Resin with plating layer and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10930988-B2
Application number	US-202016776033-A
Country	US
Kind code	B2
Filing date	Jan 29, 2020
Priority date	Jul 4, 2017
Publication date	Feb 23, 2021
Grant date	Feb 23, 2021

Abstract

A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 μm and 10 μm inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.

First claim

What is claimed is:

1. A resin with a plating layer comprising:
a resin; and
a plating layer configured to cover the resin;
wherein when the resin is made of polyethylene, a crystallinity Xc expressed in following Formula 1 is 0.744 or greater,
wherein when the resin is made of perfluoroethylene-propene copolymer, a crystallinity Xc expressed in the following Formula 1 is 0.47 or less, and

X
c

=

I
c

I
c

+

I
a

[

Formula
⁢

⁢
1

]

wherein Ic in the Formula 1 is X-ray diffraction intensity of a crystalline component, and Ia is X-ray diffraction intensity of a noncrystalline component.

2. The resin with the plating layer according to claim 1 ,
wherein a contact angle on the outer peripheral surface of the resin is 95° or less.

3. The resin with the plating layer according to claim 1 ,
wherein an absolute value of adhesion-wetting surface free energy on the outer peripheral surface of the resin is 66 mJ/m 2 or greater.

4. The resin with the plating layer according to claim 1 ,
wherein the outer peripheral surface of the resin comprises a concavity, and
wherein the concavity comprises, at its bottom in a depth direction, a space that is wider than an opening of the concavity.

5. A resin with a plating layer comprising:
a resin; and
a plating layer configured to cover the resin;
wherein the resin is made of polyethylene,
wherein the polyethylene has crystal structures of the triclinic crystal system or of the orthorhombic system, or has a coexisting state of at least one of these crystal structures,
wherein the polyethylene has preferential crystalline orientations in specific two or less number of crystal axes,
wherein a (100) crystal orientation degree O 100 of the polyethylene expressed in the following Formula 2 is 0.26 or less, and

O
100

=

I
200

I
110

+

I
200

[

Formula
⁢

⁢
2

]

wherein I 200 in the Formula 2 is X-ray diffraction intensity of the index 200, and I 110 is X-ray diffraction intensity of the index 110.

6. The resin with the plating layer according to claim 5 ,
wherein a contact angle on the outer peripheral surface of the resin is 95° or less.

7. The resin with the plating layer according to claim 5 ,
wherein an absolute value of adhesion-wetting surface free energy on the outer peripheral surface of the resin is 66 mJ/m 2 or greater.

8. The resin with the plating layer according to claim 5 ,
wherein the outer peripheral surface of the resin comprises a concavity, and
wherein the concavity comprises, at its bottom in a depth direction, a space that is wider than an opening of the concavity.

9. A resin with a plating layer comprising:
a resin; and
a plating layer configured to cover the resin;
wherein when the resin is made of polyethylene, the polyethylene has a crystalline size of 18 nm or greater in a crystalline component, and
wherein when the resin is made of perfluoroethylene-propene copolymer, the perfluoroethylene-propene copolymer has a crystalline size of 13.6 nm or less in a crystalline component.

10. The resin with the plating layer according to claim 9 ,
wherein a contact angle on the outer peripheral surface of the resin is 95° or less.

11. The resin with the plating layer according to claim 9 ,
wherein an absolute value of adhesion-wetting surface free energy on the outer peripheral surface of the resin is 66 mJ/m 2 or greater.

12. The resin with the plating layer according to claim 9 ,
wherein the outer peripheral surface of the resin comprises a concavity, and
wherein the concavity comprises, at its bottom in a depth direction, a space that is wider than an opening of the concavity.

13. A method of manufacturing a resin with a plating layer comprising a resin and a plating layer configured to cover the resin, the method comprising:
conducting dry-ice-blasting on an outer peripheral surface of the resin, followed by
conducting a surface modification treatment on the outer peripheral surface, and
forming the plating layer on the outer peripheral surface.

14. The method of manufacturing the resin with the plating layer according to claim 13 ,
wherein an arithmetic average roughness Ra of the outer peripheral surface of the resin is between 0.6 μm and 10 μm inclusive after the dry-ice-blasting is conducted.

15. The method of manufacturing the resin with the plating layer according to claim 13 ,
wherein the surface modification treatment is a corona discharge exposure process.

16. The method of manufacturing the resin with the plating layer according to claim 13 ,
wherein the surface modification treatment comprises one or more of an electron beam irradiation, an ion irradiation, a corona discharge exposure, a plasma exposure, a ultraviolet irradiation, an X-ray irradiation, a γ-ray irradiation, and an immersion in ozone-containing liquid.

Assignees

• Hitachi Metals Ltd

Inventors

• Suenaga Kazufumi
• Endo Yuju
• Sagawa Hideyuki
• Sugiyama Takahiro
• Ishikawa Hiroshi

Classifications

• H01P11/005 Primary

  Manufacturing coaxial lines · CPC title

• H01B13/06

  Insulating conductors or cables (H01B13/32 takes precedence) · CPC title

• H01B11/20

  Cables having a multiplicity of coaxial lines · CPC title

• H01B3/44

  vinyl resins; acrylic resins (silicones H01B3/46) · CPC title

• H01B7/02 Primary

  Disposition of insulation · CPC title