Light module and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10935197-B2
Application number	US-202016827684-A
Country	US
Kind code	B2
Filing date	Mar 23, 2020
Priority date	Apr 4, 2019
Publication date	Mar 2, 2021
Grant date	Mar 2, 2021

Abstract

A light module and a manufacturing method are provided. The light module comprises a first and a second substrate separated from a prefabricated substrate along a closed curve, the first substrate is detachable connected and/or fixed with the second substrate; light emitting elements mounted on one of the first and second substrate; and a drive element mounted on the other one of the first and second substrate. The method comprises: determining a closed curve on a prefabricated substrate to separate the prefabricated substrate into a first region and a second region; providing light emitting elements and first electronic element on first surface of the prefabricated substrate; providing second electronic element on second surface of the prefabricated substrate; separating a first and second substrate from the prefabricated substrate along the closed curve; and assembling and connecting the second substrate with the first substrate at a separation opening.

First claim

What is claimed is:

1. A method of manufacturing a light module, comprising:
providing a closed curve on a prefabricated substrate to separate the prefabricated substrate into a first region outside the closed curve and a second region inside the closed curve;
providing light emitting elements and a first electronic element on a first surface of the prefabricated substrate, wherein the light emitting elements are disposed on one of the first region and the second region, and the first electronic element is disposed on the other one of the first region and the second region;
providing a second electronic element on a second surface of the prefabricated substrate opposite to the first surface, the second electronic element located on a region corresponding to the region on which the first electronic element is disposed;
separating the first region and the second region of the prefabricated substrate along the closed curve to form a first substrate and a second substrate correspondingly; and
assembling the second substrate with the first substrate at a separation opening.

2. The method according to claim 1 , further comprising:
assembling and connecting the second substrate with the first substrate after flipping the second substrate by 180 degrees.

3. The method according to claim 1 , further comprising:
moving the second substrate in a direction perpendicular to a surface of the first substrate, such that the first substrate is located on a first plane, and the second substrate is located on a second plane, the first plane and the second plane being located on different planes, wherein the substrate provided with the second electronic element is below the substrate provided with the light emitting elements.

4. The method according to claim 3 , wherein a height difference between the first substrate and the second substrate is a height of the tallest second electronic element.

5. The method according to claim 1 , wherein the first substrate is provided with a first uneven part surrounding the separation opening and along the closed curve, and the second substrate is provided with a second uneven part along the closed curve.

6. The method according to claim 5 , further comprising:
rotating the second substrate relative to the first substrate, such that the first uneven part at least partially overlaps the second uneven part to form an overlapped region; and
connecting the first substrate and the second substrate in the overlapped region.

7. The method according to claim 6 , further comprising:
setting holes on the first uneven part and the second uneven part of the overlapped region respectively, and the first substrate and the second substrate are connected to each other via the holes and fastener.

8. The method according to claim 1 , further comprising:
connecting the first substrate and the second substrate respectively to a housing via fastener, wherein the housing is configured to accommodate the light module.

9. The method according to claim 1 , wherein the light emitting elements and the first electronic element are SMT (Surface Mounted Technology) type elements, and the second electronic element is DIP (dual in-line package) type element.

Assignees

• Delta Electronics Shanghai Co

Inventors

• Chai Zhaowei
• Chung Chun-Jen
• Fu Xiaoping
• Zhang Xinghua

Classifications

• F21V23/005 Primary

  the substrate is supporting also the light source · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• F21S8/04 Primary

  intended only for mounting on a ceiling or the like overhead structures (F21S8/02 takes precedence; {details of ceiling bases F21V21/03}) · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F21Y2105/18

  annular; polygonal other than square or rectangular, e.g. for spotlights or for generating an axially symmetrical light beam · CPC title