Resonant sensor device

Patent metadata

Field	Value
Publication number	US-10955434-B2
Application number	US-201916693485-A
Country	US
Kind code	B2
Filing date	Nov 25, 2019
Priority date	Nov 28, 2018
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

A resonant sensor device includes a base and a detection substrate. The detection substrate includes a movable portion configured to move in a first direction, a supporter includes one or more supporting portions which extend in a direction along an intersecting plane intersecting the first direction, an intermediate fixing portion which is connected to the movable portion via the supporter, a connection portion which connects a mounting portion fixed to the base to the intermediate fixing portion in a second direction that is one direction along the intersecting plane, and a resonator at least partially embedded in the one or more supporting portions. The maximum dimension of the connection portion in a third direction orthogonal to the second direction in the intersecting plane is smaller than a maximum dimension of the supporter in the third direction.

First claim

What is claimed is:

1. A resonant sensor device comprising:
a base; and
a detection substrate supported by being at least partially fixed to the base,
wherein the detection substrate comprises:
a movable portion configured to move in a first direction, and is disposed away from the base in the first direction;
a supporter comprising one or more supporting portions which extend in a direction along an intersecting plane intersecting the first direction, the supporter being disposed away from the base in the first direction;
an intermediate fixing portion which is connected to the movable portion via the supporter, the intermediate fixing portion being disposed away from the base in the first direction;
a connection portion which connects a mounting portion fixed to the base to the intermediate fixing portion in a second direction that is one direction along the intersecting plane, the connection portion being disposed away from the base in the first direction; and
a resonator at least partially embedded in the one or more supporting portions,

wherein a maximum dimension of the connection portion in a third direction orthogonal to the second direction in the intersecting plane is smaller than a maximum dimension of the supporter in the third direction.

2. The resonant sensor device according to claim 1 ,
wherein a thickness dimension of the connection portion in the first direction is larger than a thickness dimension of the one or more supporting portions in the first direction.

3. The resonant sensor device according to claim 1 ,
wherein a thickness dimension of the intermediate fixing portion in the first direction is larger than a thickness dimension of the one or more supporting portions in the first direction.

4. The resonant sensor device according to claim 1 ,
wherein the resonator vibrates in the third direction intersecting the first direction and the second direction.

5. The resonant sensor device according to claim 1 ,
wherein the movable portion, the supporter, the intermediate fixing portion, the connection portion, and the resonator are formed integrally using a silicon material.

6. The resonant sensor device according to claim 5 ,
wherein the resonator is a beam-shaped member formed to extend in a direction in which the one or more supporting portions extend, and the resonator is disposed in a space at least partially formed inside the one or more supporting portions in a state where both ends of the resonator are fixed.

7. The resonant sensor device according to claim 1 ,
wherein the detection substrate comprises a temperature detecting resonator which detects temperature.

8. The resonant sensor device according to claim 7 ,
wherein the temperature detecting resonator is embedded in any one of the movable portion, the intermediate fixing portion, and the connection portion.

9. The resonant sensor device according to claim 1 ,
wherein the base comprises a damping member disposed close to the movable portion, the intermediate fixing portion, and the connection portion with predetermined gaps therebetween.

10. The resonant sensor device according to claim 1 ,
wherein the detection substrate comprises a pad conducted to the outside, and
wherein the base comprises a package having an electrode electrically connected to the pad.

11. The resonant sensor device according to claim 9 ,
wherein the detection substrate comprises a pad conducted to the outside,
wherein the base comprises a package having an electrode electrically connected to the pad, and
wherein the damping member comprises a protruding portion that protrudes to a side opposite to the detection substrate further than other portions of the damping member, and the protruding portion is fixed to the package.

12. The resonant sensor device according to claim 11 ,
wherein an annular groove portion is formed in the damping member to surround the protruding portion.

13. The resonant sensor device according to claim 1 ,
wherein the resonator is vacuum-sealed.

14. The resonant sensor device according to claim 12 ,
wherein the resonator is vacuum-sealed, and
wherein a sealing pressure of the resonator is different from a pressure in the gaps.

15. The resonant sensor device according to claim 1 ,
wherein a part of the resonators arranged in a direction intersecting the second direction is embedded in at least one of the supporting portions.

16. The resonant sensor device according to claim 1 ,
wherein the intermediate fixing portion is formed to surround a periphery of the movable portion in the intersecting plane.

17. The resonant sensor device according to claim 1 , further comprising:
a sealing portion which is joined to the mounting portion, the sealing portion sealing the movable portion, the supporter, the intermediate fixing portion, the connection portion, and the resonator.

18. The resonant sensor device according to claim 1 ,
wherein the movable portion is formed to surround a periphery of the intermediate fixing portion in the intersecting plane.

19. The resonant sensor device according to claim 1 ,
wherein both ends of the one or more supporting portions in which the resonator is embedded are bonded to the movable portion and the intermediate fixing portion, respectively.

20. The resonant sensor device according to claim 5 , wherein impurities having atomic radius smaller than atomic radius of the silicon material are diffused into the resonator, and a tensile stress is applied to the resonator in the second direction.

Assignees

• Yokogawa Electric Corp

Inventors

• Iwai Shigeto
• Noro Makoto

Classifications

• G01P15/097 Primary

  by vibratory elements · CPC title

• G01P2015/0828

  the mass being of the paddle type being suspended at one of its longitudinal ends · CPC title

• G01P15/0975 Primary

  by acoustic surface wave resonators or delay lines · CPC title

• G01P15/10 Primary

  by vibratory strings · CPC title