Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement

Patent metadata

Field	Value
Publication number	US-10943740-B2
Application number	US-201916447639-A
Country	US
Kind code	B2
Filing date	Jun 20, 2019
Priority date	Feb 27, 2015
Publication date	Mar 9, 2021
Grant date	Mar 9, 2021

Abstract

An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

First claim

The invention claimed is:

1. Ceramic component,
comprising several sintered bodies, each sintered body comprising a stack of ceramic layers and electrode layers, wherein the ceramic layers and electrode layers are sintered together, wherein the sintered bodies are located adjacent to each other with a gap located between side faces of the sintered bodies facing each other, wherein the gap extends along the entire area of the side faces of the sintered bodies, and
two separate electric connection contacts that are not electrically connected to each other and that are attached to opposite sides of the sintered bodies, wherein the ceramic component is separable into smaller components,
wherein each of the connection contacts comprises several partial contacts, wherein each of the partial contacts contacts one of the sintered bodies, wherein the partial contacts are connected by thin links to each other, and wherein the thin links are breakable for separating the ceramic component into smaller components.

2. The ceramic component of claim 1 ,
wherein the connection contacts are formed from a metal plate.

3. The ceramic component of claim 1 ,
wherein each of the connection contacts comprises a connection area for attachment on a wiring board.

4. The ceramic component of claim 3 ,
wherein the connection area is bent inwardly or outwardly.

5. The ceramic component of claim 1 ,
wherein each of the connection contacts comprises a first layer comprising a first material and a second layer arranged thereon, the second layer comprising a second material, wherein the first material has an electric conductivity of at least 40 m/Ωmm 2 and the second material has a thermal expansion coefficient of at most 5 ppm/K.

6. The ceramic component of claim 5 ,
wherein the proportion of a thickness of the second layer to a thickness of the first layer is between 1:1 and 5:1.

7. The ceramic component of claim 5 ,
wherein each of the connection contacts comprises at least one further layer for improving the connection to a sintering material.

8. The ceramic component of claim 1 ,
wherein each of the connection contacts comprises at least one layer comprising copper and at least one layer comprising Invar.

9. The ceramic component of claim 1 ,
wherein each of the connection contacts is attached by a sintering material on the sintered bodies.

10. The ceramic component of claim 1 ,
wherein each of the partial contacts extends from a first edge of one of the sintered bodies along a side face of the sintered body but does not extend up to a second edge of the respective sintered body, the second edge being opposite to the first edge.

11. The ceramic component of claim 1 ,
wherein each of the connection contacts comprises a connection area for attachment on a carrier, wherein the thin links of each of the connection contacts are located near the connection area.

12. Method of producing a ceramic component,
the method comprising the steps of:
providing a plurality of sintered bodies, each sintered body comprising a stack of ceramic layers and electrode layers, wherein the ceramic layers and electrode layers are sintered together, wherein the sintered bodies are located adjacent to each other with a gap located between side faces of the sintered bodies facing each other, wherein the gap extends along the entire area of the side faces of the sintered bodies,
providing two separate connection contacts that are not electrically connected to each other, wherein each of the connection contacts includes several partial contacts, wherein the partial contacts are connected by thin links to each other;
placing the sintered bodies between the two connection contacts thereby forming a component arrangement;
separating the component arrangement between two of the sintered bodies, wherein the thin link of the connection contact between the sintered bodies is broken.

13. The method of claim 12 ,
wherein each of the connection contacts is formed by stamping out of a metal plate.

14. The method of claim 12 ,
wherein each of the connection contacts comprises a first layer comprising a first material and a second layer comprising a second material, wherein for producing the connection contacts the first material is rolled onto the second material.

15. The method of claim 12 ,
wherein each of the partial contacts extends from a first edge of one of the sintered bodies along a side face of the respective sintered body but does not extend up to a second edge of the respective sintered body, the second edge being opposite to the first edge.

16. A ceramic component,
comprising several sintered bodies, each sintered body comprising a stack of ceramic layers and electrode layers, wherein the ceramic layers and electrode layers are sintered together,
and two separate electric connection contacts that are not electrically connected to each other and that are attached to opposite sides of the sintered bodies, wherein the ceramic component is separable into smaller components,
wherein each of the connection contacts comprises several partial contacts, wherein each of the partial contacts contacts one of the sintered bodies, wherein the partial contacts are connected by thin links to each other, and wherein the thin links are breakable for separating the ceramic component into smaller components,
wherein each of the partial contacts extends from a first edge of one of the sintered bodies along a side face of the sintered body but does not extend up to a second edge of the respective sintered body, the second edge being opposite to the first edge.

Assignees

• Epcos Ag

Inventors

• Koini Markus
• Auer Christoph
• Konrad Jürgen
• Rinner Franz
• Puff Markus
• Stadlober Monika
• Wippel Thomas

Classifications

• H01G4/38 Primary

  Multiple capacitors, i.e. structural combinations of fixed capacitors · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title