Board for stringed instrument, acoustic stringed instrument, and method of manufacturing board for stringed instrument

US10964296B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10964296-B2
Application numberUS-201916502938-A
CountryUS
Kind codeB2
Filing dateJul 3, 2019
Priority dateJan 6, 2017
Publication dateMar 30, 2021
Grant dateMar 30, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A manufacturing method for a board for a stringed instrument that is used as a top plate or a back plate of an acoustic stringed instrument such as a violin, where the board has a purfling, includes forming, for instance, a groove with a depth that is 20% or more and less than 60% of a thickness of the board for a stringed instrument, filling the groove with a resin in which, for instance, colored particles having a diameter of 3 μm or more and less than 70 μm are dispersed and which has a degree of elongation of 20% or more, removing the resin that has flowed out of the groove, and curing the resin.

First claim

Opening claim text (preview).

What is claimed is: 1. A board for a stringed instrument, used for a top plate or a back plate of an acoustic stringed instrument, where the board for the stringed instrument has a purfling, the purfling comprising: a groove formed in the board; and a resin filled in the groove, wherein a depth of the groove is 20% or more and less than 60% of a thickness of the board for the stringed instrument. 2. The board for the stringed instrument according to claim 1 , wherein the resin has a degree of elongation of 20% or more. 3. The board for the stringed instrument according to claim 1 , wherein the resin is a urethane resin or a rubber resin. 4. A board for a stringed instrument, used for a top plate or a back plate of an acoustic stringed instrument, where the board for the stringed instrument has a purfling, the purfling comprising: a groove formed in the board; and a resin filled in the groove, wherein the resin includes colored particles having a diameter of 3 μm or more and less than 70 μm, and wherein the colored particles are dispersed in the resin. 5. A method of manufacturing a board for a stringed instrument that is used for a top plate or a back plate of an acoustic stringed instrument, where the board for the stringed instrument has a purfling, the method comprising: forming a groove in the board; filling the groove with a resin; curing the resin; and providing a layer that covers a surface of the groove after the forming of the groove in the board and before the filling of the groove with the resin. 6. The method according to claim 5 , wherein the resin has a degree of elongation of 20% or more. 7. The method according to claim 5 , further comprising removing the resin that has flowed out of the groove after the filling of the groove with the resin and before the curing of the resin.

Assignees

Inventors

Classifications

  • G10D3/22Primary

    Material for manufacturing stringed musical instruments; Treatment of the material · CPC title

  • by laser radiation · CPC title

  • Producing and filling perforations, e.g. tarsia plates · CPC title

  • G10D1/02Primary

    Bowed or rubbed string instruments, e.g. violins or hurdy-gurdies · CPC title

  • Inlaying with ornamental structures, e.g. niello work, tarsia work · CPC title

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Frequently asked questions

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What does patent US10964296B2 cover?
A manufacturing method for a board for a stringed instrument that is used as a top plate or a back plate of an acoustic stringed instrument such as a violin, where the board has a purfling, includes forming, for instance, a groove with a depth that is 20% or more and less than 60% of a thickness of the board for a stringed instrument, filling the groove with a resin in which, for instance, colo…
Who is the assignee on this patent?
Yamaha Corp
What technology area does this patent fall under?
Primary CPC classification G10D3/22. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 30 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).