Substrate holder, plating apparatus, plating method, and electric contact

Patent metadata

Field	Value
Publication number	US-10954603-B2
Application number	US-201815891917-A
Country	US
Kind code	B2
Filing date	Feb 8, 2018
Priority date	Feb 16, 2017
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

A substrate holder includes: a first holding member having a surface configured to come into contact with the substrate; and a second holding member, between which and the first holding member the substrate is put and held. The second holding member includes a removal portion that is disposed along an outer circumference of the substrate and configured to come into contact with the substrate and remove an insulating material on the substrate when the substrate is put between the first holding member and the second holding member, and an electric contact portion that is disposed along the outer circumference of the substrate and configured to come into contact with a region on the substrate in which the removal portion has removed the insulating material when the substrate is put and held between the first holding member and the second holding member.

First claim

What is claimed is:

1. A substrate holder for holding a substrate, comprising:
a first holding member having a surface configured to come into contact with the substrate; and
a second holding member, between which and the first holding member the substrate is put and held,
wherein
the second holding member includes
a removal portion that is disposed along an outer circumference of the substrate when the substrate is put between the first holding member and the second holding member, and configured to come into contact with the substrate and remove an insulating material on the substrate, and
an electric contact portion that is disposed along the outer circumference of the substrate and configured to come into contact with a region on the substrate in which the removal portion has removed the insulating material when the substrate is put and held between the first holding member and the second holding member,

the removal portion is located closer to the surface than the electric contact portion is when the first holding member and the second holding member are disposed facing each other,
the removal portion is positioned closer to a center of the substrate than the electric contact portion or closer to a circumferential edge of the substrate than the electric contact portion,
the second holding member includes an electric contact for allowing a current to flow on the substrate by coming into contact with the substrate,
the electric contact includes the removal portion and the electric contact portion,
the first holding member includes a relay contact configured to feed a current from an external power source to the electric contact,
the electric contact includes a leg that comes into contact with the relay contact when the substrate is put and held between the first holding member and the second holding member, a body extending from the leg, and a tip extending in an inclined manner from the body,
the tip includes the removal portion and the electric contact portion, and
the electric contact portion is a protruding portion configured to protrude from the tip.

2. The substrate holder according to claim 1 , wherein the removal portion is provided closer to a front end side of the tip than the electric contact portion is.

3. The substrate holder according to claim 1 , wherein the electric contact portion is provided closer to a front end side of the tip than the removal portion is.

4. The substrate holder according to claim 1 , wherein
the second holding member includes an electric contact for allowing a current to flow on the substrate by coming into contact with the substrate, and a removal member for removing the insulating material on the substrate,
the electric contact includes the electric contact portion, and
the removal member includes the removal portion.

5. The substrate holder according to claim 1 , wherein the removal portion is configured to be separated from the substrate when the substrate is put and held between the first holding member and the second holding member.

6. The substrate holder according to claim 1 , wherein the removal portion is configured to slide on the substrate when the substrate is put and held between the first holding member and the second holding member, after the removal portion comes into contact with the substrate until the substrate holder holds the substrate.

7. The substrate holder according to claim 1 , wherein
the second holding member includes a plurality of electric contacts for allowing a current to flow on the substrate by coming into contact with the substrate,
each of the electric contacts includes the electric contact portion, and
the plurality of electric contacts are electrically connected to each other.

8. A plating apparatus which performs plating treatment on a substrate by using the substrate holder according to claim 1 .

9. A plating method for plating a substrate held in the substrate holder according to claim 1 , the method comprising the steps of:
putting the substrate between the first holding member and the second holding member to hold the substrate in the substrate holder; and
plating the substrate held in the substrate holder,
wherein
the holding step includes
scraping the insulating material on the substrate by using the removal portion provided in the second holding member, and
bringing the electric contact portion provided in the second holding member and positioned closer to the center of the substrate than the removal portion or closer to the circumferential edge of the substrate than the removal portion into contact with a region on the substrate in which the removal portion has removed the insulating material.

10. An electric contact, configured to come into contact with a substrate in order to allow a current to flow on the substrate, the contact comprising
a leg that is electrically connected to an external power source;
a body extending from the leg; and
a tip extending in an inclined manner from the body, and
the tip includes
a removal portion configured to come into contact with the substrate and remove an insulating material on the substrate, and

an electric contact portion configured to come into contact with a region on the substrate in which the removal portion has removed the insulating material.

11. The electric contact according to claim 10 , wherein the electric contact portion is a protruding portion configured to protrude from the tip.

12. The electric contact according to claim 10 , wherein the removal portion is provided closer to a front end side of the tip than the electric contact portion is.

13. The electric contact according to claim 10 , wherein the electric contact portion is provided closer to the front end side of the tip than the removal portion is.

Assignees

• Ebara Corp

Inventors

• Fujikata Jumpei

Classifications

• H10P14/412

  Deposition of metallic or metal-silicide materials · CPC title

• C25D17/005

  Contacting devices · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title

• C25D17/12

  Shape or form (C25D17/14 takes precedence) · CPC title

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title