Organic light-emitting display device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10930884-B2
Application number	US-201916262204-A
Country	US
Kind code	B2
Filing date	Jan 30, 2019
Priority date	Feb 8, 2018
Publication date	Feb 23, 2021
Grant date	Feb 23, 2021

Abstract

An organic light-emitting display device includes a substrate and a display area over the substrate. The display area includes a plurality of organic light-emitting diodes each including a first electrode, an emission layer, and a second electrode. A first power supply line is located outside the display area and is configured to supply power to the plurality of organic light-emitting diodes. A protective portion is disposed on an end of the first power supply line facing away from the display area. An encapsulation unit includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The encapsulation unit is positioned in the display area. A dam unit is arranged between the first inorganic encapsulation layer and the second inorganic encapsulation layer. The dam unit is disposed on an end of the organic encapsulation layer facing away from the display area.

First claim

What is claimed is:

1. An organic light-emitting display device comprising:
a substrate;
a display area over the substrate and comprising a plurality of organic light-emitting diodes each comprising a first electrode, an emission layer, and a second electrode;
a first power supply line located outside the display area and configured to supply power to the plurality of organic light-emitting diodes;
a protective portion disposed on an end of the first power supply line facing away from the display area;
an encapsulation unit comprising a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, wherein the encapsulation unit is positioned in the display area; and
a dam unit arranged between the first inorganic encapsulation layer and the second inorganic encapsulation layer in a thickness direction of the substrate, wherein the dam unit is disposed on an end of the organic encapsulation layer facing away from the display area.

2. The device of claim 1 , wherein surface energy of a material included in the dam unit is greater than surface energy of a material included in the organic encapsulation layer.

3. The device of claim 2 , wherein the dam unit comprises silicon.

4. The device of claim 1 , wherein a thickness of the dam unit is less than a thickness of the organic encapsulation layer.

5. The device of claim 1 , wherein the dam unit is located closer to the display area than the first power supply line.

6. The device of claim 1 , further comprising a connection conductive layer located outside the display area and configured to connect the second electrode to the first power supply line.

7. The device of claim 6 , wherein the connection conductive layer comprises a material that is the same as a material included in the first electrode.

8. The device of claim 6 , wherein a first end of the connection conductive layer overlaps the second electrode, and a second end of the connection conductive layer overlaps the first power supply line.

9. The device of claim 6 , wherein the connection conductive layer, the first inorganic encapsulation layer, and the second inorganic encapsulation layer are sequentially stacked over the first power supply line.

10. An organic light-emitting display device comprising:
a substrate;
a display area over the substrate and comprising a plurality of organic light-emitting diodes each comprising a first electrode, an emission layer, and a second electrode;
a first power supply line located outside the display area and configured to supply power to the plurality of organic light-emitting diodes;
a protective portion disposed on an end of the first power supply line facing away from the display area;
an encapsulation unit comprising a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, wherein the encapsulation unit is positioned in the display area;
a dam unit arranged between the first inorganic encapsulation layer and the second inorganic encapsulation layer, wherein the dam unit is disposed on an end of the organic encapsulation layer facing away from the display area;
a thin film transistor arranged over the substrate and electrically connected to a corresponding first electrode of each of the organic light-emitting diodes; and
an organic insulating layer arranged between the thin film transistor and the corresponding first electrode of each of the organic light-emitting diodes, the dam unit being arranged over the organic insulating layer.

11. The device of claim 10 , wherein the first power supply line is arranged between the organic insulating layer and the protective portion.

12. The device of claim 10 , wherein the protective portion comprises a material that is the same as a material included in the organic insulating layer.

Assignees

• Samsung Display Co Ltd

Inventors

• Lee Seungmin
• Kim Taehyun
• Shim Donghwan
• Lee Jungkyu

Classifications

• H10K59/8722

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K59/131

  Interconnections, e.g. wiring lines or terminals · CPC title

• H10K50/844

  Encapsulations · CPC title

• H10K59/8723 Primary

  Vertical spacers, e.g. arranged between the sealing arrangement and the OLED · CPC title

• H10K71/166

  using selective deposition, e.g. using a mask · CPC title