Substrate treatment apparatus and substrate treatment method

Patent metadata

Field	Value
Publication number	US-10933448-B2
Application number	US-201715821287-A
Country	US
Kind code	B2
Filing date	Nov 22, 2017
Priority date	Dec 20, 2016
Publication date	Mar 2, 2021
Grant date	Mar 2, 2021

Abstract

A substrate treatment apparatus is provided with a plurality of substrate treatment parts and a liquid treatment system. The substrate treatment part has a substrate retaining part, which retains a substrate, and a discharge nozzle, which discharges a treatment liquid to the substrate retained by the substrate retaining part. The liquid treatment system has: a storage tank that stores in the treatment liquid; a supply piping part that is connected to the storage tank and forms a supply passage through which the treatment liquid to be supplied to the discharge nozzle passes; a return piping part that is connected to the storage tank and forms a return passage that returns the treatment liquid passed through the supply piping part to the storage tank; and a gas supply part that supplies a nitrogen gas different from oxygen dissolved in the treatment liquid into the return passage of the return piping part.

First claim

What is claimed is:

1. A substrate treatment apparatus for supplying a treatment liquid to a substrate and treating said substrate, the substrate treatment apparatus comprising:
a substrate retaining part that retains said substrate;
a discharge nozzle that discharges said treatment liquid to said substrate retained by said substrate retaining part;
a storage tank that stores in said treatment liquid;
a supply piping part that is connected to said storage tank and forms a supply passage through which said treatment liquid to be supplied to said discharge nozzle passes;
a return piping part that is connected to said storage tank and forms a return passage through which said treatment liquid passed through said supply piping part is returned to said storage tank; and
a gas supply part that supplies an additive gas different from a removal target gas dissolved in said treatment liquid into said return passage of said return piping part, wherein
a distal end of a gas supply pipe of said gas supply part forms a jet opening that jets said additive gas in said return passage of said return piping part;
said jet opening is configured to discharge said additive gas in a first direction, which is opposite to a second direction in which said treatment liquid flows; and
all of said additive gas is discharged from said jet opening in said first direction.

2. The substrate treatment apparatus of claim 1 , wherein
said return piping part is coupled to said supply piping part to form a circulation piping that returns said treatment liquid sent out from said storage tank to said storage tank by said supply piping part and said return piping part.

3. The substrate treatment apparatus of claim 1 , wherein,
in said storage tank, a suction opening of said supply piping part is disposed at a position lower than a release opening of said return piping part.

4. The substrate treatment apparatus of claim 1 , wherein,
in said storage tank, a release opening of said return piping part is opened toward a direction intersecting with a vertical direction.

5. The substrate treatment apparatus of claim 1 , further comprising, in said storage tank, a partition member that is disposed between a suction opening of said supply piping part and a release opening of said return piping part and has an upper end disposed at a position higher than at least one of said suction opening or said release opening.

6. The substrate treatment apparatus of claim 1 , further comprising an in-line mixer that is disposed in said return piping part between a part connected to said gas supply part and said storage tank and agitates said treatment liquid in said return passage.

7. The substrate treatment apparatus of claim 1 , further comprising
a storage-tank gas supply part that supplies said additive gas into said treatment liquid in said storage tank; wherein
said storage-tank gas supply part has a gas jetting part that is connected to said storage tank and jets said additive gas into said treatment liquid stored in said storage tank.

8. The substrate treatment apparatus of claim 1 , wherein
said removal target gas is oxygen, and said additive gas is an inert gas with respect to said substrate.

9. The substrate treatment apparatus of claim 1 , wherein
at least one of: a pump that sends said treatment liquid, a temperature adjustment mechanism that adjusts a temperature of said treatment liquid, a filter that filtrates said treatment liquid, and a flowmeter that measures a flow rate of said treatment liquid is interposed in said supply piping part.

10. The substrate treatment apparatus of claim 1 , further comprising a flow-rate control part that controls a flow rate per unit time of said treatment liquid that passes through said return piping part.

11. The substrate treatment apparatus of claim 1 , further comprising a gas-supplied-amount control part that controls a supplied amount per unit time of said additive gas supplied by said gas supply part.

12. The substrate treatment apparatus according to claim 1 , wherein
said return piping part includes a portion that extends in a vertical direction, and said gas supply part is connected to said portion of said return piping part.

13. A substrate treatment apparatus for supplying a treatment liquid to a substrate and treating said substrate, the substrate treatment apparatus comprising:
a substrate retaining part that retains said substrate;
a discharge nozzle that discharges said treatment liquid to said substrate retained by said substrate retaining part;
a storage tank that stores in said treatment liquid;
a supply piping part that is connected to said storage tank and forms a supply passage through which said treatment liquid to be supplied to said discharge nozzle passes;
a return piping part that is connected to said storage tank and forms a return passage through which said treatment liquid passed through said supply piping part is returned to said storage tank; and
a gas supply part that supplies an additive gas different from a removal target gas dissolved in said treatment liquid into said return passage of said return piping part, wherein
a distal end of a gas supply pipe of said gas supply part forms a jet opening that jets said additive gas in said return passage of said return piping part;
said jet opening is configured to discharge said additive gas in a first direction, which is opposite to a second direction in which said treatment liquid flows; and
all of said additive gas is discharged from said jet opening in said first direction,
in said storage tank, a release opening of said return piping part is opened toward a third direction intersecting with a vertical direction, different from a fourth direction of said release opening to a suction opening of said supply piping part, such that said treatment liquid is released from said release opening such that it is directed away from said suction opening.

Assignees

• Screen Holdings Co Ltd

Inventors

• Yasuda Shuichi
• Iwao Michinori
• Kikumoto Noriyuki
• Sasaki Mitsutoshi

Classifications

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0404

  for general liquid treatment, e.g. etching followed by cleaning · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title

• B01F23/23121

  having injection means, e.g. nozzles with circumferential outlet · CPC title