Compositions and methods using same for carbon doped silicon containing films
US-10145008-B2 · Dec 4, 2018 · US
US10934635B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10934635-B2 |
| Application number | US-201615740340-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 1, 2016 |
| Priority date | Jul 3, 2015 |
| Publication date | Mar 2, 2021 |
| Grant date | Mar 2, 2021 |
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There is provided a method of fabricating a trapped vacancy in a crystal lattice of a target comprising: positioning the target in a laser system, the target containing vacancy trapping elements within the crystal lattice; modifying the crystal lattice within the target by using a laser to generate a lattice vacancy; and annealing the target to cause the lattice vacancy to migrate and be captured by a vacancy trapping element to form the trapped vacancy in the crystal lattice.
Opening claim text (preview).
The invention claimed is: 1. A method of fabricating a trapped vacancy in a crystal lattice of a target comprising: positioning the target in a laser system comprising a laser, the target containing vacancy trapping elements within the crystal lattice; using a pulsed laser beam produced the laser to create a lattice vacancy in the crystal lattice within the target; and annealing the target to cause the lattice vacancy to migrate and be captured by a vacancy trapping element to form the trapped vacancy in the crystal lattice, wherein using the pulsed laser beam produced by the laser to create the lattice vacancy comprises: determining a position for the lattice vacancy within the crystal lattice; focusing the pulsed laser beam at the determined position within the crystal lattice; selecting a pulse energy of the pulsed laser beam that causes nonlinear multi-photon absorption by the crystal lattice and creates the lattice vacancy; and operating the laser to provide the pulse energy within an energy range to create the lattice vacancy within the crystal lattice only within a localized volume of width less than 1 micrometer. 2. The method of claim 1 wherein the laser is operated at a central wavelength such that an absorbed photon has energy that is less than a bandgap of the target. 3. The method of claim 1 wherein the pulse energy of the pulsed laser beam entering the target is in a range between 5 nJ and 15 nJ. 4. The method of claim 1 wherein the vacancy trapping elements are present at a concentration of less than 1 part per million. 5. The method of claim 1 wherein the vacancy trapping element is nitrogen; or wherein the vacancy trapping element is silicon; or wherein the vacancy trapping element is germanium. 6. The method of claim 1 wherein the vacancy trapping elements are deposited during fabrication of the target. 7. The method of claim 1 wherein the trapped vacancy forms part of a colour centre. 8. The method of claim 1 further comprising modifying a wavefront of the pulsed laser beam to cancel aberrations in the pulsed laser beam caused by a refractive index of the target. 9. The method of claim 1 wherein the method includes the step of selecting the pulse energy of the laser relative to a modification threshold of the target in order to reduce an effective beam area for modifying the crystal lattice. 10. The method of claim 1 wherein a modified region of the crystal lattice has a size of less than 200 nm. 11. The method of claim 1 wherein the target is diamond. 12. The method of claim 1 wherein the target is one of: silicon carbide or silicon. 13. The method of claim 1 wherein the annealing comprises heating the target to between 800-1400° C. for a period of 15 minutes to 24 hours. 14. The method of claim 1 wherein the method further comprises forming a two-dimensional or three-dimensional array or pattern of trapped vacancies in the crystal lattice of the target. 15. The method of claim 1 wherein the method is a production step in fabrication of a sensor. 16. The method of claim 1 wherein the method is a production step in fabrication of a quantum component. 17. The method of claim 1 wherein a pulse duration is shorter than a characteristic timescale for thermal diffusion in the target. 18. The method of claim 1 wherein the laser is a picosecond or femtosecond laser. 19. The method of claim 1 , wherein using the pulsed laser beam produced the laser to create the lattice vacancy in the crystal lattice within the target causes fourth-order or higher nonlinear multi-photon absorption in the crystal lattice. 20. The method of claim 1 wherein the method further comprises controlling laser operation so that the target is free of damage in a region around the trapped vacancy following annealing. 21. The method of claim 1 wherein using the pulsed laser beam produced the laser to create the lattice vacancy in the crystal lattice within the target comprises modifying the crystal lattice selectively at a depth of greater than 5 microns from a surface of the target. 22. The method of claim 1 wherein using the pulsed laser beam produced the laser to create the lattice vacancy in the crystal lattice within the target comprises modifying the lattice so as to engineer a strain field about at least one specific trapped vacancy in order to modify its properties. 23. The method of claim 1 wherein a target surface is not affected or modified. 24. The method of claim 1 wherein optical properties of the target remain unchanged except where the trapped vacancy is fabricated. 25. The method of claim 1 wherein annealing the target causes healing of lattice vacancies which are not trapped. 26. A method of fabricating a trapped vacancy in a crystal lattice of a target comprising: positioning the target in a laser system comprising a laser, the target containing vacancy trapping elements within the crystal lattice; using a pulsed laser beam produced the laser to create a lattice vacancy in the crystal lattice within the target; and annealing the target to cause the lattice vacancy to migrate and be captured by a vacancy trapping element to form the trapped vacancy in the crystal lattice, wherein using the pulsed laser beam produced the laser to create a lattice vacancy in the crystal lattice within the target comprises: determining a position for the lattice vacancy within the crystal lattice; focusing the pulsed laser beam at the determined position within the crystal lattice; selecting a pulse energy of the pulsed laser beam that causes nonlinear multi-photon absorption by the crystal lattice and creates the lattice vacancy; and operating the laser to provide the pulse energy within an energy range to create the lattice vacancy within the crystal lattice only within a localized volume of width less than 1 micrometer, wherein the laser is operated at a central wavelength such that an absorbed photon has an energy that is less than a bandgap of the target.
by using coherent radiation, e.g. using a laser · CPC title
Diamond · CPC title
Heat treatment (C30B33/04, C30B33/06 take precedence) · CPC title
After-treatment, e.g. purification, irradiation, separation or recovery · CPC title
using electric or magnetic fields or particle radiation · CPC title
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