Prepreg tape and use thereof

US10934406B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10934406-B2
Application numberUS-201816004475-A
CountryUS
Kind codeB2
Filing dateJun 11, 2018
Priority dateDec 16, 2015
Publication dateMar 2, 2021
Grant dateMar 2, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A prepreg tape in which reinforcing fiber bundles are impregnated with a thermosetting resin composition, wherein the prepreg tape has a tack value measured at 23° C. at a plunger push pressure of 90 kPa of 5-40 kPa, a tack value measured at 45° C. and a plunger push pressure of 150 kPa of 35-100 kPa, and a drape value at 23° C. of 10-40°, and includes unidirectional fibers arranged along the direction of length of the prepreg tape.

First claim

Opening claim text (preview).

The invention claimed is: 1. A prepreg tape comprising a reinforcing fiber bundle impregnated with a thermosetting resin composition, wherein a tack value measured at 23° C. and a plunger pushing pressure of 90 kPa is from 5 to 40 kPa, a tack value measured at 45° C. and a plunger pushing pressure of 150 kPa is from 35 to 100 kPa, a drape value at 23° C. is from 10° to 40°, the prepreg tape includes unidirectional fibers arranged along a length direction of the prepreg tape, and the thermosetting resin composition has a viscosity of from 1.0×10 4 to 1.0×10 5 Pa·s at 30° C. and a viscosity of from 1.0×10 2 to 6.0×10 2 Pa·s at 45° C. 2. The prepreg tape according to claim 1 , wherein the thermosetting resin composition has a curing completion time of from 2.0 to 15.0 minutes at 140° C. when the curing completion time is measured using a resin hardening instrument. 3. The prepreg tape according to claim 1 , wherein the thermosetting resin composition has a minimum viscosity of from 0.3 to 20 Pa·s when the viscosity is measured at a rate of temperature rise of 2.0° C./min and a temperature range having the minimum viscosity of from 100° C. to 120° C. 4. The prepreg tape according to claim 1 , wherein a content rate of the thermosetting resin composition with respect to a mass of the prepreg tape is from 20% to 45% by mass. 5. The prepreg tape according to claim 1 , wherein an average width of the prepreg tape is from 2 to 30 mm. 6. The prepreg tape according to claim 1 , wherein a number of filaments in the reinforcing fiber bundle is from 1,000 to 60,000. 7. The prepreg tape according to claim 1 , wherein the thermosetting resin composition contains (A) an epoxy resin and (B) a curing agent. 8. The prepreg tape according to claim 7 , wherein the thermosetting resin composition further contains (C) a curing accelerator. 9. The prepreg tape according to claim 7 , wherein (A) the epoxy resin contains an epoxy resin which is solid at room temperature and an epoxy resin which is liquid at room temperature. 10. The prepreg tape according to claim 9 , wherein the epoxy resin which is solid at room temperature contains a preliminary reaction product of a bisphenol A epoxy resin with 4,4′-diaminodiphenyl sulfone. 11. The prepreg tape according to claim 9 , wherein the epoxy resin which is liquid at room temperature contains a phenol novolak epoxy resin or a bisphenol A epoxy resin. 12. The prepreg tape according to claim 8 , wherein a content of (B) the curing agent is from 3 to 10 parts by mass and a content of (C) the curing accelerator is from 0.5 to 10 parts by mass with respect to 100 parts by mass of (A) the epoxy resin in the thermosetting resin composition. 13. The prepreg tape according to claim 8 , wherein (B) the curing agent is at least one kind of compound selected from the group consisting of an amine curing agent and an amine adduct curing agent, and (C) the curing accelerator is at least one kind of compound selected from the group consisting of a urea derivative and an imidazole derivative. 14. The prepreg tape according to claim 8 , wherein (B) the curing agent is at least one compound selected from the group consisting of diaminodiphenylmethane sulfone, diaminodiphenyl sulfone, aliphatic amine, dicyandiamide, tetramethylguanidine, a thiourea adduct amine, and isomers and modified products thereof, and (C) the curing accelerator is at least one compound selected from the group consisting of a urea derivative and an imidazole derivative. 15. A fiber-reinforced composite material comprising the cured prepreg tape according to claim 1 . 16. A laminate comprising the laminated prepreg tape according to claim 1 . 17. An automatic lamination molding method, the method comprising laminating the prepreg tape according to claim 1 after imparting adhesive property to the prepreg tape through heating. 18. A method of manufacturing a fiber-reinforced composite material, the method comprising heating and pressing one obtained by laminating the prepreg tape according to claim 1 in a mold.

Assignees

Inventors

Classifications

  • B29C70/386Primary

    Automated tape laying [ATL] · CPC title

  • characterised by the additives used in the prepolymer mixture · CPC title

  • C08J5/245Primary

    using natural fibres · CPC title

  • using carbon fibres · CPC title

  • characterised by the properties of the layers · CPC title

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What does patent US10934406B2 cover?
A prepreg tape in which reinforcing fiber bundles are impregnated with a thermosetting resin composition, wherein the prepreg tape has a tack value measured at 23° C. at a plunger push pressure of 90 kPa of 5-40 kPa, a tack value measured at 45° C. and a plunger push pressure of 150 kPa of 35-100 kPa, and a drape value at 23° C. of 10-40°, and includes unidirectional fibers arranged along the d…
Who is the assignee on this patent?
Mitsubishi Chem Corp
What technology area does this patent fall under?
Primary CPC classification B29C70/386. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 02 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).