Thermal interface materials including polymeric phase-change materials

Patent metadata

Field	Value
Publication number	US-10968320-B2
Application number	US-201916238735-A
Country	US
Kind code	B2
Filing date	Jan 3, 2019
Priority date	Nov 30, 2015
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

In an example, a thermal interface material includes a polymeric phase-change material.

First claim

The invention claimed is:

1. A thermal interface material, comprising:
a polymeric phase-change material, the polymeric phase-change material comprising a block copolymer formed from a diene, the diene formed from a vinyl-terminated fatty acid monomer and an ethylene glycol monomer.

2. The thermal interface material of claim 1 , wherein the vinyl-terminated fatty acid monomer has a chemical formula C 2 H 4 —R—C(O)OH and the ethylene glycol monomer has a chemical formula C 2n H 4n+2 O n+1 , wherein:
R corresponds to a chain length (x) of at least 8 carbon atoms between a terminal vinyl group and a carbonyl group, and
n is greater than or equal to 1.

3. The thermal interface material of claim 2 , wherein n is equal to 1.

4. The thermal interface material of claim 2 , wherein n is 2 or more.

5. The thermal interface material of claim 4 , wherein the ethylene glycol monomer includes tetraethylene glycol.

6. The thermal interface material of claim 1 , wherein the polymeric phase-change material has a melting transition temperature (T m ) in a range of 0° C. to 100° C.

7. The thermal interface material of claim 1 , wherein the polymeric phase-change material has a melting enthalpy in a range of 200 J/g to 400 J/g.

8. The thermal interface material of claim 1 , wherein the polymeric phase-change material has a thermal stability parameter (T d ) of 5% mass loss at a temperature that is in a range of 250° C. to 450° C.

9. The thermal interface material of claim 1 , wherein the thermal interface material has a structure represented by:

wherein x is at least 8 carbon atoms and n is greater than or equal to 1.

10. A thermal interface material, comprising:
a polymeric phase-change material, the polymeric phase-change material comprising a block copolymer formed from a diene, the diene being formed from a vinyl-terminated fatty acid monomer and an ethylene glycol monomer, the vinyl-terminated fatty acid monomer having a chemical formula of C 2 H 4 —R—C(O)OH and the ethylene glycol monomer having the chemical formula C 2n H 4n+2 O n+1 , wherein:
R corresponds to a chain length (x) of at least 8 carbon atoms between a terminal vinyl group and a carbonyl group, and
n is greater than 2.

11. The thermal interface material of claim 10 , wherein the ethylene glycol monomer includes tetraethylene glycol.

12. The thermal interface material of claim 10 , wherein the polymeric phase-change material has a melting transition temperature (T m ) in a range of 0° C. to 100° C.

13. The thermal interface material of claim 10 , wherein the polymeric phase-change material has a melting enthalpy in a range of 200 J/g to 400 J/g.

14. The thermal interface material of claim 10 , wherein the polymeric phase-change material has a thermal stability parameter (T d ) of 5% mass loss at a temperature that is in a range of 250° C. to 450° C.

15. The thermal interface material of claim 10 , wherein n is equal to 4.

16. The thermal interface material of claim 10 , wherein the thermal interface material has a structure represented by:

wherein x us at least 8 carbon atoms and n is greater than 2.

17. A thermal interface material, comprising:
a polymeric phase-change material, the polymeric phase-change material comprising a block copolymer formed from a diene, and the diene being formed from a vinyl-terminated fatty acid monomer and an ethylene glycol monomer, the vinyl-terminated fatty acid monomer having a chemical formula of C 2 H 4 —R—C(O)OH and the ethylene glycol monomer having the chemical formula C 2n H 4n+2 O n+1 , wherein:
R corresponds to a chain length (x) of at least 8 carbon atoms between a terminal vinyl group and a carbonyl group,
n is greater than or equal to 1, and
the polymeric phase-change material has one or more of a melting transition temperature (T m ) in a range of 0° C. to 100° C., a melting enthalpy in a range of 200 J/g to 400 J/g, or a thermal stability parameter (T d ) of 5% mass loss at a temperature that is in a range of 250° C. to 450° C.

18. The thermal interface material of claim 17 , wherein the thermal interface material has a structure represented by:

wherein x is at least 8 carbon atoms and n is greater than or equal to 1.

Assignees

• IBM

Inventors

• Boday Dylan J
• Kuczynski Joseph
• Mauldin Timothy C

Classifications

• H10W72/30

  Die-attach connectors · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W40/735

  by melting or evaporation of solids · CPC title

• H10W40/251 Primary

  Organics · CPC title