Humidifier and layered heating element

US10940285B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10940285-B2
Application numberUS-202016743156-A
CountryUS
Kind codeB2
Filing dateJan 15, 2020
Priority dateJun 16, 2011
Publication dateMar 9, 2021
Grant dateMar 9, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A heating apparatus includes a heating element which converts electrical power to heat energy, a heatable element having a first surface and a second surface, and a dielectric laminate layer between the heating element and the first surface of the heatable element, wherein the dielectric laminate layer is thermally conductive to transfer heat energy from the heating element to the heatable element, and wherein the second surface of the heatable element is configured heat a liquid in a container.

First claim

Opening claim text (preview).

What is claimed is: 1. A humidifier for humidifying a pressurized flow of breathable gas for respiratory therapy for a patient, comprising: a gas inlet configured to receive gas from a flow generator; a tub adapted to hold a liquid, the tub including sidewalls and a bottom wall joined to the sidewalls; a gas outlet adapted to be connectable to a tube to provide humidified gas to a patient interface; a heating apparatus including: a hot plate to contact the liquid; a heating element having a first side and a second side, the heating element including a copper or alloy or Positive Temperature Coefficient (PTC) layer with heating tracks to in use provide heat to heat the liquid in the tub; a first thermally conductive laminate layer provided on the first side of the heating element and in thermal contact with the hot plate; and a protective layer provided on the second side of the heating element, wherein the bottom wall is overmolded onto the heating apparatus such that the heating apparatus is embedded in the bottom wall. 2. The humidifier according to claim 1 , wherein a substrate is provided to an end portion of the heating element to form a connector section. 3. The humidifier according to claim 2 , wherein the end portion of the heating element forms an electrical contact to receive electrical power. 4. The humidifier according to claim 1 , wherein the heating element is a metal printed circuit board (PCB). 5. The humidifier according to claim 1 , wherein portions of the copper or alloy or PTC layer of the heating apparatus are etched to form the heating tracks of the heating element. 6. The humidifier according to claim 1 , wherein the heating element includes conductive metal foils. 7. The humidifier according to claim 1 , wherein the heating element is arranged in a serpentine pattern. 8. The humidifier according to claim 1 , wherein at least a portion of the heating tracks has a width in a range of about 0.3 mm to 2 mm. 9. The humidifier according to claim 1 , wherein the heating tracks are associated with contact pads for electrical leads and at least one electrical component. 10. The humidifier according to claim 1 , wherein in use the temperature of the heating apparatus is determined by determining a resistance of the heating tracks. 11. The humidifier according to claim 1 , wherein the sidewalls are overmolded onto the heating apparatus. 12. The humidifier according to claim 11 , wherein the protective layer includes a solder mask. 13. The humidifier according to claim 1 , wherein the first thermally conductive laminate layer is a first dielectric laminate layer. 14. The humidifier according to claim 13 , wherein the bottom wall is overmolded over peripheral edges of the first dielectric laminate layer, the heating element and the protective layer. 15. The humidifier according to claim 13 , wherein the first dielectric laminate layer comprises at least one of a ceramic, a polymer, a polymeric mixture, polytetrafluoroethylene, polyimides, boron nitride, alumina, beryllium oxide, aluminum nitride, boron nitride, epoxy composite, and reinforced fiberglass. 16. The humidifier according to claim 15 , wherein the first dielectric laminate layer is constructed from a flexible polyimide film. 17. The humidifier according to claim 13 , wherein the first dielectric laminate layer has a thickness in a range of 20 um to 160 um. 18. The humidifier according to claim 13 , wherein the first dielectric laminate layer has a dielectric breakdown voltage above 2 kV. 19. The humidifier according to claim 1 , wherein the heating apparatus is provided to a humidifier chamber adapted to receive the tub. 20. The humidifier according to claim 19 , wherein the heating apparatus is integral with the tub.

Assignees

Inventors

Classifications

  • Mixing gases with liquids · CPC title

  • by introducing gases into liquid media, e.g. for producing aerated liquids · CPC title

  • heating conductor embedded in insulating material · CPC title

  • by Joule effect, i.e. electric resistance · CPC title

  • Control means therefor · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10940285B2 cover?
A heating apparatus includes a heating element which converts electrical power to heat energy, a heatable element having a first surface and a second surface, and a dielectric laminate layer between the heating element and the first surface of the heatable element, wherein the dielectric laminate layer is thermally conductive to transfer heat energy from the heating element to the heatable elem…
Who is the assignee on this patent?
ResMed Pty Ltd
What technology area does this patent fall under?
Primary CPC classification A61M16/16. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Mar 09 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).