Molding system for applying a uniform clamping pressure onto a substrate

Patent metadata

Field	Value
Publication number	US-10960583-B2
Application number	US-201615213576-A
Country	US
Kind code	B2
Filing date	Jul 19, 2016
Priority date	Jul 19, 2016
Publication date	Mar 30, 2021
Grant date	Mar 30, 2021

Abstract

A molding system for encapsulating electronic devices mounted on a substrate, the molding system comprising a first mold chase with a first mold chase surface and a second mold chase with a second mold chase surface opposite to the first mold chase surface, the first and second mold chase surfaces being operative to clamp onto the substrate and to apply a clamping pressure thereto. The molding system further comprises a first sensor located at a first position for determining a first relative distance between the substrate and a mold chase facing the substrate at the first position, and a second sensor located at a second position for determining a second relative distance between the substrate and a mold chase facing the substrate at the second position. The molding system also comprises a first actuator located adjacent to the first position and a second actuator located adjacent to the second position, wherein the first and second actuators are operative to adjust the first relative distance with respect to the second relative distance for applying a uniform clamping pressure onto the substrate.

First claim

The invention claimed is:

1. A molding system for encapsulating electronic devices mounted on a substrate, the molding system comprising:
a first mold chase;
a clamping member having a first clamping surface which is adjacent to and surrounding the first mold chase, the clamping member being forced by the substrate to resiliently move with respect to the first mold chase upon contact with the substrate;
a second mold chase with a second mold chase surface opposite to the first clamping surface, the first clamping surface and second mold chase surface being operative to clamp onto the substrate and to apply a clamping pressure thereto;
a first sensor located at a first position which determines a first relative distance between the first sensor and the first clamping surface facing the substrate at the first position when the first clamping surface is exerting a force onto the substrate after the first clamping surface adjacent to the first position has been resiliently moved by the substrate with respect to the first mold chase;
a second sensor located at a second position which determines a second relative distance between the second sensor and the first clamping surface facing the substrate at the second position when the first clamping surface is exerting a force onto the substrate after the first clamping surface adjacent to the second position has been resiliently moved by the substrate with respect to the first mold chase; and
a first actuator which is located adjacent to the first position, and a second actuator which is located adjacent to the second position,
wherein the first and second actuators are operative to adjust a planarity of the first clamping surface relative to the second mold chase surface by changing the first relative distance with respect to the second relative distance such that the first and second relative distances are substantially the same and the first clamping surface clamping the substrate applies uniform clamping pressure onto the substrate.

2. The molding system as claimed in claim 1 , wherein each of the sensors is operative to detect a distance between a respective position on the clamping member and the sensor.

3. The molding system as claimed in claim 1 , wherein the first and second mold chases are quadrangular in shape, and the molding system comprises:
a total of four sensors, each sensor being located adjacent to a corner of the first clamping surface or the second mold chase surface.

4. The molding system as claimed in claim 2 , wherein the molding system further comprises a total of four actuators, each actuator being located adjacent to a respective sensor.

5. The molding system as claimed in claim 1 , wherein the first and second sensors are resiliently mounted onto a clamping plate that is configured to be movable towards the substrate to compress a molding cavity when the first clamping surface and second mold chase surface clamp onto the substrate.

6. The molding system as claimed in claim 4 , wherein the first and second actuators are coupled to the clamping plate.

7. The molding system as claimed in claim 4 , wherein the clamping plate is coupled to the first mold chase, and the first and second actuators are coupled to the second mold chase.

8. The molding system as claimed in claim 1 , wherein each actuator is operative to move a portion of one mold chase towards or away from a corresponding portion of the other mold chase.

9. The molding system as claimed in claim 1 , wherein each actuator is operative to adjust the first or second relative distance to tilt a first mold chase surface or the second mold chase surface relative to the substrate so that the first and second relative distances are the same, and the surface of the substrate is parallel to the mold chase surface that is facing it.

10. The molding system as claimed in claim 1 , further comprising:
one or more molding cavities in the first and/or second mold chase, and
a plurality of runners connecting the molding cavity to a plurality of mold supply pots.

11. The molding system as claimed in claim 9 , wherein each molding cavity is situated between at least two mold supply pots and a separate runner connects each mold supply pot to the molding cavity.

12. The molding system as claimed in claim 9 , wherein each of the plurality of runners has substantially the same length.

13. The molding system as claimed in claim 10 , wherein the molding cavity is circular in shape, and the plurality of runners is distributed symmetrically on opposite sides of the molding cavity along a circumference thereof.

Assignees

• Asm Tech Singapore Pte Ltd

Inventors

• Ho Shu Chuen
• Cheong Choon Hong
• Ong Chin Guan
• Wu Kai
• Kuah Teng Hock
• Hao Ji Yuan

Classifications

• H10P72/0441 Primary

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• B29C2945/76294

  Inserts · CPC title

• B29C2945/76387

  Mould closing · CPC title

• B29C45/14655

  connected to or mounted on a carrier, e.g. lead frame · CPC title

• B29C45/02

  Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity · CPC title