Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board
US-2016234934-A1 · Aug 11, 2016 · US
US10960642B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10960642-B2 |
| Application number | US-201815903825-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 23, 2018 |
| Priority date | Nov 26, 2015 |
| Publication date | Mar 30, 2021 |
| Grant date | Mar 30, 2021 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Provided is a solvent-free-adhesive polyisocyanate composition, containing, a polyisocyanate (A) and an aromatic vinyl-maleic anhydride copolymer (B), which is a copolymer of aromatic vinyl and maleic anhydride in which a molar ratio [aromatic vinyl/maleic anhydride] of the raw material monomers of the copolymer is 1.5/1 to 5/1. Further provided is a method for producing the polyisocyanate composition; a solvent-free adhesive containing, the solvent-free-adhesive polyisocyanate composition and a polyol (Y); and a multilayer film obtained by laminating a first base material film, a second base material film, and an adhesive layer between the base material films, in which the adhesive layer is formed of the solvent-free adhesive.
Opening claim text (preview).
What is claimed is: 1. A solvent-free adhesive comprising a solvent-free-adhesive polyisocyanate composition, and a polyol (Y), wherein the solvent-free-adhesive polyisocyanate composition comprises a polyisocyanate (A) and an aromatic vinyl-maleic anhydride copolymer (B), the polyisocyanate (A) is a reaction product of a polyol component and a polyisocyanate comprising one or more selected from the group consisting of 4,4′-diphenylmethane diisocyanate, 2,4′-diphenylmethane diisocyanate, toluene diisocyanate, m-xylene diisocyanate, carbodiimide-modified 4,4′-methylenebisphenyl diisocyanate, hexamethylene diisocyanate allophanate, isophorone diisocyanate, hexanemethylene diisocyanurate, and isocyanurate of isophorone diisocyanate, the polyol (Y) is a polyester polyol, the copolymer is of an aromatic vinyl and a maleic anhydride, and the copolymer has a molar ratio [aromatic vinyl/maleic anhydride] of raw material monomers of 2/1 to 3/1, the aromatic vinyl-maleic anhydride copolymer (B) is a styrene-maleic anhydride copolymer, and the solvent-free adhesive polyisocyanate composition is essentially free of propylene carbonate. 2. A multilayer film obtained by laminating a first base material film, a second base material film, and an adhesive layer between the base material films, wherein the adhesive layer is formed of the solvent-free adhesive according to claim 1 . 3. The multilayer film according to claim 2 , wherein the base material films each comprise an aluminum, silica, or alumina layer, or are each a metal film. 4. A package obtained by forming a bag from a multilayer film obtained by laminating a first plastic film, a second plastic film, and an adhesive layer between the plastic films, wherein the adhesive layer is formed of the solvent-free adhesive according to claim 1 . 5. The package according to claim 4 , wherein the first plastic film and the second plastic film each comprise an aluminum, silica, or alumina layer, or are each a metal film. 6. A method for producing a solvent-free adhesive, the solvent-free adhesive comprising a solvent-free-adhesive polyisocyanate composition and a polyol (Y), the method comprising: preparing a solvent-free-adhesive polyisocyanate composition comprising a polyisocyanate (A) and an aromatic vinyl-maleic anhydride copolymer (B); and mixing the solvent-free-adhesive polyisocyanate composition with the polyol (Y) component, wherein the polyisocyanate (A) is a reaction product of a polyol component and a polyisocyanate comprising one or more selected from the group consisting of 4,4′-diphenylmethane diisocyanate, 2,4′-diphenylmethane diisocyanate, toluene diisocyanate, m-xylene diisocyanate, carbodiimide-modified 4,4′-methylenebisphenyl diisocyanate, hexamethylene diisocyanate allophanate, isophorone diisocyanate, hexanemethylene diisocyanurate, and isocyanurate of isophorone diisocyanate, the polyol (Y) is a polyester polyol, the copolymer is of an aromatic vinyl and a maleic anhydride, and the copolymer has a molar ratio [aromatic vinyl/maleic anhydride] of raw material monomers of 2/1 to 3/1, the aromatic vinyl-maleic anhydride copolymer (B) is a styrene-maleic anhydride copolymer, and the solvent-free adhesive polyisocyanate composition is essentially free of propylene carbonate.
containing two or more cycloaliphatic rings · CPC title
using interposed adhesives or interposed materials with bonding properties · CPC title
Polymers of compounds having carbon-to-carbon double bonds · CPC title
Homopolymers or copolymers of hydrocarbons · CPC title
comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.