Antenna-integrated type communication module and manufacturing method for the same
US-2018205155-A1 · Jul 19, 2018 · US
US10965004B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10965004-B2 |
| Application number | US-201916259005-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 28, 2019 |
| Priority date | Jul 17, 2018 |
| Publication date | Mar 30, 2021 |
| Grant date | Mar 30, 2021 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A chip antenna module includes a substrate having layers; a chip antenna mounted on one surface of the substrate to radiate a radio signal, the chip antenna having a body portion formed of a dielectric substance, and a ground portion and a radiating portion disposed on opposite surfaces of the body portion; and an auxiliary patch disposed below the radiating portion on at least one layer of the substrate.
Opening claim text (preview).
What is claimed is: 1. A chip antenna module comprising: a substrate comprising a plurality of layers; a chip antenna comprising a first body portion formed of a first dielectric substance, a second body portion formed of a second dielectric substance, a ground portion, and a radiating portion; and an auxiliary patch disposed on at least another layer of the substrate below the radiating portion to be overlapped with the radiating portion along a direction perpendicular to the surface of the at least one layer, wherein the chip antenna is mounted on a surface of at least one layer of the substrate and configured to radiate a radio signal, and wherein the radiating portion is disposed between the first body portion and the second body portion, and wherein the ground portion is disposed to face the radiation portion with the first body portion interposed between the ground portion and the radiating portion. 2. The chip antenna module of claim 1 , wherein the auxiliary patch is disposed in a portion of the substrate corresponding to the radiating portion with respect to a mounting direction of the chip antenna on the substrate. 3. The chip antenna module of claim 1 , wherein a length of the auxiliary patch is the same as a length of the radiating portion. 4. The chip antenna module of claim 1 , wherein the auxiliary patch comprises auxiliary patches disposed on different layers of the substrate. 5. The chip antenna module of claim 4 , further comprising an auxiliary via connecting two or more of the auxiliary patches to each other. 6. The chip antenna module of claim 5 , wherein the auxiliary via is electrically connected to the radiating portion. 7. The chip antenna module of claim 5 , wherein the auxiliary via is disposed in a central region of the auxiliary patches in a length direction of the auxiliary patches. 8. The chip antenna module of claim 5 , wherein the auxiliary via comprises two auxiliary vias, and the two auxiliary vias are disposed in different edge regions of the auxiliary patches in a length direction of the auxiliary patches. 9. The chip antenna module of claim 5 , wherein the auxiliary via comprises auxiliary vias, and the auxiliary vias are spaced apart from each other in a length direction of the auxiliary patches. 10. A chip antenna module comprising: a substrate comprising a plurality of layers; a chip antenna mounted on a surface of at least one layer of the substrate and comprising a first block formed of a first dielectric substance and a second block formed of a second dielectric substance, a radiating portion, and a director disposed to face the radiating portion with the second block interposed between the director and the radiating portion; and an auxiliary patch disposed on at least another layer of the substrate below one or both of the radiating portion and the director to be overlapped with one or both of the radiating portion and the director along a direction perpendicular to the surface of the at least one layer, wherein the radiating portion is disposed between the first block and the second block, and wherein the ground portion is disposed to face the radiating portion with the first block interposed between the ground portion and the radiating portion. 11. The chip antenna module of claim 10 , wherein the auxiliary patch comprises a first auxiliary patch disposed below the radiating portion and a second auxiliary patch disposed below the director. 12. The chip antenna module of claim 11 , wherein the first auxiliary patch is disposed in a portion of the substrate corresponding to the radiating portion with respect to a mounting direction of the chip antenna on the substrate, and the second auxiliary patch disposed in a portion of the substrate corresponding to the director with respect to the mounting direction. 13. The chip antenna module of claim 11 , wherein a length of the first auxiliary patch is the same as a length of the radiating portion, and a length of the second auxiliary patch is the same as a length of the director. 14. The chip antenna module of claim 10 , wherein the auxiliary patch comprises auxiliary patches disposed on different layers of the substrate. 15. The chip antenna module of claim 14 , further comprising an auxiliary via connecting the auxiliary patches to each other. 16. The chip antenna module of claim 15 , wherein at least two of the auxiliary patches are connected to each other by the auxiliary via, and at least one auxiliary patch is electrically separated from the other auxiliary patches. 17. The chip antenna module of claim 15 , wherein the auxiliary via is disposed in a central region of the auxiliary patches in a length direction of the auxiliary patches. 18. The chip antenna module of claim 15 , wherein the auxiliary via comprises two auxiliary vias, and the two auxiliary vias are disposed in different edge regions of the auxiliary patches in a length direction of the auxiliary patches. 19. The chip antenna module of claim 15 , wherein the auxiliary via comprises auxiliary vias, and the auxiliary vias are spaced apart from each other in a length direction of the auxiliary patches. 20. An electronic device, comprising: the chip antenna module of claim 10 . 21. A chip antenna module comprising: a substrate; a chip antenna mounted on the substrate and comprising a first body portion formed of a first dielectric substance, a second body portion formed of a second dielectric substance, a ground portion, and a radiating portion configured to radiate a radio signal mounted the substrate and comprising a radiating portion configured to radiate a radio signal; and auxiliary patches disposed in the substrate at positions corresponding to the radiating portion with respect to a mounting direction of the chip antenna on the substrate, the auxiliary patches comprising at least two auxiliary patches that are electrically connected to each other and at least one auxiliary patch that is not electrically connected to any other of the auxiliary patches, wherein the radiating portion is disposed between the first body portion and the second body portion, and wherein the ground portion is disposed to face the radiating portion with the first body portion interposed between the ground portion and the radiating portion. 22. The chip antenna module of claim 1 , wherein the opposite surfaces of the body portion are perpendicular to the surface of the at least one layer of the substrate. 23. The chip antenna module of claim 10 , wherein an interface between the radiating portion and the first block is perpendicular to the surface of the at least one layer of the substrate.
Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40) · CPC title
Earthing means; Earth screens; Counterpoises · CPC title
mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title
formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} · CPC title
with built-in antennas · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.