Optical unit, fixing mechanism for optical unit, and semiconductor laser module

Patent metadata

Field	Value
Publication number	US-10944236-B2
Application number	US-201715622897-A
Country	US
Kind code	B2
Filing date	Jun 14, 2017
Priority date	Dec 25, 2014
Publication date	Mar 9, 2021
Grant date	Mar 9, 2021

Abstract

A circuit conductor is provided on a base. A semiconductor laser is connected to the circuit conductor. Cutout parts on which the circuit conductor is not formed are provided at, for example, the vicinity of the four corners of the base, and a hole is provided at each of the said portions. The holes penetrate the base. Fixing members are inserted through the holes. The fixing members are, for example, male threads. Since the head part of the fixing members is located in the cutout part, the fixing members and the circuit conductor are not in contact with each other. A platform has holes formed at portions corresponding to the holes in the optical unit and female threads formed on the inner surface. The fixing members and the platform are therefore joined. As a result, the optical unit is fixed to the platform.

First claim

What is claimed is:

1. An optical unit comprising:
a thermally conductive base, rectangular in shape, having a pair of short sides and a pair of long sides longer than the short sides;
a circuit conductor that is provided on the base; and
a semiconductor laser that is connected to the circuit conductor and is disposed on the base, the semiconductor laser having a rectangular shape and having a pair of short sides and a pair of long sides longer than the short sides, wherein:
four through holes, configured to receive fixing members, are formed adjacent to respective four corners of the semiconductor laser, each through hole disposed between one of the long sides of the semiconductor laser and the nearest long side of the base, and each through hole disposed, along a short side of the base, closer to the semiconductor laser than the center of the distance between the nearest long side of the semiconductor laser and the nearest long side of the base, four cutouts are formed in the circuit conductor, the circuit conductor comprises a first portion in contact with a first terminal of the semiconductor laser and a second portion in contact with a second terminal of the semiconductor laser,
two of the four cutouts are formed in the first portion and the others of the four cutouts are formed in the second portion,
the through holes are formed at the positions of the cutouts on the base, and
loosening prevention members are disposed in order to prevent the fixing members inserted into the through holes from loosening.

2. The optical unit according to claim 1 , wherein:
a lens that collimates light emitted from the semiconductor laser is joined to the optical unit.

3. The optical unit according to claim 1 , wherein: the loosening prevention members are metal layers exposed around the holes and the metal layers are insulated from the circuit conductor on the base.

4. A semiconductor laser module comprising:
the optical unit according to claim 1 ;
an optical fiber to which laser beams emitted from the semiconductor laser are coupled; and
a package that accommodates the optical unit,
wherein: the optical unit is directly or indirectly fixed to the package with the fixing members.

5. The semiconductor laser module according to claim 4 , further comprising:
a plurality of the optical units that are accommodated in the package;
a plurality of reflective mirrors that reflect laser beams emitted from each of the semiconductor lasers respectively; and
a condensing lens that condenses the laser beams reflected by the plurality of the reflective mirrors,
wherein: each of the plurality of the optical units can be individually attached or detached.

6. The semiconductor laser module according to claim 4 , wherein:
a thermo-conductive sheet is disposed on a bottom face of the base and the optical unit is in contact with a connection target via the thermo-conductive sheet.

7. The semiconductor laser module according to claim 4 , wherein:
the optical fiber is a multi-mode optical fiber.

8. The optical unit according to claim 1 , wherein the loosening prevention members are solders or adhesive agents applied onto the periphery of the fixing members.

9. The optical unit according to claim 1 , wherein an insulating layer is formed between the circuit conductor and the base.

10. A fixing mechanism for an optical unit, comprising:
a thermally conductive base of the optical unit, a circuit conductor provided on the base, and a semiconductor laser connected to the circuit conductor and disposed on the base,
wherein the thermally conductive base is rectangular in shape and has a pair of short sides and a pair of long sides longer than the short sides,
wherein the semiconductor laser is rectangular in shape and has a pair of short sides and a pair of long sides longer than the short sides,
wherein four through holes, configured to receive fixing members, are formed adjacent to respective four corners of the semiconductor laser, each through hole disposed between one of the long sides of the semiconductor laser and the nearest long side of the base, and each through hole disposed, along a short side of the base, closer to the semiconductor laser than the center of the distance between the nearest long side of the semiconductor laser and the nearest long side of the base, four cutouts are formed in the circuit conductor, the circuit conductor comprises a first portion in contact with a first terminal of the semiconductor laser and a second portion in contact with a second terminal of the semiconductor laser,
wherein two of the four cutouts are formed in the first portion and the others of the four cutouts are formed in the second portion,
wherein the through holes are formed at the positions of the cutouts on the base,
wherein loosening prevention members are disposed in order to prevent the fixing members that are inserted into the through holes from loosening, and
wherein the optical unit is fixed to a platform, a package, or a cooling device with the fixing members.

Assignees

• Furukawa Electric Co Ltd

Inventors

• Taniguchi Hidehiro
• Yoshida Junji

Classifications

• H01S5/4075

  Beam steering · CPC title

• H01S5/02325

  Mechanically integrated components on mount members or optical micro-benches · CPC title

• H01S5/4012

  Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms · CPC title

• H01S5/024 Primary

  Arrangements for thermal management · CPC title

• H01S5/0683

  by monitoring the optical output parameters · CPC title