Thin film treatment process

Patent metadata

Field	Value
Publication number	US-10971357-B2
Application number	US-201816152395-A
Country	US
Kind code	B2
Filing date	Oct 4, 2018
Priority date	Oct 4, 2018
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

A method of modifying a layer in a semiconductor device is provided. The method includes depositing a low quality film on a semiconductor substrate, and exposing a surface of the low quality film to a first process gas comprising helium while the substrate is heated to a first temperature, and exposing a surface of the low quality film to a second process gas comprising oxygen gas while the substrate is heated to a second temperature that is different than the first temperature. The electrical properties of the film are improved by undergoing the aforementioned processes.

First claim

What is claimed is:

1. A method of modifying a low quality film in a semiconductor device, comprising:
exposing a surface of the film disposed on a surface of a substrate to a first plasma formed from a first process gas that comprises helium, while the substrate is heated to a first temperature between about 350° C. and about 500° C. and a first radio frequency (RF) is applied to cause ions formed in the first plasma to bombard the surface of the film; and
exposing the surface of the film disposed on the surface of the substrate to a second plasma formed from a second process gas that comprises helium and oxygen gas, while a second RF bias different from the first RF is applied to the substrate.

2. The method of claim 1 , wherein the applying the second RF bias imparts energy to at least a portion of the ions formed in the second plasma of between about 2 eV and about 2,000 eV.

3. The method of claim 2 , wherein the first plasma has an average ion density over the surface of film during processing of between about 1×10 10 and 1×10 12 ions per cubic centimeter (cm −3 ).

4. The method of claim 2 , wherein the first plasma is created by applying a source power.

5. The method of claim 1 , wherein the first process gas further comprises a secondary gas, wherein the secondary gas comprises oxygen gas, nitrogen trifluoride gas (NF 3 ), nitrogen gas (N 2 ), and ammonia (NH 3 ).

6. The method of claim 1 , wherein the film is selected from the group consisting of silicon, silicon oxide, silicon nitride, and silicon oxynitride.

7. The method of claim 1 , further comprising depositing the film by an atomic layer deposition.

8. The method of claim 7 , wherein depositing the film further comprises exposing the surface to a primary precursor and a secondary precursor, wherein the primary precursor is a silicon based precursor, and the secondary precursor is water.

9. The method of claim 7 , wherein depositing the film further comprises exposing the surface to a primary precursor and a secondary precursor, wherein the primary precursor is a silicon based precursor, and the secondary precursor is selected from the group consisting of nitrogen gas (N 2 ) and ammonia (NH 3 ).

10. The method of claim 1 , wherein:
the film is grown in a thin film deposition chamber;
exposing the surface of the film on the substrate is performed in a processing chamber; and
the thin film deposition chamber and the processing chamber are coupled to a cluster tool that is configured to allow the substrate to be transferred between the thin film deposition chamber and the processing chamber without being exposed to air.

11. A method of modifying a film in a semiconductor device, comprising:
depositing the film on a substrate in a first processing chamber;
exposing a surface of the film to a first plasma formed from a first process gas in a second processing chamber, wherein the first process gas comprises helium, while the substrate is heated to a first temperature between about 150 and about 500° C., and a first radio frequency (RF) is applied to cause ions formed in the first plasma to bombard the surface of the film; and
exposing the surface of the film to a second plasma formed from a second process gas, wherein the second process gas comprises helium and oxygen gas, while the substrate is heated to a second temperature that is different than the first temperature and while a second RF bias is applied to the substrate.

12. The method of claim 11 , wherein the second RF bias imparts energy to the ions generated in the second plasma so that the ions bombard the surface of the film, wherein the ions have an average ion energy of between about 2 and 2,000 eV.

13. The method of claim 12 , wherein the first and the second plasmas comprise an average ion density over the surface of the film of between about 1×10 10 and 1×10 12 ions per cubic centimeter (cm −3 ).

14. The method of claim 11 , wherein the exposing the surface of the film to the first plasma and the exposing the surface of the film to the second plasma is repeated at least twice.

15. The method of claim 11 , wherein the first process gas further comprises a gas is selected from the group consisting of nitrogen trifluoride gas (NF 3 ), nitrogen gas (N 2 ), and ammonia (NH 3 ).

16. The method of claim 11 , wherein the second process gas further comprises a secondary process gas, wherein the secondary process gas is selected from the group consisting of nitrogen fluoride gas (NF 3 ), nitrogen gas (N 2 ), and ammonia (NH 3 ).

17. The method of claim 11 , wherein the film is selected from the group consisting of silicon, silicone oxide, silicon nitride, and silicon oxynitride, and wherein depositing the film comprises forming the film by an atomic layer deposition process.

18. The method of claim 17 , wherein depositing the film further comprises exposing the surface to a primary precursor and a secondary precursor, wherein the primary precursor is a silicon based precursor, and the secondary precursor is water.

19. The method of claim 17 , wherein depositing the film further comprises exposing the surface to a primary precursor and a secondary precursor, wherein the primary precursor is a silicon based precursor, and the secondary precursor is selected from the group consisting of nitrogen gas (N 2 ) and ammonia (NH 3 ).

20. A method of modifying a film in a semiconductor device, comprising:
exposing a surface of the film disposed on a surface of a substrate to a first plasma formed from a first process gas that comprises helium, while the substrate is heated to a first temperature between about 150° C. and about 500° C., wherein the first plasma is created by applying a first source power to the first process gas, and the first plasma has an average ion density over the surface of film during processing of between about 1×10 10 and 1×10 12 ions per cubic centimeter (cm −3 ); and
exposing the surface of the film disposed on the surface of the substrate to a second plasma formed from a second process gas that comprises helium and oxygen, wherein the second plasma is created by applying a second source power greater than the first source power to the second process gas.

Assignees

• Applied Materials Inc

Inventors

• Liu Wei
• Guarini Theresa Kramer
• Wang Linlin
• Bevan Malcolm
• Swenberg Johanes S
• Nagorny Vladimir
• Hwang Bernard L
• Lo Kin Pong
• Hawrylchak Lara
• George Rene

Classifications

• H10P14/69433

  the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz · CPC title

• H10P14/69215

  the material being a silicon oxide, e.g. SiO2 · CPC title

• H10P14/6927

  the material being a silicon oxynitride, e.g. SiON or SiON:H · CPC title

• H10P14/6682

  the compound being a silane, e.g. disilane, methylsilane or chlorosilane · CPC title

• H10P14/6532 Primary

  by exposure to a plasma · CPC title