Methods and apparatuses for universal interface between parts in transport structures

Patent metadata

Field	Value
Publication number	US-10960611-B2
Application number	US-201715697396-A
Country	US
Kind code	B2
Filing date	Sep 6, 2017
Priority date	Sep 6, 2017
Publication date	Mar 30, 2021
Grant date	Mar 30, 2021

Abstract

Techniques for providing universal interfaces between parts of a transport structure are disclosed. In one aspect of the disclosure, an apparatus for joining first and second parts of a transport structure includes an additively manufactured body having first and second surfaces. The first surface may connect to a first part such as, for example, a panel. The second surface may include a fitting for mating with a complementary fitting on a second part.

First claim

What is claimed is:

1. An apparatus for joining parts of a transport structure, comprising:
an additively manufactured interface structure configured to be co-molded with a first part of the transport structure, wherein the interface structure includes,
a uniform first surface configured to be connected to a uniform surface of the first part of the transport structure during the co-molding, and
a second surface that comprises a female fitting configured to be mated with a complementary male fitting disposed on a second part of the transport structure that is configured to be received by the female fitting of the interface structure.

2. The apparatus of claim 1 , wherein the uniform first surface is shaped to conform to the uniform surface of the first part.

3. The apparatus of claim 1 , wherein the first part comprises a panel.

4. The apparatus of claim 1 , wherein the second part comprises a node.

5. The apparatus of claim 1 , wherein the uniform first surface is arranged substantially opposite the second surface.

6. The apparatus of claim 1 , wherein the uniform first surface comprises a porous material.

7. The apparatus of claim 1 , wherein the female fitting comprises a ball receptacle or a socket for a ball receptacle.

8. The apparatus of claim 1 , wherein the female fitting comprises a mounting plate or a receptacle for a mounting plate.

9. The apparatus of claim 1 , wherein the female fitting comprises a co-printed floating nut.

10. The apparatus of claim 1 , wherein the female fitting comprises one or more flex legs.

11. The apparatus of claim 1 , wherein the female fitting comprises one of a three-way location or a four-way location.

12. An additively manufactured node for a transport structure, comprising:
a joint member configured to provide at least uniform one structural connection; and
an extended structure coupled to the joint member and comprising a female fitting for connecting to a complementary fitting arranged on a part.

13. The node of claim 12 , wherein the extended structure comprises at least one member coupled to the joint member.

14. The node of claim 13 , wherein the member comprises a protrusion configured to support the fitting.

15. The node of claim 13 , wherein the member comprises a recessed section configured to support the fitting.

16. The node of claim 12 , wherein the female fitting comprises a threaded fastener.

17. The node of claim 16 , wherein the threaded fastener comprises a protrusion for receiving a rod coupled to the part.

18. The node of claim 12 , wherein the part comprises a panel.

19. The node of claim 18 , wherein the panel comprises a vehicle hood.

20. The node of claim 12 , wherein the female fitting comprises one of a ball receptacle or a socket for a ball receptacle.

21. The node of claim 12 , wherein the female fitting comprises one of a mounting plate or a receptacle for a mounting plate.

22. The node of claim 12 , wherein the female fitting comprises a co-printed floating nut.

Assignees

• Divergent Tech Inc

Inventors

• Gunner Jon Paul

Classifications

• B29C65/565 Primary

  involving interference fits, e.g. force-fits or press-fits (B29C65/66 takes precedence) · CPC title

• B22F10/80

  Data acquisition or data processing · CPC title

• B22F12/52

  Hoppers · CPC title

• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• B29C70/72 Primary

  Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components {(B29C70/742 takes precedence)} · CPC title