Method and apparatus for producing flexible OLED device

Patent metadata

Field	Value
Publication number	US-10957881-B2
Application number	US-201716079439-A
Country	US
Kind code	B2
Filing date	Oct 26, 2017
Priority date	Oct 26, 2017
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

According to a flexible OLED device production method of the present disclosure, a multilayer stack (100) is provided which includes a glass base (10), a functional layer region (20) including a TFT layer (20A) and an OLED layer (20B), and a synthetic resin film (30) provided between the glass base (10) and the functional layer region (20) and bound to the glass base (10). In a dry gas atmosphere whose dew point is not more than −50° C., the multilayer stack (100) is separated into a first portion (110) and a second portion (120), and a surface (30s) of the synthetic resin film (30) is exposed to the dry gas atmosphere, the first portion (110) including the functional layer region (20) and the synthetic resin film (30), the second portion (120) including the glass base (10). The first portion (110) is transported from the dry gas atmosphere to a reduced-pressure atmosphere R, and a protection layer (60) is formed on the surface (30s) of the synthetic resin film (30) in the reduced-pressure atmosphere R.

First claim

The invention claimed is:

1. A method for producing a flexible OLED device, comprising:
providing a multilayer stack, the multilayer stack including
a glass base,
a plurality of functional layer regions each including a TFT layer and an OLED layer, and
a synthetic resin film provided between the glass base and the functional layer regions and bound to the glass base; and

separating the multilayer stack into a first portion and a second portion in a dry gas atmosphere whose dew point is not more than −50° C., thereby exposing a surface of the synthetic resin film to the dry gas atmosphere, the first portion including the functional layer regions and the synthetic resin film, the second portion including the glass base; and
transporting the first portion of the multilayer stack from the dry gas atmosphere to a reduced-pressure atmosphere and forming a protection layer on the surface of the synthetic resin film in the reduced-pressure atmosphere,
wherein
the synthetic resin film includes a plurality of flexible substrate regions respectively supporting the plurality of functional layer regions and an intermediate region surrounding the plurality of flexible substrate regions, and
the method further includes, after forming the protection layer on the surface of the synthetic resin film, dividing the intermediate region and respective ones of the plurality of flexible substrate regions of the synthetic resin film from one another.

2. The method of claim 1 , wherein forming the protection layer on the surface of the synthetic resin film in the reduced-pressure atmosphere includes forming a layer of a dielectric and/or electric conductor on the surface of the synthetic resin film by physical vapor deposition.

3. The method of claim 1 , wherein forming the protection layer on the surface of the synthetic resin film in the reduced-pressure atmosphere includes forming a metal layer on the surface of the synthetic resin film by physical vapor deposition.

4. The method of claim 3 , wherein the metal layer is made of aluminum or copper.

5. The method of claim 3 , wherein the metal layer is deposited so as to have a thickness based on a surface roughness of the surface of the synthetic resin film.

6. The method of claim 3 , wherein a thickness of the metal layer is not less than 5 nm and not more than 200 nm.

7. The method of claim 3 , wherein a thickness of the metal layer is more than 200 nm and not more than 1 μm.

8. The method of claim 1 , wherein separating the multilayer stack into the first portion and the second portion includes irradiating an interface between the synthetic resin film and the glass base with laser light.

9. The method of claim 1 , wherein separating the multilayer stack into the first portion and the second portion includes sliding a blade at an interface between the synthetic resin film and the glass base.

10. The method of claim 1 , wherein separating the multilayer stack into the first portion and the second portion includes supplying an ion into the dry gas atmosphere using an ionizer.

11. The method of claim 1 further comprising, after forming the protection layer on the surface of the synthetic resin film in the reduced-pressure atmosphere, mounting an electronic part or an optical part to the first portion of the multilayer stack in an environmental atmosphere.

12. The method of claim 1 further comprising, before exposing a surface of the synthetic resin film to the dry gas atmosphere, adhering a protection sheet to the functional layer regions.

13. A method for producing a flexible OLED device, comprising:
providing a multilayer stack, the multilayer stack including
a glass base,
a plurality of functional layer regions each including a TFT layer and an OLED layer, and
a synthetic resin film provided between the glass base and the functional layer regions and bound to the glass base, the synthetic resin film including a plurality of flexible substrate regions respectively supporting the plurality of functional layer regions and an intermediate region surrounding the plurality of flexible substrate regions;

cutting the synthetic resin film on the glass base, thereby dividing the intermediate region and respective ones of the plurality of flexible substrate regions of the synthetic resin film from one another; and
separating the multilayer stack into a first portion and a second portion in a dry gas atmosphere whose dew point is not more than −50° C., thereby exposing a surface of the synthetic resin film to the dry gas atmosphere, the first portion including the functional layer regions and the synthetic resin film, the second portion including the glass base; and
transporting the first portion of the multilayer stack from the dry gas atmosphere to a reduced-pressure atmosphere and forming a protection layer on the surface of the synthetic resin film in the reduced-pressure atmosphere.

Assignees

• Sakai Display Products Corp

Inventors

• Tanaka Kohichi
• Kishimoto Katsuhiko

Classifications

• H10K71/40

  Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

• H10K59/8794

  Arrangements for heating and cooling · CPC title

• H10K59/873

  Encapsulations · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K71/80 Primary

  using temporary substrates · CPC title