Package-on-package and package connection system comprising the same

Patent metadata

Field	Value
Publication number	US-10957670-B2
Application number	US-201916540715-A
Country	US
Kind code	B2
Filing date	Aug 14, 2019
Priority date	May 21, 2019
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

An electronic component module includes a semiconductor package having a first surface provided as a mounting surface and a second surface opposing the first surface, and including a semiconductor chip, a component package having a first surface facing the second surface of the semiconductor package, and a second surface opposing the first surface of the component package, the component package including a passive component, and a connector disposed on the second surface of the component package and having a connection surface configured to be mechanically coupled to an external device, the connector including a plurality of connection lines arranged on the connection surface.

First claim

What is claimed is:

1. An electronic component module comprising:
a semiconductor package having a first surface provided as a mounting surface and a second surface opposing the first surface, and including a semiconductor chip;
a component package having a first surface facing the second surface of the semiconductor package, and a second surface opposing the first surface of the component package, the component package including a passive component; and
a connector disposed on the second surface of the component package and having a connection surface configured to be mechanically coupled to an external device, the connector including a plurality of connection lines arranged on the connection surface.

2. The electronic component module of claim 1 , wherein the semiconductor package further comprises:
a first connection structure having a first surface and a second surface opposing each other, the second surface of the first connection structure providing the second surface of the semiconductor package, the first connection structure having a first redistribution layer,
a first encapsulant disposed on the first surface of the first connection structure and encapsulating the semiconductor chip; and
a first wiring structure connected to the first redistribution layer and extending to the mounting surface of the semiconductor package,
wherein the semiconductor chip is disposed on the second surface of the first connection structure, and includes a connection pad connected to the first redistribution layer.

3. The electronic component module of claim 2 , wherein the semiconductor package further comprises:
a first frame having a first surface and a second surface opposing each other, the second surface of the first frame being in contact with the first surface of the first connection structure, the first frame having a cavity accommodating the semiconductor chip, and
the first wiring structure penetrating through the first surface and the second surfaces of the first frame.

4. The electronic component module of claim 3 , wherein the cavity has a through-hole penetrating through the first and second surfaces of the first frame.

5. The electronic component module of claim 3 , wherein the cavity is a recess in which the second surface of the first frame is open.

6. The electronic component module of claim 3 , wherein the semiconductor package further comprises:
an additional redistribution layer disposed on the first surface of the first frame and on the first encapsulant, and connected to the first wiring structure on the first surface of the first frame.

7. The electronic component module of claim 3 , wherein the first wiring structure comprises a first metal post penetrating through the first encapsulant.

8. The electronic component module of claim 2 , wherein the semiconductor package further comprises:
an electrical connection metal body disposed on the mounting surface and electrically connected to the first redistribution layer through the first wiring structure.

9. The electronic component module of claim 2 , wherein the component package comprises:
a second connection structure having a first surface facing the second surface of the first connection structure, and a second surface, opposing the first surface of the second connection structure, the second connection structure including a second redistribution layer electrically connected to the first redistribution layer;
the passive component disposed on the second surface of the second connection structure, and connected to the second redistribution layer;
a second encapsulant disposed on the second surface of the second connection structure and encapsulating the passive component; and
a second wiring structure connected to the second redistribution layer and extending to the second surface of the component package, and
the connector is electrically connected to the second wiring structure.

10. The electronic component module of claim 9 , wherein the component package further comprises:
a second frame having a first surface in contact with the second surface of the second connection structure, and a second surface opposing the first surface of the second frame, the second frame including a through-hole penetrating through the first and second surfaces of the second frame and accommodating the passive component, and
the second wiring structure penetrates through the first and second surfaces of the second frame.

11. The electronic component module of claim 9 , wherein the second wiring structure comprises a metal post penetrating through the second encapsulant.

Assignees

• Samsung Electro Mech

Inventors

• Kim Hyung Joon
• Kim Seok Hwan
• Jo Sung Il
• Shim Jung Ho

Classifications

• H10W70/656

  Fan-in layouts · CPC title

• H10W70/655

  Fan-out layouts · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W72/90

  Bond pads, in general · CPC title