Diecut, in particular for permanently closing holes

Patent metadata

Field	Value
Publication number	US-10946629-B2
Application number	US-201916414171-A
Country	US
Kind code	B2
Filing date	May 16, 2019
Priority date	May 18, 2018
Publication date	Mar 16, 2021
Grant date	Mar 16, 2021

Abstract

Diecuts are configured for permanent closing of holes and have a carrier comprising an assembly of at least two polymeric films. An upper film of the at least two polymeric films has a basis weight of at least 1.0 kg/m 2 and a lower film of the at least two polymeric films consisting of at least two layers, wherein a first layer is in the form of a polymeric film and faces the upper film, and a second layer is in the form of a functional layer with a side of the lower film, facing away from the upper film, bears an applied adhesive composition.

First claim

We claim:

1. A diecut configured for permanent closing of at least one hole, the diecut comprising:
a carrier comprising an assembly of at least two polymeric films,
wherein
the at least two polymeric films comprise an upper film and a lower film, the upper film having a basis weight of at least 1.0 kg/m 2 and the lower film consisting of at least two layers,
the at least two layers of the lower film have a first layer in the form of a polymeric film facing the upper film and a second layer in the form of a functional layer,
a side of the lower film facing away from the upper film has an applied adhesive composition
the functional layer has a first barrier effect with respect to first migratable substances that are diffusible into the applied adhesive composition and a second barrier effect with respect to second migratable substances that are diffusible into the upper film,
the first migratable substances comprise one or more oils, one or more lubricants, and one or more plasticizers,
the second migratable substances comprise one or more tackifier resins, and
a melting point of a polymer of the functional layer is above a melting point of a polymer of the upper film by 20° C.

2. The diecut according to claim 1 , wherein the upper film of the at least two polymeric films and the polymeric film and the functional layer of the lower film are each implemented over the full area and are free from holes or vacancies.

3. The diecut according to claim 1 , wherein the upper film has a basis weight of between 1.0 and 6 kg/m 2 .

4. The diecut according to claim 3 , wherein the upper film has a basis weight of between 1.5 and 3.9 kg/m 2 .

5. The diecut according to claim 4 , wherein the upper film has a basis weight of between 1.5 and 2.5 kg/m 2 .

6. The diecut according to claim 1 , wherein the upper film is an elastomer-modified bitumen film.

7. The diecut according to claim 1 , wherein the upper film is a polyolefin film.

8. The diecut according to claim 7 , wherein the upper film is a polyethylene and ethylene-vinyl acetate film.

9. The diecut according to claim 8 , wherein the polyethylene and ethylene-vinyl acetate film is mineral-filled.

10. The diecut according to claim 1 , wherein the polymeric film of the lower film consists of a type of polymer used in the upper film.

11. The diecut according to claim 1 , wherein the polymeric film of the lower film consists of polyolefin.

12. The diecut according to claim 11 , wherein the polymeric film of the lower film consists of polyethylene.

13. The diecut according to claim 1 , wherein the melting point of the polymer of functional layer is above the melting point of the polymer of the upper film by 50° C.

14. The diecut according to claim 1 , wherein the polymer of the functional layer comprises one or more selected from the group consisting of polyethylene terephthalate, polyamide, polyurethane, polyoxymethylene, polyvinyl chloride, polyethylene napthalate, ethylene-vinyl alcohol, polyvinylidene chloride, polyvinylidene fluoride, polyacrylonitrile, polycarbonate, polyethersulfone, polyimide, polyarylene sulfide, polyarylene oxide, and mixtures thereof.

15. The diecut according to claim 14 , wherein the polymeric film of the lower film consists of polyethylene and polymer of the functional layer consists of polyamide.

16. The diecut according to claim 1 , wherein the thickness of the upper film is between 400 and 3500 μm and the thickness of the lower film is between 25 and 200 μm.

17. The diecut according to claim 1 , wherein the applied adhesive composition is an acrylate-based self-adhesive composition.

18. A vehicle body comprising:
at least one hole to be closed; and
the diecut according to claim 1 applied over and closing the at least one hole.

19. The diecut according to claim 18 , wherein the diecut is applied concentrically over the at least one hole.

20. The diecut according to claim 19 , wherein contours of the diecut correspond to the contour of the at least one hole such that a margin of overlap is between 1 and 20 mm.

Assignees

• Tesa Se

Inventors

• Meyer Katja
• Seibert Matthias

Classifications

• B32B15/08 Primary

  of synthetic resin · CPC title

• B32B27/32

  comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} · CPC title

• B32B2605/00

  Vehicles · CPC title

• B32B27/36

  comprising polyesters · CPC title

• B32B27/20

  using fillers, pigments, thixotroping agents · CPC title