What is claimed is:
1. A manufacturing method of a high thermal conductive hybrid film, and the manufacturing method comprising:
preparing a graphene oxide solution, wherein the graphene oxide solution comprises a plurality of graphene oxides;
preparing a nano-particle solution, wherein the nano-particle solution comprises a plurality of nano initial hybrid structures, and each of the nano initial hybrid structures comprises a nanodiamond and a polydopamine layer coating the nanodiamond, the nanodiamonds are dispersed in a tris-hydrochloride buffer to disperse the nanodiamonds evenly and then mixed with a dopamine hydrochloride to form the nano initial hybrid structures, and then the nano initial hybrid structures are dispersed in an ammonia to form the nano-particle solution;
providing a mixing process, wherein the mixing process is for mixing the graphene oxide solution and the nano-particle solution to obtain a mixing solution;
providing a preliminary-film forming process, wherein the preliminary-film forming process is for filtrating the mixing solution and then remaining a mixture of the graphene oxides and the nano initial hybrid structures to form a preliminary film; and
providing a heating process, wherein the heating process is for heating the preliminary-film to reduce the graphene oxides as a plurality of reduced graphene oxides and convert the polydopamine layers into a plurality of carbon layers, so as to convert the nano initial hybrid structures into a plurality of nano hybrid structures;
whereby, the high thermal conductive hybrid film is formed.
2. The manufacturing method of the high thermal conductive hybrid film of claim 1 , wherein in the preliminary-film forming process, the mixture of the graphene oxides and the nano initial hybrid structures is pressurized and dried in air to form the preliminary-film.
3. The manufacturing method of the high thermal conductive hybrid film of claim 2 , wherein in the heating process, the preliminary-film is disposed in a high-temperature furnace with argon flowing at 800° C. to anneal.