Electret condenser microphone and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10939192-B2
Application number	US-201616326338-A
Country	US
Kind code	B2
Filing date	Aug 18, 2016
Priority date	Aug 18, 2016
Publication date	Mar 2, 2021
Grant date	Mar 2, 2021

Abstract

An electret condenser microphone is provided. The electret condenser microphone comprises a diaphragm, a backplate with a metal layer on the side facing the diaphragm and an amplifier on the other side, the input of the amplifier electrically connecting the metal layer, a spacer separating the diaphragm and the backplate PWB; and a metal sleeve accommodating the diaphragm, the backplate and the spacer.

First claim

The invention claimed is:

1. An electret condenser microphone, comprising:
a diaphragm,
a backplate with a metal layer on a side facing the diaphragm and an amplifier on positioned on another side of the backplate, an input of the amplifier electrically connecting the metal layer,
a spacer positioned outwardly of the backplate and separating the diaphragm and the backplate; and
a metal sleeve accommodating the diaphragm, the backplate, and the spacer,
wherein a gap is formed between the spacer and the metal layer.

2. The electret condenser microphone according to claim 1 , wherein the backplate is formed of a printed wire board (PWB) material.

3. The electret condenser microphone according to claim 1 , wherein the spacer between the backplate and the diaphragm is formed of an annular insulating material.

4. The electret condenser microphone according to claim 3 , wherein the annular insulating material is mylar plastic.

5. The electret condenser microphone according to claim 1 , wherein the amplifier is a junction field effect transistor (JFET) and the input is a gate terminal of the JFET.

6. The electret condenser microphone according to claim 1 further comprising a connecting layer and a bottom layer, the connecting layer electrically connecting terminals of the amplifier to pads on a bottom layer.

7. The electret condenser microphone according to claim 6 , wherein the connecting layer is formed of an annular PWB with conductive connectors protruding through a body of the connecting layer.

8. The electret condenser microphone according to claim 6 , wherein the bottom layer comprises a printed wire board (PWB) substrate, conductive connectors embedded in the PWB substrate, traces on the PWB substrate, and pads on the PWB substrate.

9. The electret condenser microphone according to claim 1 further comprising an anti-dust cover within the metal sleeve at an opening of the electret condenser microphone.

10. A method of manufacturing an electret condenser microphone, comprising:
providing a diaphragm;
providing a backplate with a metal layer a surface thereof being orientated towards the diaphragm and an amplifier positioned on another surface, an input of the amplifier being electrically connected to the metal layer;
providing an insulating spacer that is positioned outwardly of the backplate;
bonding the diaphragm, the insulating spacer, and the backplate together; and
inserting the diaphragm, the insulating spacer, and the backplate into a metal sleeve,
wherein a gap is formed between the insulating spacer and the metal layer.

11. The method according to claim 10 , wherein the backplate is formed of a printed wire board (PWB) material.

12. The method according to claim 10 , wherein the insulating spacer between the backplate and diaphragm is formed of an annular insulating material.

13. The method according to claim 12 , wherein the insulating material is mylar plastic.

14. The method according to claim 10 , wherein the amplifier is a junction field effect transistor and the input is a gate terminal of the JFET.

15. A method of manufacturing an electret condenser microphone, comprising:
providing a diaphragm;
providing a backplate with a metal layer on a surface thereof being orientated towards the diaphragm and an amplifier positioned on another surface, an input of the amplifier being electrically connected to the metal layer;
providing a bottom layer with conductors that extend through a substrate of the bottom layer and traces and pads on its surface;
providing an insulating spacer that is positioned outwardly of the backplate;
forming a gap between the insulating spacer and the metal layer;
providing a connecting layer with conductive connectors protruding through a body of the connecting layer;
bonding the diaphragm, the backplate, the bottom layer, the insulating spacer and the connecting layer together; and
inserting the diaphragm, the backplate, the bottom layer, the insulating spacer and the connecting layer into a metal sleeve.

16. The method according to claim 15 , wherein the backplate is formed of a printed wire board (PWB) material.

17. The method according to claim 15 , wherein the insulating spacer is formed of annular insulating material.

18. The method according to claim 17 , wherein the annular insulating material is mylar plastic.

19. The method according to claim 15 , wherein the amplifier is a junction field effect transistor (JFET) and the input is a gate terminal of the JFET.

20. The method according to claim 15 , wherein the bottom layer comprises a printed wire board (PWB) substrate.

21. The electret condenser microphone according to claim 1 , wherein the spacer and the metal layer are positioned on an insulating substrate and the gap separates the spacer from the metal layer on the insulating substrate.

Assignees

• Michel Alan
• Gao Sean
• Lv Guangyue
• Harman Int Ind

Inventors

• Michel Alan
• Gao Sean
• Lv Guangyue

Classifications

• H04R31/006

  Interconnection of transducer parts (of diaphragm and outer suspension by moulding H04R31/003) · CPC title

• H04R19/016

  for microphones · CPC title

• H04R1/04 Primary

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title

• H04R7/22

  Clamping rim of diaphragm or cone against seating · CPC title