Mold separation device and separation method thereof

US10967544B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10967544-B2
Application numberUS-201715828451-A
CountryUS
Kind codeB2
Filing dateDec 1, 2017
Priority dateDec 1, 2017
Publication dateApr 6, 2021
Grant dateApr 6, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A mold separation device includes a carrying mechanism, a scraping mechanism, and two separation mechanisms. The carrying mechanism is adapted to carry a first mold and a second mold bonded to the first mold. The scraping mechanism is disposed at an edge of the carrying mechanism and is adapted to scrape off a spilled glue produced when the first mold is bonded to the second mold. The separation mechanisms are disposed at the edge of the carrying mechanism and are located on two opposite sides of the scraping mechanism. The separation mechanisms are adapted to pull open the first mold and the second mold so that the first mold and the second mold are separated from each other.

First claim

Opening claim text (preview).

What is claimed is: 1. A mold separation device comprising: a carrying stage adapted to carry a first mold and a second mold bonded to the first mold; a scraping mechanism disposed at an edge of the carrying stage and comprising a blade tool adapted to scrape off a spilled glue connecting an edge of the first mold and an edge of the second mold and produced when the first mold is bonded to the second mold, wherein the blade tool is mounted in a fixed position; two separation mechanisms disposed at the edge of the carrying stage and located on two opposite sides of the scraping mechanism, wherein each of the separation mechanisms comprises a pull controlling member adapted to pull open the first mold and the second mold so that the first mold and the second mold are separated from each other; and a working platform comprising a platform surface, an accommodating recess, and a spin table, wherein a height difference exists between a bottom surface of the accommodating recess and the platform surface, and the spin table is located on the platform surface. 2. The mold separation device as recited in claim 1 , wherein the carrying stage is assembled on the spin table, the spin table is spun to cause the scraping mechanism to scrape off the spilled glue produced when the first mold is bonded to the second mold, the scraping mechanism is located in the accommodating recess, and the separation mechanisms are assembled on the platform surface. 3. The mold separation device as recited in claim 1 , further comprising: a blocking plate assembled on the platform surface, located at another edge of the carrying stage opposite to the edge, and configured to abut edges of the first mold and the second mold. 4. The mold separation device as recited in claim 1 , further comprising: a vacuum on button disposed on the working platform and located on the platform surface, wherein a vacuum adsorption force between the first mold and the carrying stage is generated when the vacuum on button is pressed; and a vacuum off button disposed on the working platform and located on the platform surface, wherein the vacuum adsorption force between the first mold and the carrying stage is removed when the vacuum off button is pressed. 5. The mold separation device as recited in claim 1 , wherein the scraping mechanism comprises the blade tool and an adjustment base, the blade tool is disposed on the adjustment base, and the adjustment base is suitable for adjusting a distance between the blade tool and the spilled glue, suitable for adjusting a blade angle of the blade tool, and suitable for adjusting a blade height of the blade tool. 6. The mold separation device as recited in claim 1 , wherein each of the separation mechanisms comprises a first separation part and a second separation part, the first separation part and the second separation part are disposed on the pull controlling member, and the second separation part is adapted to be moved relatively to the first separation part by a vertical distance through the pull controlling member. 7. The mold separation device as recited in claim 6 , wherein the first separation part of each of the separation mechanisms abuts an upper surface of the first mold, and the second separation part abuts a lower surface of the second mold, when the second separation part is constantly moved relatively to the first separation part by the vertical distance, the first mold and the second mold are pulled open so that the first mold and the second mold are separated from each other. 8. The mold separation device as recited in claim 1 , wherein a thickness of the first mold is smaller than a thickness of the second mold. 9. The mold separation device as recited in claim 1 , wherein the second mold comprises an indented portion indented towards the first mold to define an indented space with the first mold, and the spilled glue produced when the first mold is bonded to the second mold is located in the indented space.

Assignees

Inventors

Classifications

  • B26F1/38Primary

    Cutting-out; Stamping-out · CPC title

  • Hand or foot actuated means · CPC title

  • Halving devices, e.g. for halving buns · CPC title

  • Deburring or deflashing {(thermal deburring in general B23D79/005)} · CPC title

  • Opening, closing or clamping · CPC title

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What does patent US10967544B2 cover?
A mold separation device includes a carrying mechanism, a scraping mechanism, and two separation mechanisms. The carrying mechanism is adapted to carry a first mold and a second mold bonded to the first mold. The scraping mechanism is disposed at an edge of the carrying mechanism and is adapted to scrape off a spilled glue produced when the first mold is bonded to the second mold. The separatio…
Who is the assignee on this patent?
Himax Tech Ltd
What technology area does this patent fall under?
Primary CPC classification B26F1/38. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 06 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).