Manufacturing method

Patent metadata

Field	Value
Publication number	US-10957674-B2
Application number	US-201916699805-A
Country	US
Kind code	B2
Filing date	Dec 2, 2019
Priority date	Sep 18, 2015
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

A manufacturing method is provided. The manufacturing method includes the following steps. Firstly, a substrate and a light-emitting component are provided, wherein the light-emitting component is disposed on the substrate. Then, a wavelength conversion layer is provided, wherein the wavelength conversion layer includes a high-density phosphor layer and a low-density phosphor layer. Then, the high-density phosphor layer is adhered to the light-emitting component by an adhesive. Then, a reflective layer is formed above the substrate, wherein the reflective layer covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion layer.

First claim

What is claimed is:

1. A manufacturing method of a light-emitting device, comprises:
providing a substrate and a light-emitting component, wherein the light-emitting component is disposed on the substrate;
providing a wavelength conversion layer, wherein the wavelength conversion layer comprises a high-density phosphor layer and a low-density phosphor layer, wherein the high-density phosphor layer has a substantially uniform thickness;
adhering the high-density phosphor layer to the light-emitting component by an adhesive, wherein the high-density phosphor layer is spaced from an upper surface of the light-emitting component by the adhesive; and
forming a reflective layer above the substrate, wherein the reflective layer covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion layer.

2. The manufacturing method according to claim 1 , wherein the step of adhering the high-density phosphor layer to the light-emitting component by the adhesive comprises:
forming the adhesive on the high-density phosphor layer of the wavelength conversion layer; and
disposing the light-emitting component on the adhesive.

3. The manufacturing method according to claim 2 , wherein after the step of disposing the light-emitting component on the adhesive, the manufacturing method further comprises:
inverting the light-emitting component, the wavelength conversion layer and the substrate, such that the wavelength conversion layer faces upwardly.

4. The manufacturing method according to claim 1 , wherein the step of adhering the high-density phosphor layer to the light-emitting component by the adhesive comprises:
forming the adhesive on the light-emitting component; and
disposing the high-density phosphor layer of the wavelength conversion layer on the adhesive.

5. The manufacturing method according to claim 1 , further comprising:
forming a first singulation path passing through the wavelength conversion layer;
wherein after the step of forming the reflective layer above the substrate, the manufacturing method further comprises:
forming a second singulation path passing through the reflective layer and the substrate.

6. The manufacturing method according to claim 1 , further comprises:
forming a first singulation path passing through the wavelength conversion layer and the substrate to form a lateral surface of the substrate;
wherein in the step of forming the reflective layer above the substrate, the reflective layer further covers the lateral surface of the substrate.

7. The manufacturing method according to claim 1 , wherein the light-emitting component comprises a first electrode and a second electrode; in the step of forming the reflective layer above the substrate, the reflective layer further covers a lateral surface of the first electrode and a lateral surface of the second electrode.

8. The manufacturing method according to claim 1 , wherein in the step of adhering the high-density phosphor layer to the light-emitting component by the adhesive, the adhesive comprises a first lateral portion, and the first lateral portion covers a portion of the lateral surface of the light-emitting component; in the step of forming the reflective layer above the substrate, the reflective layer covers another portion of the lateral surface of the light-emitting component.

9. The manufacturing method according to claim 1 , wherein in the step of adhering the high-density phosphor layer to the light-emitting component by the adhesive, the adhesive comprises a first lateral portion, and the first lateral portion covers the lateral surface of the light-emitting component; the manufacturing method further comprises:
forming a first singulation path passing through at least a portion of the first lateral portion.

10. The manufacturing method according to claim 9 , wherein in the step of forming the first singulation path passing through the at least a portion of the first lateral portion, the first singulation path passes through the entire first lateral portion; in the step of forming the reflective layer above the substrate, the reflective layer covers the entire lateral surface of the light-emitting component.

11. The manufacturing method according to claim 1 , wherein in the step of adhering the high-density phosphor layer to the light-emitting component by the adhesive, the adhesive comprises a first lateral portion, the first lateral portion covers the lateral surface of the light-emitting component, and the manufacturing method further comprises:
forming a first singulation path passing through the wavelength conversion layer but not through the first lateral portion.

Assignees

• Genesis Photonics Inc

Inventors

• Hung Cheng-Wei
• Chang Jui-Fu
• Hung Chin-Hua
• Lin Yu-Feng

Classifications

• H10W90/724

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• H10W90/00 Primary

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• H10H20/8506

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• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/0363

  of optical field-shaping means · CPC title