Filling body for reducing a volume of a pressure measurement chamber

US10969287B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10969287-B2
Application numberUS-201716325824-A
CountryUS
Kind codeB2
Filing dateJul 25, 2017
Priority dateAug 16, 2016
Publication dateApr 6, 2021
Grant dateApr 6, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure relates to a filling body for reducing a volume of a pressure measurement chamber, which is to be filled with a pressure transmitting fluid, surrounding a pressure sensor. The filling body includes a recess for receiving the pressure sensor and has a free-standing base projecting into the recess on which the pressure sensor can be mounted. A filling body base supporting the filling body is provided on a side of the filling body facing away from the recess. The filling body can be mounted in an application location in such a way that the filling body base supports the otherwise free-standing filling body. The filling body base has a base surface that is smaller than a base surface of a filling body region that is adjacent to the filling body base and surrounding the recess.

First claim

Opening claim text (preview).

The invention claimed is: 1. A filling body for reducing a volume to be filled with a pressure-transmitting fluid of a pressure measurement chamber surrounding a pressure sensor, the filling body comprising: a recess for receiving the pressure sensor; and a freestanding base projecting into the recess on which the pressure sensor is mountable; wherein a filling body base carrying the filling body is provided on a side of the filling body facing away from the recess; wherein the filling body is mountable at an application location such that the filling body base carries the free-standing filling body; wherein a base surface of the filling body base is smaller than a base surface of a filling body region that borders the filling body base and surrounds the recess. 2. The filling body of claim 1 , wherein the filling body is made of at least one of aluminum oxide (Al 2 O 3 ), silicon nitride (Si 3 N 4 ), and silicon carbide (SiC). 3. The filling body of claim 1 , wherein the filling body base has a height of at least 0.4 mm in a direction parallel to a longitudinal axis of the filling body base; or the base surface of the filling body base is less than a base surface of the recess in the filling body, larger than a base surface of the freestanding base or greater than a minimum area of 2 mm 2 . 4. The filling body of claim 1 , wherein electrically conductive contact surfaces are provided on a side of the filling body facing away from the filling body base, wherein an electrical terminal of a functional element that is mountable on the filling body is electrically connectable to the electrically conductive contact surfaces via a lead. 5. The filling body of claim 1 , wherein bores extending through the filling body, outside of the recess, are each configured to receive a connecting lead that is connectable to an electrical terminal of a functional element mounted on the filling body. 6. The filling body of claim 5 , wherein, on a side facing away from the filling body base, an extension is provided which is molded onto the filling body region surrounding the recess in the filling body. 7. The filling body of claim 6 , wherein the bores of the extension pass through the filling body. 8. The filling body of claim 1 , wherein the freestanding base has a length of at least three tenths of a millimeter; or the freestanding base has a base surface that is smaller than a base surface of the pressure sensor mountable thereon. 9. A pressure measurement module, comprising: a filling body for reducing a volume to be filled with a pressure-transmitting fluid of a pressure measurement chamber surrounding a pressure sensor, wherein the filling body includes: a recess for receiving the pressure sensor; and a freestanding base projecting into the recess on which the pressure sensor is mountable; wherein a filling body base carrying the filling body is provided on a side of the filling body facing away from the recess; wherein the filling body is mountable at an application location such that the filling body base carries the free-standing filling body; wherein a base surface of the filling body base is smaller than a base surface of a filling body region that borders the filling body base and surrounds the recess; wherein a pressure sensor is received in the recess of the filling body and is mounted to the freestanding base using a joint. 10. The pressure measurement module of claim 9 , including at least one functional element in addition to the pressure sensor. 11. The pressure measurement module of claim 9 , wherein electrically conductive contact surfaces are provided on a side of the filling body facing away from the filling body base, wherein an electrical terminal of a functional element that is mountable on the filling body is electrically connectable to the electrically conductive contact surfaces via a lead. 12. A pressure measurement device, including: a pressure measurement module including a filling body for reducing a volume to be filled with a pressure-transmitting fluid of a pressure measurement chamber surrounding a pressure sensor, wherein the filling body includes: a recess for receiving the pressure sensor; and a freestanding base projecting into the recess on which the pressure sensor is mountable; wherein a filling body base carrying the filling body is provided on a side of the filling body facing away from the recess; wherein the filling body is mountable at an application location such that the filling body base carries the free-standing filling body; wherein a base surface of the filling body base is smaller than a base surface of a filling body region that borders the filling body base and surrounds the recess; wherein a pressure sensor is received in the recess of the filling body and is mounted to the base using a joint; and wherein the pressure measurement module is inserted on a carrier into the pressure measurement chamber; wherein the filling body is mounted on the carrier using a joint; wherein sensor terminals of the pressure sensor are directly connected via a lead to an associated connecting lead; and wherein the associated connecting lead passes through an electrically insulating grommet provided in the carrier and a bore passing through the filling body. 13. The pressure measurement device of claim 12 , wherein the carrier includes a recess into which the filling body base is received. 14. The pressure measurement device of claim 12 , wherein the filling body on a side facing away from the filling body base includes an extension that surrounds the recess, and the carrier includes a carrier region received in a cavity located below the extension; or wherein the carrier includes a recess in which a filling body region adjacent the filling body base is arranged.

Assignees

Inventors

Classifications

  • G01L19/04Primary

    Means for compensating for effects of changes of temperature {, i.e. other than electric compensation} · CPC title

  • Details about the mounting of the sensor to support or covering means · CPC title

  • Transmitting or indicating the displacement of flexible diaphragms · CPC title

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What does patent US10969287B2 cover?
The present disclosure relates to a filling body for reducing a volume of a pressure measurement chamber, which is to be filled with a pressure transmitting fluid, surrounding a pressure sensor. The filling body includes a recess for receiving the pressure sensor and has a free-standing base projecting into the recess on which the pressure sensor can be mounted. A filling body base supporting t…
Who is the assignee on this patent?
Endress Hauser Se Co Kg
What technology area does this patent fall under?
Primary CPC classification G01L19/04. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 06 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).