Assembly of a semi-conductor lamp from separately produced components
US-10125960-B2 · Nov 13, 2018 · US
US10935228B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10935228-B2 |
| Application number | US-202016839779-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 3, 2020 |
| Priority date | Apr 3, 2019 |
| Publication date | Mar 2, 2021 |
| Grant date | Mar 2, 2021 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A lighting device (e.g., a controllable light-emitting diode illumination device) may have a light-generation module that may be assembled and calibrated prior to the light-generation module being installed in a finished good. The light-generation module may include an emitter module having at least one emitter mounted to a substrate and configured to emit light. The light-generation module may include a first printed circuit board on which the emitter module may be mounted and a second printed circuit board on which those circuits that are essential for powering the emitter module may be mounted. The light-generation module may include a heat sink located between the first printed circuit board and the second printed circuit board. The emitter module may be thermally-coupled to the heat sink through the substrate and the first printed circuit board.
Opening claim text (preview).
What is claimed is: 1. A lighting device comprising: an emitter mounted to a substrate and configured to emit light; a first printed circuit board to which the substrate is mounted; a second printed circuit board arranged in a plane that is parallel to a plane of the first printed circuit board, the second printed circuit board comprising a drive circuit for the emitter, a control circuit for controlling the drive circuit, and a wireless communication circuit configured to communicate wireless control signals; and a heat sink located between the first printed circuit board and the second printed circuit board, the heat sink defining a front surface and at least one sidewall extending from a periphery of the front surface, wherein the emitter is thermally-coupled to the front surface of the heat sink through the substrate and the first printed circuit board, and wherein the heat sink is configured to radiate heat generated by the emitter radially out through the at least one sidewall. 2. The lighting device of claim 1 , further comprising: an antenna electrically coupled to the wireless communication circuit on the second printed circuit board, the antenna extending through a tunnel in the heat sink and an opening in the first printed circuit board. 3. The lighting device of claim 2 , further comprising: an insulator configured to be received in a first recess in a rear surface of the heat sink, the insulator configured to electrically isolate the drive circuit, the control circuit, and the wireless communication circuit from the heat sink. 4. The lighting device of claim 3 , wherein the insulator comprises a second recess in which the second printed circuit board is located. 5. The lighting device of claim 4 , wherein the heat sink comprises a coupling portion configured to be capacitively coupled to a ground plane of the second printed circuit board when the second printed circuit board is located in the second recess of the insulator. 6. The lighting device of claim 5 , wherein the insulator comprises a void through which the coupling portion of the heat sink extends towards the second printed circuit board. 7. The lighting device of claim 6 , further comprising an insulating material located between the coupling portion of the heat sink and the second printed circuit board. 8. The lighting device of claim 5 , wherein the heat sink operates as a counterpoise of the antenna. 9. The lighting device of claim 3 , wherein the first printed circuit board comprises a first connector configured to be connected to a second connector of the second printed circuit board for electrically coupling the drive circuit to the emitter. 10. The lighting device of claim 9 , wherein at least one of the first and second connectors extend through respective openings in the heat sink and the insulator. 11. The lighting device of claim 3 , wherein the insulator comprises an extension having a bore, the extension configured to extend into the tunnel in the heat sink when the insulator is received in the first recess of the heat sink, the antenna configured to extend through the bore in the extension of the insulator. 12. The lighting device of claim 11 , further comprising: a lens through which the light from the emitter is emitted; and a reflector configured to reflect the light emitted by the emitter towards the lens, wherein the lens, the reflector, and the first printed circuit board define an optical cavity, and wherein the antenna extends through the bore in the extension of the insulator and the tunnel in the heat sink, such that the antenna extends into the optical cavity. 13. The lighting device of claim 12 , further comprising: a shield located over a top surface of the first printed circuit board in the optical cavity, the shield configured to be electrically coupled to the heat sink to reduce noise from the second printed circuit board from coupling to the reflector of the lighting device. 14. The lighting device of claim 13 , wherein a top side of the shield is electrically coupled to the heat sink, and a bottom side of the shield is not electrically conductive such that the first printed circuit board is electrically isolated from the shield. 15. The lighting device of claim 12 , wherein the antenna is straight and is configured to abut an inner surface of the lens of the lighting device. 16. The lighting device of claim 12 , wherein the antenna is bent so as to avoid contacting an inner surface of the lens of the lighting device. 17. The lighting device of claim 3 , wherein the antenna is electrically isolated from the control circuit on the second printed circuit board. 18. The lighting device of claim 1 , further comprising: a housing defining a cavity in which the first and second printed circuit boards and the heat sink are located, the heat sink thermally coupled to the housing, wherein the housing operates as an additional heat sink. 19. The lighting device of claim 18 , wherein the at least one sidewall of the heat sink is thermally coupled to the housing. 20. The lighting device of claim 19 , wherein the front surface of the heat sink defines a planar front surface having a circular periphery. 21. The lighting device of claim 19 , wherein the heat sink is smaller in volume than the housing, and the heat sink is made from a material that is more thermally conductive than a material of the housing. 22. The lighting device of claim 1 , further comprising: a spacer located between the first printed circuit board and the front surface of the heat sink, the spacer defining a void in which a thermally-conductive substance is located. 23. The lighting device of claim 22 , wherein the spacer is integral to the heat sink. 24. The lighting device of claim 1 , wherein the heat sink comprises a recess in the front surface, the recess filled with a thermally-conductive substance. 25. The lighting device of claim 1 , wherein a bottom surface of the substrate comprises: a plurality of electrical pads grouped together in sets of multiple pads, the electrical pads coupled to corresponding electrical pads on a top side of the first printed circuit board; and one or more heat sink pads, the heat sink pads comprising a central pad and four corner pads located in respective corners of the substrate. 26. The lighting device of claim 25 , wherein at least one of the sets of electrical pads on the bottom surface of the substrate is surrounded by an electrostatic discharge trace that is connected to a ground plane of the first printed circuit board. 27. The lighting device of claim 25 , wherein at least one of the sets of electrical pads on the top side of the first printed circuit board is surrounded by an electrostatic discharge trace that is connected to a ground plane of the first printed circuit board. 28. The lighting device of claim 25 , wherein the corner pads of the heat sink pads are connected to the central pad by respective arms. 29. A lighting device comprising: an emitter mounted to a substrate and configured to emit light; a first printed circuit board to which the substrate is mounted; a second printed circuit board comprising a drive circuit for the emitter, a control circuit for controlling the drive circuit, and a wireless communication circuit configured to communicate wireless control signals; a heat sink located betwe
via wireless transmission · CPC title
comprising an assembly of point-like light sources · CPC title
in direct thermal and mechanical contact of each other to form a single system · CPC title
with parabolic curvature · CPC title
activated by means of a sensor, e.g. motion or photodetectors · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.