Electronic device comprising a discrete transistor assembled on a printed circuit board

Patent metadata

Field	Value
Publication number	US-10930606-B2
Application number	US-201916449405-A
Country	US
Kind code	B2
Filing date	Jun 23, 2019
Priority date	Jun 25, 2018
Publication date	Feb 23, 2021
Grant date	Feb 23, 2021

Abstract

An electronic device including: a discrete transistor including a semiconductor chip encapsulated in a package made of an insulating material leaving access to a first pad of connection to a first conduction terminal of the transistor; and a printed circuit board (320) including first (125) and second (129) separate connection pads, wherein the transistor is assembled on the printed circuit board so that the first connection pad (105) of the transistor is in contact with the first (125) and second (129) connection pads of the printed circuit board.

First claim

What is claimed is:

1. An electronic device comprising:
a discrete transistor comprising a semiconductor chip encapsulated in a package made of an insulating material leaving access to a first pad of connection to a first conduction terminal of the transistor, a second pad of connection to a second conduction terminal of the transistor, and a third pad of connection to a control terminal of the transistor; and
a printed circuit board comprising first, second, third, and fourth separate connection pads,
wherein the transistor is assembled on the printed circuit board so that the first pad of connection of the transistor is in contact with the first and second connection pads of the printed circuit board and that the second and third pads of connection of the transistor are respectively in contact with the third and fourth connection pads of the printed circuit board;
the device further comprises, assembled on the printed circuit board, a circuit of control of the transistor, connected to the control terminal of the transistor via the fourth connection pad of the printed circuit board and to the first conduction terminal of the transistor via the second connection pad of the printed circuit board; and
the first connection pad of the printed circuit board is connected to a power terminal of the electronic device.

2. The device of claim 1 , wherein the circuit of control is configured to alternately switch the transistor to the off state and to the on state at a frequency greater than 10 kHz.

3. The device of claim 1 , wherein, in top view, a distance between the second connection pad of the printed circuit board and the fourth connection pad of the printed circuit board is shorter than one tenth of a largest dimensions of the transistor.

4. The device of claim 1 , wherein:
the printed circuit board further comprises a fifth connection pad separate from the first and second connection pads of the printed circuit board; and
the transistor is assembled on the printed circuit board so that the first pad of connection of the transistor is in contact with the first, second, and fifth connection pads of the printed circuit board.

5. The device of claim 1 , wherein the first, second, third, and fourth connection pads are made of metal.

6. The device of claim 1 , wherein the first, second, third, and fourth connection pads are made of copper.

7. The device of claim 1 , wherein the transistor is a MOS transistor, the first conduction terminal being a source terminal of the transistor.

8. The device of claim 1 , wherein the transistor is a MOS transistor, the first conduction terminal being a source terminal of the transistor, and wherein the second conduction terminal and the control terminal are respectively a drain terminal and a gate terminal of the transistor.

9. The device of claim 1 , wherein the transistor is a gallium nitride transistor, a silicon carbide MOS transistor, or a silicon superjunction MOS transistor.

Assignees

• Commissariat Energie Atomique
• Renault Sas

Inventors

• Maynard Xavier
• Boudet Thierry
• Carcouet Sébastien
• Loudot Serge

Classifications

• H10W90/794

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W70/66

  Conductive materials thereof · CPC title

• H10W90/701 Primary

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title