Chassis and method for manufacturing chassis
US-2015190985-A1 · Jul 9, 2015 · US
Clad material
US10967609B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10967609-B2 |
| Application number | US-201815925876-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 20, 2018 |
| Priority date | Aug 9, 2017 |
| Publication date | Apr 6, 2021 |
| Grant date | Apr 6, 2021 |
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- Title
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- Abstract
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Abstract
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A clad material includes a first layer made of stainless steel and a second layer made of Cu or a Cu alloy and roll-bonded to the first layer. In the clad material, a grain size of the second layer measured by a comparison method of JIS H 0501 is 0.150 mm or less.
First claim
Opening claim text (preview).
What is claimed is: 1. A clad material comprising: a first layer made of stainless steel; and a second layer made of Cu or a Cu alloy and roll-bonded to the first layer and interatomic bonding by diffusion between the stainless steel and the Cu or the Cu alloy, wherein a grain size of the second layer made of Cu or the Cu alloy measured by a comparison method of JIS H 0501 is 0.076 mm or more and 0.150 mm or less and the Cu alloy contains 0.05 mass % or more and 0.15 mass % or less of Zr, or contains 4 ppm or more and 55 ppm or less of Ti, and 2 ppm or more and 12 ppm or less of S and 2 ppm or more and 30 ppm or less of O. 2. The clad material according to claim 1 , wherein the grain size of the second layer is 0.130 mm or less. 3. The clad material according to claim 1 , further comprising a third layer made of stainless steel and roll-bonded to a side of the second layer opposite to the first layer. 4. The clad material according to claim 1 , wherein the stainless steel is austenitic stainless steel.
Assignees
Inventors
Classifications
Arrangements for heating · CPC title
containing silicon · CPC title
- B32B15/015Primary
the said other metal being copper or nickel or an alloy thereof · CPC title
by means of a rolling mill · CPC title
- B32B15/013Primary
one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium · CPC title
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Frequently asked questions
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- What does patent US10967609B2 cover?
- A clad material includes a first layer made of stainless steel and a second layer made of Cu or a Cu alloy and roll-bonded to the first layer. In the clad material, a grain size of the second layer measured by a comparison method of JIS H 0501 is 0.150 mm or less.
- Who is the assignee on this patent?
- Hitachi Metals Ltd
- What technology area does this patent fall under?
- Primary CPC classification B32B15/015. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 06 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).