Substrate assembly and method of bonding substrates

Patent metadata

Field	Value
Publication number	US-10940472-B2
Application number	US-201816176348-A
Country	US
Kind code	B2
Filing date	Oct 31, 2018
Priority date	Nov 1, 2017
Publication date	Mar 9, 2021
Grant date	Mar 9, 2021

Abstract

A substrate assembly and a method of bonding substrates are disclosed. The method includes steps of: providing two substrate; subjecting a connecting surface of each of the substrates to surface-modifying treatment to form surface-modified region respectively on each of the connecting surfaces; contacting the substrates in such a manner that the substrates are connected with each other through a physical interaction between the surface-modified regions; and laser irradiating and melting a portion of each of the connecting surfaces to form a respective bonding region, and solidifying the melted bonding regions of the substrates to bond the substrates together.

First claim

What is claimed is:

1. A method of bonding substrates, comprising steps of:
providing a first substrate and a second substrate;
subjecting a first connecting surface of the first substrate and a second connecting surface of the second substrate to a surface-modifying treatment using an energy source, so as to form a first surface-modified region on the first connecting surface and a second surface-modified region on the second connecting surface;
contacting the first and second substrates in such a manner that the first and second substrates are connected with each other through a physical interaction between the first surface-modified region and the second surface-modified region; and
irradiating a portion of the first connecting surface of the first substrate and a portion of the second connecting surface of the second substrate that are close to, but are spaced apart from peripheral regions of the first and second connecting surfaces using a laser, such that the portions of the first and second connecting surfaces are melted to form first and second bonding regions, respectively; and
cutting the peripheral regions of the first and second connecting surfaces that are not melt-bonded from the first and second substrates, respectively, using the laser, and then solidifying the melted first and second bonding regions so as to bond the first and second substrates together.

2. The method as claimed in claim 1 , wherein:
in the providing step, one of the first and second substrates is formed with a channel;
after the first and second substrates are bonded together, the channel is covered by the other one of the first and second substrates to define a microfluidic unit disposed between the first and second substrates.

3. The method as claimed in claim 2 , wherein the first and second bonding regions surround the microfluidic unit.

4. The method as claimed in claim 1 , wherein the energy source is an ultraviolet light.

5. The method as claimed in claim 1 , wherein the energy source is plasma.

6. The method as claimed in claim 1 , wherein each of the first and second substrates is made of a hydrophobic polymer material.

7. A substrate assembly, comprising:
a first substrate including a first bonding region and a first surface-modified region; and
a second substrate including a second bonding region and a second surface-modified region,
wherein said first and second substrates are bonded together through a physical interaction of said first surface-modified region and said second surface-modified region and melt-bonding between said first bonding region and said second bonding region, and
wherein said first and second bonding regions are respectively at laser-cut peripheries of said first and second substrates, and respectively surround and enclose said first and second surface-modified regions.

8. The substrate assembly as claimed in claim 7 , further comprising a microfluidic unit disposed between said first and second substrates.

9. The substrate assembly as claimed in claim 8 , wherein said first and second bonding regions surround said microfluidic unit.

10. The substrate assembly as claimed in claim 7 , wherein said first substrate and said second substrate are made of a hydrophobic polymer material.

11. The substrate assembly as claimed in claim 7 , wherein said first surface-modified region of said first substrate has a plurality of hydrophilic functional groups.

12. The substrate assembly as claimed in claim 10 , wherein said second surface-modified region of said second substrate has a plurality of hydrophilic functional groups, the physical interaction between said first surface-modified region and said second surface-modified region is a hydrophilic-hydrophilic interaction.

Assignees

• Taiwan Green Point Entpr Co

Inventors

• Yang Sung-Yi
• Wang Pao-Chuan

Classifications

• B29C66/73175

  Hydrophobicity · CPC title

• B29C65/8215

  Tensile tests · CPC title

• B29C65/8207

  by mechanical methods · CPC title

• B29C65/1658

  scanning once, e.g. contour laser welding · CPC title

• B29C66/028

  Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation (B29C65/14 takes precedence; non-mechanical surface treatment of plastics in general B29C59/08 - B29C59/16) · CPC title