Dielectric waveguide having a dielectric waveguide body and a dielectric waveguide end with specified densities and method of producing

US10944146B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10944146-B2
Application numberUS-201716338229-A
CountryUS
Kind codeB2
Filing dateSep 29, 2017
Priority dateSep 30, 2016
Publication dateMar 9, 2021
Grant dateMar 9, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The invention provides a dielectric waveguide for transmitting millimeter waves or sub-millimeter waves. The dielectric waveguide is easily processed and connected even when having a small diameter, and can provide a connection structure exhibiting low transmission and return losses of high frequency signals. The dielectric waveguide includes a dielectric waveguide body and a dielectric waveguide end having a lower permittivity than the dielectric waveguide body. The dielectric waveguide body and the dielectric waveguide end are seamlessly and monolithically formed from the same material.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for producing a dielectric waveguide, comprising: a step of providing a resin line formed from polytetrafluoroethylene; a step of heating the resin line at 326° C. to 345° C. for 10 seconds to 2 hours; a step of heating an end of the resin line; and a step of stretching the heated end in a longitudinal direction to provide a dielectric waveguide. 2. The production method according to claim 1 , wherein the step of heating is performed at a temperature of 100° C. or higher and 450° C. or lower. 3. A dielectric waveguide comprising: a dielectric waveguide body; and a dielectric waveguide end having a lower permittivity than the dielectric waveguide body, the dielectric waveguide body and the dielectric waveguide end being seamlessly and monolithically formed from a same material, wherein the dielectric waveguide body has a density of 1.90 g/cm 3 or higher and 2.40 g/cm 3 or lower, and the dielectric waveguide end has a density that is 90% or less of the density of the dielectric waveguide body. 4. The dielectric waveguide according to claim 3 , wherein the dielectric waveguide body has a permittivity of 2.05 or higher and 2.30 or lower, and the dielectric waveguide end has a permittivity that is (i) lower than the permittivity of the dielectric waveguide body and that is (ii) 2.20 or lower, where both (i) and (ii) are satisfied. 5. The dielectric waveguide according to claim 3 , wherein the dielectric waveguide body has a hardness of 95 or higher which is a spring hardness determined pursuant to JIS K6253-3. 6. The dielectric waveguide according to claim 3 , wherein the dielectric waveguide body has a loss tangent at 2.45 GHz of 1.20×10 −4 or lower. 7. The dielectric waveguide according to claim 3 , wherein the dielectric waveguide is obtainable by stretching an end of a resin line in a longitudinal direction. 8. The dielectric waveguide according to claim 3 , wherein the dielectric waveguide is formed from polytetrafluoroethylene. 9. A connection structure comprising: a hollow metallic tube; and the dielectric waveguide according to claim 3 , the dielectric waveguide end being inserted in the hollow metallic tube and thereby the hollow metallic tube and the dielectric waveguide being connected to each other. 10. The connection structure according to claim 9 , wherein the hollow metallic tube has a cavity filled with gas, and the gas has a lower permittivity than the dielectric waveguide end. 11. A dielectric waveguide comprising: a dielectric waveguide body; and a dielectric waveguide end having a lower density than the dielectric waveguide body, the dielectric waveguide body and the dielectric waveguide end being seamlessly and monolithically formed from a same material, wherein the dielectric waveguide body has a density of 1.90 g/cm 3 or higher and 2.40 g/cm 3 or lower, and the dielectric waveguide end has a density that is 90% or less of the density of the dielectric waveguide body.

Assignees

Inventors

Classifications

  • H01P3/16Primary

    Dielectric waveguides, i.e. without a longitudinal conductor · CPC title

  • Manufacturing dielectric waveguides · CPC title

  • Transitions to a dielectric waveguide · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10944146B2 cover?
The invention provides a dielectric waveguide for transmitting millimeter waves or sub-millimeter waves. The dielectric waveguide is easily processed and connected even when having a small diameter, and can provide a connection structure exhibiting low transmission and return losses of high frequency signals. The dielectric waveguide includes a dielectric waveguide body and a dielectric wavegui…
Who is the assignee on this patent?
Daikin Ind Ltd, Aist
What technology area does this patent fall under?
Primary CPC classification H01P3/16. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 09 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).