on a front side of the flexible substrate, the back-side trace part being disposed on a back side of the flexible substrate;
the electric power supply part is disposed on the back side of the flexible substrate; and
at least one of the front-side trace part and the back-side trace part includes individual traces that extend from the electric power supply part to individually connect to the respective LED chips.

17. The irradiation substrate according to claim 16 , wherein:
both the front-side trace part and the back-side trace part each include the individual traces that extend from the electric power supply part to individually connect to the respective LED chips; and
the individual traces of the front-side trace part and the individual traces of the back-side trace part are routed so as not to overlap each other.

18. The irradiation substrate according to claim 14 , wherein:
the trace includes a front-side trace part and a back-side trace part, the front-side trace part being disposed on a front side of the flexible substrate, the back-side trace part being disposed on a back side of the flexible substrate;
the electric power supply part is disposed on the back side of the flexible substrate; and
at least one of the front-side trace part and the back-side trace part includes an allover trace that connects the electric power supply part and the LED chips collectively.

19. An irradiation substrate, comprising:
a trace disposed on a flexible substrate;

Assignees

• Sharp Kk
• Univ Osaka City
• Sbi Pharmaceuticals Co Ltd

Inventors

• Iguchi Katsuji
• Sato Hiroya
• Yoshimoto Takashi
• Mori Jun
• Ozawa Toshiyuki
• Awazu Kunio

Classifications

• A61N5/0616 Primary

  Skin treatment other than tanning · CPC title

• A61N2005/0645

  Applicators worn by the patient · CPC title

• A61N2005/0652

  Arrays of diodes · CPC title