Filament and lighting device

Patent metadata

Field	Value
Publication number	US-10969063-B2
Application number	US-201716303887-A
Country	US
Kind code	B2
Filing date	May 23, 2017
Priority date	May 25, 2016
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

A filament includes a plurality of strings including radiation-emitting semiconductor chips electrically connected in series; and a plurality of contact structures to contact the strings, wherein the contact structures electrically connect to semiconductor chips at ends of the strings such that the strings are electrically drivable via the contact structures, and the filament is configured such that the strings are electrically drivable at least separately from one another via the contact structures.

First claim

The invention claimed is:

1. A filament comprising:
a plurality of strings comprising radiation-emitting semiconductor chips electrically connected in series; and
a plurality of contact structures to contact the strings, wherein the contact structures electrically connect to semiconductor chips at ends of the strings such that the strings are electrically drivable via the contact structures, wherein
the filament is configured such that the strings are electrically drivable at least separately from one another via the contact structures,
the strings comprise different numbers of semiconductor chips, and
all of the semiconductor chips of the filament are arranged along a common line.

2. The filament according to claim 1 ,
wherein a plurality of strings electrically connect in series to constitute a series circuit,
two contact structures electrically connect to semiconductor chips at the ends of the series circuit, and
at least one further contact structure is present, via which two strings of the series circuit electrically connect in series.

3. The filament according to claim 1 ,
wherein a plurality of strings are electrically isolated, and
in the isolated strings, each of two contact structures electrically connect to semiconductor chips at the ends of the strings.

4. The filament according to claim 1 , wherein at least two contact structures are accessible at the ends of the filament.

5. The filament according to claim 1 , wherein at least one contact structure is accessible in a region between the ends of the filament.

6. The filament according to claim 1 , wherein two contact structures electrically connected to semiconductor chips at the ends of a string are accessible at one end of the filament.

7. The filament according to claim 1 , wherein the semiconductor chips of the strings are covered with a conversion layer for radiation conversion.

8. The filament according to claim 7 , wherein at least two contact structures at the ends of the filament project from the conversion layer.

9. The filament according to claim 7 , wherein at least two contact structures at the ends of the filament project from the conversion layer, and
at least one further contact structure projects laterally from the conversion layer in a region between the ends of the filament.

10. The filament according to claim 7 ,
wherein the semiconductor chips of the strings are each covered with a separate layer section of the conversion layer, and
at least one contact structure is accessible in an intermediate region of two adjacent layer sections of the conversion layer.

11. The filament according to claim 1 , further comprising at least one of:
a carrier on which the semiconductor chips and the contact structures are arranged; and
a carrier laterally surrounding the semiconductor chips.

12. The filament according to claim 1 , wherein the semiconductor chips of the strings are arranged alternately side-inverted with respect to one another.

13. A lighting device, comprising the filament according to claim 1 .

14. The lighting device according to claim 13 , further comprising a multistage driver that drives the strings of the filament.

15. The lighting device according to claim 13 , wherein the strings of the filament are interconnected in separate circuits.

16. The lighting device according to claim 15 , further comprising a driver connected to the filament to convert a mains voltage into a forward voltage, wherein the driver is configured to drive the strings of the filament such that the forward voltage is adjusted to the mains voltage.

17. A filament comprising:
a plurality of strings comprising radiation-emitting semiconductor chips electrically connected in series; and
a plurality of contact structures to contact the strings, wherein the contact structures electrically connect to semiconductor chips at ends of the strings such that the strings are electrically drivable via the contact structures, wherein
the filament is configured such that the strings are electrically drivable at least separately from one another via the contact structures, and
the filament comprises at least one of:
the semiconductor chips of the strings are each covered with a separate layer section of a conversion layer for radiation conversion, and at least one contact structure is accessible in an intermediate region of two adjacent layer sections of the conversion layer; and
the semiconductor chips of the strings are arranged alternately side-inverted with respect to one another.

18. A lighting device comprising a filament and a driver connected to the filament, wherein
the filament comprises a plurality of strings comprising radiation-emitting semiconductor chips electrically connected in series and a plurality of contact structures to contact the strings,
the contact structures electrically connect to semiconductor chips at ends of the strings such that the strings are electrically drivable via the contact structures,
the filament is configured such that the strings are electrically drivable at least separately from one another via the contact structures,
the strings comprise different numbers of semiconductor chips,
all of the semiconductor chips of the filament are arranged along a common line,
the driver is configured to convert a mains voltage into a forward voltage,
the forward voltage is provided to operate the filament and applied to the filament, and
the driver is configured to drive the strings of the filament such that the forward voltage comprises a stepped voltage profile adjusted to the mains voltage.

19. The lighting device according to claim 18 , wherein the driver is configured to optionally drive individual, a plurality or all of the strings of the filament such that,
with increasing magnitude of the mains voltage, increasingly more semiconductor chips of the filament are each electrically operated,
in a region of a maximum magnitude of the mains voltage, each of the strings and thus all of the semiconductor chips of the filament are electrically operated,
with decreasing magnitude of the mains voltage, increasingly fewer semiconductor chips of the filament are each electrically operated, and
in a region of zero crossings of the mains voltage, all of the strings and thus all of the semiconductor chips of the filament are not operated.

Assignees

• Osram Opto Semiconductors Gmbh
• Osram Oled Gmbh

Inventors

• Schlereth Thomas
• Luckner Hagen

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/00 Primary

  Package configurations · CPC title