Forming device

Patent metadata

Field	Value
Publication number	US-10967414-B2
Application number	US-201815887643-A
Country	US
Kind code	B2
Filing date	Feb 2, 2018
Priority date	Aug 28, 2015
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

A forming device that expands a metal pipe material to form a metal pipe includes a die that has an upper die and a lower die, at least one of which is movable, and that form the metal pipe, an electrode that energizes the metal pipe material to heat the metal pipe material, a gas supply part that supplies a gas into the heated metal pipe material to expand the metal pipe material, and a die movement suppressing part that suppresses the movement of the die by an electromagnetic force at least when the energization to the metal pipe material is performed by the electrode.

First claim

What is claimed is:

1. A forming device that expands a metal pipe material to form a metal pipe, the device comprising:
a die that has an upper die and a lower die, either the upper die or the lower die is movable to form the metal pipe;
an electrode configured to supply, to the metal pipe material, energization that heats the metal pipe material at a location of the die where an electromagnetic force caused by the energization acts on the die to move the die;
a gas supply part configured to supply, into the metal pipe material when the electrode supplies the energization to the metal pipe material, a gas that expands the metal pipe material; and
a die movement suppressing part configured to suppress, when the electrode supplies the energization to the metal pipe material, movement of the die that is caused by the electromagnetic force,
wherein the die movement suppressing part is provided with a die magnetization suppressing part that suppresses the movement of the die by an electromagnetic force by suppressing the magnetization of the die.

2. The forming device according to claim 1 ,
wherein the upper die is supported by an upper die holder and the lower die is supported by a lower die holder,
the die movement suppressing part is provided with a fixing part that mechanically fixes the lower die at least when the electrode supplies the energization, the fixing part is attached to a side surface on an outer side of the lower die holder.

3. The forming device according to claim 2 ,
wherein the fixing part is provided with a pin that is inserted into a side surface of the lower die at least when the energization to the metal pipe material is performed by the electrode.

4. The forming device according to claim 1 ,
wherein the electrode is between the die and the gas supply part.

5. The forming device according to claim 1 ,
wherein the electromagnetic force is generated when the electrode supplies the energization to the metal pipe material.

6. The forming device according to claim 1 ,
wherein the die is magnetizable by the electromagnetic force.

7. The forming device according to claim 1 ,
wherein the upper die and the lower die are movable.

8. A forming device that expands a metal pipe material to form a metal pipe, the device comprising:
a die that has an upper die and a lower die, either the upper die or the lower die is movable to form the metal pipe;
an electrode configured to supply, to the metal pipe material, energization that heats the metal pipe material;
a gas supply part configured to supply, into the metal pipe material when the electrode supplies the energization to the metal pipe material, a gas that expands the metal pipe material; and
a die movement suppressing part configured to suppress, when the electrode supplies the energization to the metal pipe material, movement of the die that is caused by an electromagnetic force,
wherein the die movement suppressing part is provided with a die magnetization suppressing part that suppresses the movement of the die by an electromagnetic force by suppressing the magnetization of the die.

9. The forming device according to claim 8 ,
wherein the die magnetization suppressing part is provided with a switching part that switches the direction of a DC current that is supplied to the electrode.

10. The forming device according to claim 8 ,
wherein the die magnetization suppressing part is provided with a coil surrounding the die.

11. The forming device according to claim 10 ,
wherein the coil is provided to surround each of the upper die and the lower die.

12. The forming device according to claim 8 ,
wherein the upper die is supported by an upper die holder and the lower die is supported by a lower die holder, and
the die magnetization suppressing part is provided with a magnetic flux loop forming part including a protrusion extending from one of the upper die holder and the lower die holder toward the other at a position adjacent to the die.

13. The forming device according to claim 12 ,
wherein the protrusion provided on the outer surface side of at least one of the upper die holder and the lower die holder forms a leakage magnetic field suppressing part.

14. The forming device according to claim 8 ,
wherein the upper die and the lower die are movable.

15. A forming device that expands a metal pipe material to form a metal pipe, the device comprising:
a die that has an upper die and a lower die, the upper die and the lower die are movable to form the metal pipe;
an electrode configured to supply, to the metal pipe material, energization that heats the metal pipe material;
a gas supply part configured to supply, into the metal pipe material when the electrode supplies the energization to the metal pipe material, a gas that expands the metal pipe material; and
a die movement suppressing part configured to suppress, when the electrode supplies the energization to the metal pipe material, movement of the die that is caused by an electromagnetic force.

Assignees

• Sumitomo Heavy Industries

Inventors

• SAIKA Masayuki
• Ishizuka Masayuki
• UENO Norieda
• Miyazaki Shuji
• Moritani Koji
• Yamamoto Taizo

Classifications

• B21D26/033 Primary

  Deforming tubular bodies (corrugating tubes by applying fluid pressure B21D15/03, B21D15/10) · CPC title

• B21D26/047 Primary

  Mould construction (B21D26/037 - B21D26/045 take precedence) · CPC title